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MediaTek Helio G37

MediaTek Helio G37

About processor

Helio G37 is a SmartPhone Low end mobile processor manufactured by MediaTek. It was released on June 2020. The SoC is manufactured using the 12 nm fabrication process. It has 8 cores. The main feachers of the SoC are: Frequency - 2300 MHz, TDP - 2.2 W. This chip also integrates the PowerVR GE8320.

Basic

Label Name
MediaTek
Platform
SmartPhone Low end
Launch Date
June 2020
Manufacturing
TSMC
Model Name
MT6765H
Architecture
4x 2.3 GHz – Cortex-A53
4x 1.8 GHz – Cortex-A53
Cores
8
Technology
12 nm
Frequency
2300 MHz

GPU Specifications

GPU name
PowerVR GE8320
GPU frequency
680 MHz
FLOPS
0.0435 TFLOPS
Shading units
8
Execution units
4
OpenCL version
1.2
Vulkan version
1.1
Max display resolution
2400 x 1080
DirectX version
12

Connectivity

4G support
LTE Cat. 7
5G support
No
Bluetooth
5.0
Wi-Fi
5
Navigation
GPS, GLONASS, Beidou, Galileo, QZSS

Memory Specifications

Memory type
LPDDR4X
Memory frequency
1600 MHz
Memory Bus
2x 16 Bit

Miscellaneous

Neural processor (NPU)
No
Audio codecs
AIFF, CAF, MP3, MP4, WAV
Max camera resolution
1x 50MP, 2x 13MP
Storage type
eMMC 5.1
Video capture
1K at 30FPS
Video codecs
H.264, H.265
Video playback
1080p at 30FPS
TDP
2.2 W
Instruction set
ARMv8.2-A

Benchmarks

Geekbench 6
Single Core Score
206
Geekbench 6
Multi Core Score
915
AnTuTu 10
Score
156995

Compared to Other SoC

Geekbench 6 Single Core
Dimensity 1300
1252 +507.8%
Dimensity 1080
969 +370.4%
Snapdragon 730G
701 +240.3%
Snapdragon 660
345 +67.5%
Helio G37
206
Geekbench 6 Multi Core
Kirin 9000
3529 +285.7%
Dimensity 820
2494 +172.6%
Exynos 9810
1847 +101.9%
Helio X30
1115 +21.9%
Helio G37
915
AnTuTu 10
Dimensity 900
505728 +222.1%
Snapdragon 4 Gen 2
419580 +167.3%
Snapdragon 680
316260 +101.4%
Helio P60
228849 +45.8%
Helio G37
156995