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MediaTek Dimensity 8500

MediaTek Dimensity 8500

About processor

Dimensity 8500 is a SmartPhone Mid range mobile processor manufactured by MediaTek. It was released on January 2026. The SoC is manufactured using the 4 nm fabrication process. It has 8 cores. The main feachers of the SoC are: Frequency - 3400 MHz. This chip also integrates the Mali-G720 MP8.

Basic

Label Name
MediaTek
Platform
SmartPhone Mid range
Launch Date
January 2026
Manufacturing
TSMC
Model Name
Dimensity 8500
Architecture
1x 3.4 GHz – Cortex-A725
3x 3.2 GHz – Cortex-A725
4x 2.2 GHz – Cortex-A725
Cores
8
Technology
4 nm
Frequency
3400 MHz

GPU Specifications

GPU name
Mali-G720 MP8
Shading units
128
OpenCL version
3.2
Vulkan version
1.3
Max display resolution
2960 x 1440
DirectX version
12

Connectivity

5G support
Yes
Bluetooth
6.0
Wi-Fi
7
Navigation
GPS, GLONASS, Beidou, Galileo, QZSS, NAVIC

Memory Specifications

Memory type
LPDDR5X
Memory frequency
4266 MHz
Memory Bus
4x 16 Bit

Miscellaneous

Neural processor (NPU)
MediaTek NPU 880
Audio codecs
- AAC LC
- FLAC
- HE-AACv1
- HE-AACv2
- MP3
Max camera resolution
1x 320MP, 3x 32MP
Storage type
UFS 4.0, UFS 4.1
Video capture
4K at 60FPS
Video codecs
- H.264
- H.265
- AV1
- VP9
Video playback
4K at 60FPS
Instruction set
ARMv9.2-A

Benchmarks

Geekbench 6
Single Core Score
1693
Geekbench 6
Multi Core Score
6897
AnTuTu 10
Score
2359462

Compared to Other SoC

Geekbench 6 Single Core
M5 iPad
4259 +151.6%
Dimensity 8500
1693
Snapdragon 855 Plus
1040 -38.6%
Dimensity 720
774 -54.3%
Snapdragon 835
415 -75.5%
Geekbench 6 Multi Core
M5 iPad
15265 +121.3%
Dimensity 8500
6897
Snapdragon 855 Plus
2865 -58.5%
Kirin 810
1992 -71.1%
Helio G85
1338 -80.6%
AnTuTu 10
Snapdragon 8 Elite Gen 5
4177588 +77.1%
Dimensity 8500
2359462
Snapdragon 7s Gen 4
857250 -63.7%
Kirin 8000
666377 -71.8%
Dimensity 7025
485165 -79.4%