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MediaTek Dimensity 9600 Pro

vs

Xiaomi Xring O3

SoC Comparison Result

Below are the results of a comparison of MediaTek Dimensity 9600 Pro and Xiaomi Xring O3 mobile processors based on key performance characteristics, as well as power consumption and much more.

Advantages

MediaTek Dimensity 9600 Pro

Higher Technology: 2 nm (2 nm vs 3 nm)
Newer Launch Date: September 2026 (September 2026 vs August 2026)

Xiaomi Xring O3

Higher Frequency: 4350 MHz (4.55 GHz vs 4350 MHz)

Basic

MediaTek

Label Name

Xiaomi

September 2026

Launch Date

August 2026

SmartPhone Flagship

Platform

SmartPhone Flagship

10 MB

System Level Cache (SLC)

16 MB

TSMC

Manufacturing

TSMC

MT6995

Model Name

Xiaomi XRING O3

2x 4.55 GHz Arm C2-Ultra + 3x 4.35 GHz Arm C2-Pro + 3x 3.10 GHz Arm C2-Pro

Architecture

2x 4.35 GHz C1-Ultra + 4x 3.68 GHz C1-Premium + 4x 3.15 GHz C1-Pro

Cores

2 nm

Technology

3 nm

4.55 GHz

Frequency

4350 MHz

Transistor count

24 billion

GPU Specifications

Arm Mali-G2 Ultra NX

GPU name

G2-Ultra NX (16-core)

WQHD+

Max display resolution

Connectivity

5G/4G Triple SIM Triple Active, Dual Data, SA and NSA, SA Option 2, NSA Option 3/3a/3x, NR FR1 TDD+FDD, DSS, 256QAM, VoNR, EPS fallback

Cellular specific functions

3GPP Release 17, Sub-6GHz (FR1), 2G-5G multi-mode, 5G-CA, 4G-CA, 5G FDD/TDD, 4G FDD/TDD, TD-SCDMA, WCDMA, EDGE, GSM

Cellular technologies

Sub-6 DL 5CC 350 MHz, Release 17 Enhancement, low-band DL 4x4 MIMO

Downlink functions

>7.4 Gbps

Download speed

MediaTek 5G UltraSave 2.0, Release 17 Power Saving Enhancement

Modem power saving technologies

Sub-6 UL 2CC 200 MHz, Release 17 Enhancement, FDD UL 2x2 MIMO, PC2

Uplink functions

Yes

4G support

Yes, 5G-Advanced

5G support

Bluetooth 6.2, dual Bluetooth engine, up to 12 Mbps

Bluetooth

Wi-Fi 7 (802.11a/b/g/n/ac/ax/be), Triple Band Triple Concurrency, up to 7.3 Gbps

Wi-Fi

GPS, BeiDou, GLONASS, Galileo, QZSS, NavIC

Navigation

Memory Specifications

LPDDR6 / LPDDR5X

Memory type

LPDDR6

10667 MT/s

Memory frequency

10667 Mbps

Memory Bus

4 x 24-bit (96-bit)

Miscellaneous

8.5 MB (2x 2 MB + 3x 1 MB + 3x 512 KB)

L2 Cache

12 MB

16 MB

L3 cache

16 MB

200 MP

Max camera resolution

432 MP single camera; 64 MP + 64 MP + 50 MP triple camera

UFS 5.0

Storage type

8K at 60 FPS; 4K at 120 FPS with EIS; 4K at 240 FPS slow-motion; 4K at 60 FPS HDR

Video capture

4K at 60 FPS with AI RAW-domain noise reduction

VVC (H.266), HEVC (H.265), AVC (H.264), VP9, AV1, MV-HEVC

Video codecs

H.266 (VVC) hardware decoding

8K at 60 FPS, 10-bit

Video playback

180 Hz

Display refresh rate

Armv9.3-A

Instruction set

ARMv9.3-A

Native AI Architecture, Dimensity Agentic AI Engine, AI Compute Fusion, Neural Graphics Architecture, AI Imaging Fusion Architecture, on-device MoE inference, edge-training LLM, KV-cache compression

AI features

SME2 CPU acceleration, 8 NX GPU neural accelerators, AI super resolution, AI frame generation, ISP AINR, DPU AI super resolution, ADSP AI engine

MediaTek NPU 1090 + Super Efficient NPU 2.0

Neural processor (NPU)

4-core NPU, 200 TOPS tensor, 3.13 TFLOPS vector