Qualcomm Snapdragon X Elite

Qualcomm Snapdragon X Elite

About processor

Snapdragon X Elite is a new high-performance ARM processor from Qualcomm, designed specifically for laptops. Here are the key features and specifications of this chip: Architecture and Performance - 12-core processor manufactured using 4nm process technology - Clock speed up to 3.8 GHz on all cores, with the ability to automatically overclock to 4.2 GHz on one or two cores - Total L2 and L3 cache is 42 MB - Supports LPDDR5X-8448 memory and PCIe 4.0 drives Graphic arts - Built-in Adreno GPU - Performance up to 4.6 teraflops - Supports 4K displays with 120Hz refresh rate and HDR10 Artificial intelligence - Hexagon neural coprocessor for machine learning tasks - Performance up to 45 TOPS Performance The Geekbench 6 and Snapdragon X Elite showed impressive results, outperforming many other processors. Application Snapdragon X Elite is planned to be used in various laptops, from high-performance models to thin and light devices. For example, Samsung released the Galaxy Book 4 Edge laptop based on this processor. Overall, the Snapdragon X Elite is a powerful and energy-efficient solution for laptops, especially in tasks related to artificial intelligence and everyday work.

Basic

Label Name
Qualcomm
Platform
Laptop
Launch Date
October 2023
Model Name
?
The Intel processor number is just one of several factors - along with processor brand, system configurations, and system-level benchmarks - to be considered when choosing the right processor for your computing needs.
X1E-84-100
Code Name
Oryon
Foundry
Samsung TSMC
Generation
Oryon

CPU Specifications

Total Cores
?
Cores is a hardware term that describes the number of independent central processing units in a single computing component (die or chip).
12
Total Threads
?
Where applicable, Intel® Hyper-Threading Technology is only available on Performance-cores.
12
Performance-cores
12
Performance-core Base Frequency
3.8 GHz
Performance-core Max Turbo Frequency
?
Maximum P-core turbo frequency derived from Intel® Turbo Boost Technology.
4.2 GHz
L3 Cache
42MB
Unlocked Multiplier
No
Bus Frequency
100MHz
Technology
?
Lithography refers to the semiconductor technology used to manufacture an integrated circuit, and is reported in nanometer (nm), indicative of the size of features built on the semiconductor.
4 nm
TDP
23-65 W
PCIe Version
?
PCI Express is a high-speed serial computer expansion bus standard used for connecting high-speed components, replacing older standards such as AGP, PCI, and PCI-X. It has gone through multiple revisions and improvements since its initial release. PCIe 1.0 was first introduced in 2002, and in order to meet the growing demand for higher bandwidth, subsequent versions have been released over time.
4.0
PCI Express Version
?
PCI Express Revision is the supported version of the PCI Express standard. Peripheral Component Interconnect Express (or PCIe) is a high-speed serial computer expansion bus standard for attaching hardware devices to a computer. The different PCI Express versions support different data rates.
4.0
Instruction Set
?
The instruction set is a hard program stored inside the CPU that guides and optimizes CPU operations. With these instruction sets, the CPU can run more efficiently. There are many manufacturers that design CPUs, which results in different instruction sets, such as the 8086 instruction set for the Intel camp and the RISC instruction set for the ARM camp. x86, ARM v8, and MIPS are all codes for instruction sets. Instruction sets can be extended; for example, x86 added 64-bit support to create x86-64. Manufacturers developing CPUs that are compatible with a certain instruction set need authorization from the instruction set patent holder. A typical example is Intel authorizing AMD, enabling the latter to develop CPUs compatible with the x86 instruction set.
Arm-64

Memory Specifications

Memory Type
?
Intel® processors come in four different types: Single Channel, Dual Channel, Triple Channel, and Flex Mode. Maximum supported memory speed may be lower when populating multiple DIMMs per channel on products that support multiple memory channels.
LPDDR5x-8448
Max Memory Size
?
Max memory size refers to the maximum memory capacity supported by the processor.
64GB
Memory Channels
?
The number of memory channels refers to the bandwidth operation for real world application.
8
Max Memory Bandwidth
?
Max Memory bandwidth is the maximum rate at which data can be read from or stored into a semiconductor memory by the processor (in GB/s).
135 GB/s
ECC Memory Support
No

GPU Specifications

GPU Name
Qualcomm Adreno
Integrated Graphics Model
?
An integrated GPU refers to the graphics core that is integrated into the CPU processor. Leveraging the processor's powerful computational capabilities and intelligent power efficiency management, it delivers outstanding graphics performance and a smooth application experience at a lower power consumption.
True
Graphics Performance
4.6 TFLOPS

Benchmarks

Cinebench R23
Single Core Score
1772
Cinebench R23
Multi Core Score
14525
Geekbench 6
Single Core Score
2694
Geekbench 6
Multi Core Score
13969
Geekbench 5
Single Core Score
1871
Geekbench 5
Multi Core Score
12913
Passmark CPU
Single Core Score
3895
Passmark CPU
Multi Core Score
23272
Cinebench 2024
Single Core Score
135
Cinebench 2024
Multi Core Score
1203

Compared to Other CPU

Cinebench R23 Single Core
2424 +36.8%
1823 +2.9%
1275 -28%
1008 -43.1%
Cinebench R23 Multi Core
45651 +214.3%
17839 +22.8%
10027 -31%
3567 -75.4%
Geekbench 6 Single Core
3978 +47.7%
2438 -9.5%
2305 -14.4%
Geekbench 6 Multi Core
18372 +31.5%
15631 +11.9%
12636 -9.5%
11558 -17.3%
Geekbench 5 Single Core
2536 +35.5%
2010 +7.4%
1768 -5.5%
1690 -9.7%
Geekbench 5 Multi Core
15883 +23%
14346 +11.1%
11828 -8.4%
10786 -16.5%
Passmark CPU Single Core
4151 +6.6%
4037 +3.6%
3804 -2.3%
3701 -5%
Passmark CPU Multi Core
25797 +10.8%
24656 +5.9%
22609 -2.8%
21615 -7.1%
Cinebench 2024 Single Core
148 +9.6%
123 -8.9%
116 -14.1%
Cinebench 2024 Multi Core
2167 +80.1%
1691 +40.6%
1071 -11%
862 -28.3%