MediaTek Dimensity 8300 ultra

MediaTek Dimensity 8300 ultra

MediaTek Dimensity 8300 Ultra: What This Chip Is

Dimensity 8300 Ultra is a branded variation of Dimensity 8300, created in collaboration with manufacturers (most often Xiaomi/POCO) via the Dimensity 5G Open Resource Architecture. The base silicon is the same, but partners get access to deep tuning of the camera, AI, and display pipelines, as well as fine-grained adjustment of clocks and power limits. In practice, Ultra is not a separate die—it's a device-specific, tuned version.


Key Platform Specifications

  • Process/CPU: TSMC 4 nm; 8-core Armv9 — 4× Cortex-A715 and 4× Cortex-A510. In Ultra configurations on some models there’s a peak up to 3.35 GHz on one A715 core (typical: 1×3.35 GHz + 3×3.2 GHz + 4×2.2 GHz).

  • GPU: Arm Mali-G615 MC6.

  • Memory & Storage: LPDDR5X up to 8533 MT/s; UFS 4.0 with Multi-Circular Queue (MCQ) to speed up random access and app installs.

  • AI/ML: APU/NPU 780 for on-device acceleration, including generative scenarios (local models, enhanced camera effects and scene understanding).

  • Camera & Video: Imagiq 980 ISP, sensors up to 320 MP; 4K60 HDR recording; advanced noise-reduction and HDR chains; hardware AV1 decode.

  • Displays: Up to 180 Hz for FHD+ or 120 Hz for WQHD+.

  • Connectivity: 5G with peak download up to 5.17 Gbps, Wi-Fi 6E, Bluetooth 5.4.

Ultra vs the Standard 8300 — The Idea

  • Same base SoC, but with expanded access via DORA to tune camera algorithms (AE/AF/AWB/NR/HDR), display chains (smoothing engines/PWM management/color), AI pipelines, and networking stacks.

  • OEMs can carefully raise clocks and/or power limits where the device’s thermal design allows. Final figures depend on the specific smartphone model.

Where Dimensity 8300 Ultra Is Used

  • POCO X6 Pro

  • Xiaomi 14T

  • Redmi K70E

What This Brings to Devices

  • Fast on-device AI: photo/video processing and offline features (including generative effects) run locally with low latency and without sending data to the cloud.

  • Strong camera in the upper-mid segment: 4K60 HDR, advanced noise reduction and HDR pipelines, plus fine OEM tuning for specific sensors.

  • Stable performance: modern LPDDR5X and UFS 4.0 help sustain FPS in games and speed up app launches.

  • Power efficiency: the 4 nm process and flexible power limits enable longer sustained peaks without throttling (within a device’s thermal budget).

Basic

Label Name
MediaTek
Platform
SmartPhone Flagship
Launch Date
November 2023
Manufacturing
TSMC
Model Name
Dimensity 8300 ultra
Architecture
1x 3.35 GHz – Cortex-A7153x 3.2 GHz – Cortex-A7154x 2.2 GHz – Cortex-A510
Cores
8
Technology
4 nm
Frequency
3350 MHz

GPU Specifications

GPU name
Mali-G615 MP6
GPU frequency
1400 MHz
OpenCL version
2.0
Vulkan version
1.3
Max display resolution
2960 x 1440

Connectivity

4G support
Yes
5G support
Yes
Bluetooth
5.4
Wi-Fi
6
Navigation
GPS, GLONASS, Beidou, Galileo, QZSS, NAVIC

Memory Specifications

Memory type
LPDDR5X
Memory frequency
4266 MHz
Memory Bus
4x 16 Bit
Max Bandwidth
68.2 Gbit/s

Miscellaneous

Neural processor (NPU)
MediaTek APU 780
Audio codecs
AAC LC, MP3, HE-AACv1, HE-AACv2, FLAC
Max camera resolution
1x 320MP
Storage type
UFS 4.0
Video capture
4K at 60FPS
Video codecs
H.264, H.265, AV1, VP9
Video playback
4K at 60FPS

Benchmarks

Geekbench 6
Single Core Score
1506
Geekbench 6
Multi Core Score
4844
AnTuTu 10
Score
1518170
AiTuTu 3
Score
197065

Compared to Other SoC

Geekbench 6 Single Core
3842 +155.1%
989 -34.3%
718 -52.3%
356 -76.4%
Geekbench 6 Multi Core
14383 +196.9%
2674 -44.8%
1850 -61.8%
1143 -76.4%
AnTuTu 10
3518353 +131.7%
813782 -46.4%
600030 -60.5%
456569 -69.9%
AiTuTu 3
215106 +9.2%
197065 +0%
158942 -19.3%
154291 -21.7%