Qualcomm Snapdragon X Elite X1E-80-100
About processor
The Qualcomm Snapdragon X Elite X1E-80-100 processor is a powerhouse designed for high-performance laptops. With a code name of "Oryon" and built on a 4 nm technology, this processor boasts 12 cores and 12 threads, making it ideal for multitasking and demanding workloads.
The performance-core base frequency of 3.4 GHz and max turbo frequency of 4.0 GHz ensures swift and responsive computing, while the 42MB L3 cache further enhances its speed and efficiency. The integrated graphics model delivers excellent visuals, making it suitable for gaming, content creation, and other graphics-intensive tasks.
With a TDP ranging from 23-65 W, the X1E-80-100 strikes a balance between power consumption and performance, making it suitable for a wide range of laptops. The processor's impressive benchmark scores of 2826 for Geekbench 6 Single Core and 14336 for Geekbench 6 Multi Core further testify to its top-notch performance.
Overall, the Qualcomm Snapdragon X Elite X1E-80-100 processor is a stellar choice for users seeking a high-performance laptop processor that can handle demanding workloads with ease. Its combination of power, efficiency, and graphics capabilities make it a standout option in the market.
Basic
Label Name
Qualcomm
Platform
Laptop
Launch Date
October 2023
Model Name
?
The Intel processor number is just one of several factors - along with processor brand, system configurations, and system-level benchmarks - to be considered when choosing the right processor for your computing needs.
X1E-80-100
Code Name
Oryon
Foundry
Samsung TSMC
Generation
Oryon
CPU Specifications
Total Cores
?
Cores is a hardware term that describes the number of independent central processing units in a single computing component (die or chip).
12
Total Threads
?
Where applicable, Intel® Hyper-Threading Technology is only available on Performance-cores.
12
Performance-cores
12
Performance-core Base Frequency
3.4 GHz
Performance-core Max Turbo Frequency
?
Maximum P-core turbo frequency derived from Intel® Turbo Boost Technology.
4.0 GHz
L3 Cache
42MB
Bus Frequency
100MHz
Unlocked Multiplier
No
Technology
?
Lithography refers to the semiconductor technology used to manufacture an integrated circuit, and is reported in nanometer (nm), indicative of the size of features built on the semiconductor.
4 nm
TDP
23-65 W
PCIe Version
?
PCI Express is a high-speed serial computer expansion bus standard used for connecting high-speed components, replacing older standards such as AGP, PCI, and PCI-X. It has gone through multiple revisions and improvements since its initial release. PCIe 1.0 was first introduced in 2002, and in order to meet the growing demand for higher bandwidth, subsequent versions have been released over time.
4.0
PCI Express Version
?
PCI Express Revision is the supported version of the PCI Express standard. Peripheral Component Interconnect Express (or PCIe) is a high-speed serial computer expansion bus standard for attaching hardware devices to a computer. The different PCI Express versions support different data rates.
4.0
Instruction Set
?
The instruction set is a hard program stored inside the CPU that guides and optimizes CPU operations. With these instruction sets, the CPU can run more efficiently. There are many manufacturers that design CPUs, which results in different instruction sets, such as the 8086 instruction set for the Intel camp and the RISC instruction set for the ARM camp. x86, ARM v8, and MIPS are all codes for instruction sets. Instruction sets can be extended; for example, x86 added 64-bit support to create x86-64. Manufacturers developing CPUs that are compatible with a certain instruction set need authorization from the instruction set patent holder. A typical example is Intel authorizing AMD, enabling the latter to develop CPUs compatible with the x86 instruction set.
Arm-64
Memory Specifications
Memory Type
?
Intel® processors come in four different types: Single Channel, Dual Channel, Triple Channel, and Flex Mode. Maximum supported memory speed may be lower when populating multiple DIMMs per channel on products that support multiple memory channels.
LPDDR5x-8448
Max Memory Size
?
Max memory size refers to the maximum memory capacity supported by the processor.
64GB
Memory Channels
?
The number of memory channels refers to the bandwidth operation for real world application.
8
Max Memory Bandwidth
?
Max Memory bandwidth is the maximum rate at which data can be read from or stored into a semiconductor memory by the processor (in GB/s).
135 GB/s
ECC Memory Support
No
GPU Specifications
GPU Name
Qualcomm Adreno
Integrated Graphics Model
?
An integrated GPU refers to the graphics core that is integrated into the CPU processor. Leveraging the processor's powerful computational capabilities and intelligent power efficiency management, it delivers outstanding graphics performance and a smooth application experience at a lower power consumption.
True
Graphics Performance
3.8 TFLOPS
Benchmarks
Cinebench R23
Single Core
Score
1711
Cinebench R23
Multi Core
Score
13414
Geekbench 6
Single Core
Score
2676
Geekbench 6
Multi Core
Score
13847
Passmark CPU
Single Core
Score
3345
Passmark CPU
Multi Core
Score
22746
Compared to Other CPU
Cinebench R23 Single Core
Cinebench R23 Multi Core
Geekbench 6 Single Core
Geekbench 6 Multi Core
Passmark CPU Single Core
Passmark CPU Multi Core