Xiaomi Xring O3: 10 cores, LPDDR6, and 15,000 points in Geekbench

Fifteen months after the Xring O1, Xiaomi has introduced a new flagship SoC of its own design. The Xring O3 features a 10-core CPU, new graphics, LPDDR6, and a more powerful NPU. In Geekbench, the prototype scores over 15,000 points in Multi-Core. However, there are currently no production devices with the Xring O3, so these results should be considered preliminary.

10 cores without a classic energy-efficient cluster

The processor cores are divided into three groups: 2 + 4 + 4. Two C1-Ultra cores operate at speeds of up to 4.35 GHz, four C1-Premium cores up to 3.68 GHz, and another four C1-Pro cores up to 3.15 GHz.

There is no separate cluster for small cores here. This configuration helps the Xring O3 achieve a high score in Multi-Core.

The behavior of this configuration in everyday use can only be assessed once production devices are released. For the Xring O3, heat management and frequency drop under sustained load are particularly important.

The chip is manufactured by TSMC using a 3nm process. The die area is approximately 133 mm², with the number of transistors increasing to around 24 billion.

Preliminary performance of Xring O3 compared to flagships

Xiaomi claims 3945 points in Geekbench 6.5 for Single-Core and 15,221 points for Multi-Core.

In a third-party test, the prototype scored 3854 points in Single-Core and 15,086 in Multi-Core.

The Xring O3 appears strongest in Multi-Core, where the prototype outperforms devices featuring the A19 Pro and Snapdragon 8 Elite Gen 5.

Calculating the exact percentage difference is not advisable here. The Xring O3 was tested on a prototype using Geekbench 6.5, while some results for production devices were obtained with Geekbench 6.7.

The comparison in AnTuTu is even more complex. The score of 5,228,014 points relates to AnTuTu V11, not AnTuTu 10. Additionally, the testing for Xiaomi was conducted in special low-temperature laboratory conditions.

Thus, 5.2 million points cannot be directly compared with AnTuTu 10 results nor extrapolated to the production Xiaomi 18 Fold.

New graphics G2-Ultra NX

The Xring O3 features a 16-core Arm Mali-G2 Ultra NX MC16. According to Xiaomi, the GPU is approximately 85% faster than the Xring O1 while consuming less power.

The GPU also includes eight NX blocks for machine learning and graphics computations.

In an official test, the Xring O3 scored around 4567 points in Steel Nomad Light. In comparison, the Xiaomi 15S Pro with the Xring O1 shows around 2456 points.

LPDDR6 and new NPU

The Xring O3 supports LPDDR6 with speeds of up to 10,667 Mbps. The bandwidth reaches 113.8 GB/s.

LPDDR6 is especially beneficial for graphics and local AI models.

The four-core NPU is claimed to support up to 200 TOPS. AI acceleration is utilized not only in the NPU but also in the GPU, image processing, and output rendering.

Currently, 200 TOPS remains just a projected peak figure. The speed of local AI models can be assessed once production devices are released.

Which devices will receive the Xring O3

At the time of the announcement, two models have been confirmed:

The first launch of both models is expected in China. Prices have not yet been announced, making it difficult to assess the Xring O3 in terms of cost-performance ratio.

Comparing several production devices based on the Xring O3 is likewise impossible for now.

From Xring O1 to O3

The first flagship SoC from Xiaomi was the Xring O1, introduced in 2025. It was used in the Xiaomi 15S Pro and the company’s tablets.

The next production flagship from Xiaomi received the O3 index.

The name O3 came as a surprise, as Xiaomi had previously denied reports that it would skip the O2 designation after the O1.

Conclusion

Compared to the Xring O1, the new chip has received a significantly more powerful CPU, new graphics, and a more robust AI block. The Xring O3’s main strength is already apparent in Multi-Core, and the new graphics and LPDDR6 should notably enhance performance compared to the O1.

With peak results already evident, it is now more crucial to find out how much performance will decline under heat and prolonged load in the Xiaomi 18 Fold and Pad 9 Pro Max.

If the production devices are close to the current results and do not experience severe throttling, the Xring O3 could compete with the current flagships from Apple, Qualcomm, and MediaTek in its second generation.