Intel Core i7-13700TE

Intel Core i7-13700TE

About processor

The Intel Core i7-13700TE is a powerful embedded processor designed for high-performance computing in a variety of applications. With its Raptor Lake architecture and Intel 7 technology, this processor offers impressive performance and efficiency for embedded systems. With a total of 24 threads and a TDP of 35W, the Core i7-13700TE is capable of handling demanding workloads while consuming minimal power. This makes it an ideal choice for industrial automation, digital signage, and other embedded applications where power efficiency is crucial. The integrated Intel UHD Graphics 770 provides excellent visual processing capabilities, further enhancing the overall performance of the processor. Whether handling complex graphics or running multiple displays, this processor delivers smooth and reliable performance. In benchmark tests, the Core i7-13700TE excels with a Geekbench 6 Single Core score of 2135 and a Multi Core score of 12508, showcasing its ability to handle both single-threaded and multi-threaded workloads with ease. Overall, the Intel Core i7-13700TE is a top-tier embedded processor that delivers exceptional performance, power efficiency, and graphics capabilities, making it a standout choice for a wide range of embedded applications.


Label Name
Launch Date
January 2023
Model Name
The Intel processor number is just one of several factors - along with processor brand, system configurations, and system-level benchmarks - to be considered when choosing the right processor for your computing needs.
Code Name
Raptor Lake

CPU Specifications

Total Cores
Cores is a hardware term that describes the number of independent central processing units in a single computing component (die or chip).
Total Threads
Where applicable, Intel® Hyper-Threading Technology is only available on Performance-cores.
Basic Frequency
1.10 GHz
Max Turbo Frequency
Max Turbo Frequency is the maximum single-core frequency at which the processor is capable of operating using Intel® Turbo Boost Technology and, if present, Intel® Turbo Boost Max Technology 3.0 and Intel® Thermal Velocity Boost. Frequency is typically measured in gigahertz (GHz), or billion cycles per second.
4.80 GHz
L3 Cache
30 MB
CPU Socket
The socket is the component that provides the mechanical and electrical connections between the processor and motherboard.
Lithography refers to the semiconductor technology used to manufacture an integrated circuit, and is reported in nanometer (nm), indicative of the size of features built on the semiconductor.
Intel 7
35 W
Processor Base Power
The time-averaged power dissipation that the processor is validated to not exceed during manufacturing while executing an Intel-specified high complexity workload at Base Frequency and at the junction temperature as specified in the Datasheet for the SKU segment and configuration.
35 W
Max. Operating Temperature
Junction Temperature is the maximum temperature allowed at the processor die.
PCI Express Version
PCI Express Revision is the supported version of the PCI Express standard. Peripheral Component Interconnect Express (or PCIe) is a high-speed serial computer expansion bus standard for attaching hardware devices to a computer. The different PCI Express versions support different data rates.
5.0 and 4.0
Instruction Set
The instruction set is a hard program stored inside the CPU that guides and optimizes CPU operations. With these instruction sets, the CPU can run more efficiently. There are many manufacturers that design CPUs, which results in different instruction sets, such as the 8086 instruction set for the Intel camp and the RISC instruction set for the ARM camp. x86, ARM v8, and MIPS are all codes for instruction sets. Instruction sets can be extended; for example, x86 added 64-bit support to create x86-64. Manufacturers developing CPUs that are compatible with a certain instruction set need authorization from the instruction set patent holder. A typical example is Intel authorizing AMD, enabling the latter to develop CPUs compatible with the x86 instruction set.

Memory Specifications

Memory Type
Intel® processors come in four different types: Single Channel, Dual Channel, Triple Channel, and Flex Mode. Maximum supported memory speed may be lower when populating multiple DIMMs per channel on products that support multiple memory channels.
Up to DDR5 5600 MT/s Up to DDR4 3200 MT/s
Max Memory Size
Max memory size refers to the maximum memory capacity supported by the processor.
128 GB
Memory Channels
The number of memory channels refers to the bandwidth operation for real world application.
Max Memory Bandwidth
Max Memory bandwidth is the maximum rate at which data can be read from or stored into a semiconductor memory by the processor (in GB/s).
89.6 GB/s

GPU Specifications

Integrated Graphics Model
An integrated GPU refers to the graphics core that is integrated into the CPU processor. Leveraging the processor's powerful computational capabilities and intelligent power efficiency management, it delivers outstanding graphics performance and a smooth application experience at a lower power consumption.
Intel® UHD Graphics 770
Graphics Frequency
Graphics max dynamic frequency refers to the maximum opportunistic graphics render clock frequency (in MHz) that can be supported using Intel® HD Graphics with Dynamic Frequency feature.
1.60 GHz


Intel Active Management Technology (AMT)
Intel Hardware Shield Eligibility


Geekbench 6
Single Core Score
Geekbench 6
Multi Core Score
Geekbench 5
Single Core Score
Geekbench 5
Multi Core Score
Passmark CPU
Single Core Score
Passmark CPU
Multi Core Score

Compared to Other CPU

Geekbench 6 Single Core
2137 +0.1%
Geekbench 6 Multi Core
12471 -0.3%
12468 -0.3%
Geekbench 5 Single Core
Geekbench 5 Multi Core
11744 +0.4%
11721 +0.2%
11531 -1.4%
Passmark CPU Single Core
3228 +0%
3226 -0.1%
Passmark CPU Multi Core
23088 +0.1%
23042 -0.1%
23042 -0.1%