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HiSilicon Kirin 9000S

HiSilicon Kirin 9000S

About processor

Kirin 9000S is a SmartPhone Flagship mobile processor manufactured by HiSilicon. It was released on August 2023. The SoC is manufactured using the 14 nm fabrication process. It has 12 cores. The main feachers of the SoC are: Frequency - 2620 MHz, TDP - 7 W. This chip also integrates the Maleoon 910.

Basic

Label Name
HiSilicon
Platform
SmartPhone Flagship
Launch Date
August 2023
Manufacturing
SMIC
Model Name
Kirin 9000S
Architecture
2x 2.62 GHz – Cortex-X1
4x 2.15 GHz – Cortex-A710
6x 1.53 GHz – Cortex-A510
Cores
12
Technology
14 nm
Frequency
2620 MHz

GPU Specifications

GPU name
Maleoon 910
GPU frequency
750 MHz
Max display resolution
3840 x 2160

Connectivity

4G support
LTE Cat. 24
5G support
Yes
Bluetooth
5.2
Wi-Fi
6
Navigation
GPS, GLONASS, Beidou, Galileo, QZSS, NAVIC

Memory Specifications

Memory type
LPDDR5
Memory frequency
2750 MHz
Memory Bus
4x 16 Bit

Miscellaneous

Neural processor (NPU)
Yes
Audio codecs
AAC, AIFF, CAF, MP3, MP4, WAV
Storage type
UFS 4.0
Video capture
4K at 60FPS
Video codecs
H.264, H.265, VP9
Video playback
4K at 60FPS
TDP
7 W

Benchmarks

Geekbench 6
Single Core Score
1222
Geekbench 6
Multi Core Score
3622
AnTuTu 10
Score
923510

Compared to Other SoC

Geekbench 6 Single Core
M5 iPad
4259 +248.5%
Dimensity 9000
1599 +30.9%
Kirin 9000S
1222
Snapdragon 765G
801 -34.5%
Helio G70
418 -65.8%
Geekbench 6 Multi Core
M5 iPad
15265 +321.5%
Tensor G3
4477 +23.6%
Kirin 9000S
3622
Helio G100
2069 -42.9%
Helio G88
1357 -62.5%
AnTuTu 10
Snapdragon 8 Elite Gen 5
4177588 +352.4%
Dimensity 9200 Plus
1579845 +71.1%
Kirin 9000S
923510
Dimensity 1300
684541 -25.9%
Exynos 1280
490914 -46.8%