Qualcomm Snapdragon X Plus X1P-64-100
About processor
The Qualcomm Snapdragon X Plus (X1P-64-100) processor is an impressive addition to the Snapdragon X lineup, specifically designed for use in laptops. Built on a 4nm technology, this processor boasts a total of 10 cores and 10 threads, making it a powerhouse in terms of multitasking capabilities.
The performance-core base frequency of 3.4 GHz ensures smooth and efficient operation even when handling demanding tasks. Additionally, the substantial 42MB of L3 cache contributes to faster data access and overall improved performance.
With a TDP of 23W, the Snapdragon X Plus strikes a good balance between power consumption and performance, making it an efficient choice for mobile computing.
The integrated graphics model delivers solid visuals, providing a seamless multimedia experience. The Geekbench 6 Single Core score of 2394 and Multi Core score of 12711 reflect the processor's impressive performance across various workloads.
Overall, the Qualcomm Snapdragon X Plus (X1P-64-100) processor is a top-notch choice for laptop users who require a high-performing, energy-efficient processor for their computing needs. Its combination of power, efficiency, and multitasking capabilities make it a formidable option in the market.
Basic
Label Name
Qualcomm
Platform
Laptop
Launch Date
April 2024
Model Name
?
The Intel processor number is just one of several factors - along with processor brand, system configurations, and system-level benchmarks - to be considered when choosing the right processor for your computing needs.
X1P-64-100
Code Name
Snapdragon X
CPU Specifications
Total Cores
?
Cores is a hardware term that describes the number of independent central processing units in a single computing component (die or chip).
10
Total Threads
?
Where applicable, Intel® Hyper-Threading Technology is only available on Performance-cores.
10
Performance-cores
10
Performance-core Base Frequency
3.4 GHz
L3 Cache
42 MB
Unlocked Multiplier
No
Multiplier
34x
CPU Socket
?
The socket is the component that provides the mechanical and electrical connections between the processor and motherboard.
Custom
Technology
?
Lithography refers to the semiconductor technology used to manufacture an integrated circuit, and is reported in nanometer (nm), indicative of the size of features built on the semiconductor.
4 nm
TDP
23 W
PCIe Version
?
PCI Express is a high-speed serial computer expansion bus standard used for connecting high-speed components, replacing older standards such as AGP, PCI, and PCI-X. It has gone through multiple revisions and improvements since its initial release. PCIe 1.0 was first introduced in 2002, and in order to meet the growing demand for higher bandwidth, subsequent versions have been released over time.
4.0
Instruction Set
?
The instruction set is a hard program stored inside the CPU that guides and optimizes CPU operations. With these instruction sets, the CPU can run more efficiently. There are many manufacturers that design CPUs, which results in different instruction sets, such as the 8086 instruction set for the Intel camp and the RISC instruction set for the ARM camp. x86, ARM v8, and MIPS are all codes for instruction sets. Instruction sets can be extended; for example, x86 added 64-bit support to create x86-64. Manufacturers developing CPUs that are compatible with a certain instruction set need authorization from the instruction set patent holder. A typical example is Intel authorizing AMD, enabling the latter to develop CPUs compatible with the x86 instruction set.
ARMv9
Memory Specifications
Memory Type
?
Intel® processors come in four different types: Single Channel, Dual Channel, Triple Channel, and Flex Mode. Maximum supported memory speed may be lower when populating multiple DIMMs per channel on products that support multiple memory channels.
LPDDR5X-8448
Max Memory Size
?
Max memory size refers to the maximum memory capacity supported by the processor.
64 GB
Memory Channels
?
The number of memory channels refers to the bandwidth operation for real world application.
8
Max Memory Bandwidth
?
Max Memory bandwidth is the maximum rate at which data can be read from or stored into a semiconductor memory by the processor (in GB/s).
135 GB/s
ECC Memory Support
No
GPU Specifications
Integrated Graphics Model
?
An integrated GPU refers to the graphics core that is integrated into the CPU processor. Leveraging the processor's powerful computational capabilities and intelligent power efficiency management, it delivers outstanding graphics performance and a smooth application experience at a lower power consumption.
true
GPU Base Frequency
500 MHz
GPU Max Dynamic Frequency
1200 MHz
Execution Units
?
The Execution Unit is the foundational building block of Intel’s graphics architecture. Execution Units are compute processors optimized for simultaneous Multi-Threading for high throughput compute power.
6
Graphics Performance
3.8 TFLOPS
Benchmarks
Cinebench R23
Single Core
Score
1518
Cinebench R23
Multi Core
Score
11704
Geekbench 6
Single Core
Score
2348
Geekbench 6
Multi Core
Score
12663
Passmark CPU
Single Core
Score
3144
Passmark CPU
Multi Core
Score
21266
Compared to Other CPU
Cinebench R23 Single Core
Cinebench R23 Multi Core
Geekbench 6 Single Core
Geekbench 6 Multi Core
Passmark CPU Single Core
Passmark CPU Multi Core