AMD EPYC 7313P
About processor
The AMD EPYC 7313P processor is a powerful and efficient CPU designed for server use. With a total of 16 cores and 32 threads, this processor offers excellent multitasking capabilities, making it ideal for demanding server workloads. The large 128MB L3 cache ensures quick access to frequently used data, further improving overall performance.
Despite its impressive processing power, the EPYC 7313P maintains a reasonable thermal design power (TDP) of 155W, which is important for keeping energy consumption and heat generation in check, particularly in server environments where multiple processors may be running simultaneously.
In benchmark testing, the EPYC 7313P performs admirably, scoring a Geekbench 6 Single Core score of 727 and a Multi-Core score of 5233. These results reflect the processor's ability to handle both single-threaded and multi-threaded tasks with ease.
Overall, the AMD EPYC 7313P is a solid choice for server applications, offering a balance of performance, efficiency, and reliability. Whether for data processing, virtualization, or cloud computing, this processor is well-equipped to handle the demands of modern server workloads.
Basic
Label Name
AMD
Platform
Server
Launch Date
March 2021
Code Name
Milan
CPU Specifications
Total Cores
?
Cores is a hardware term that describes the number of independent central processing units in a single computing component (die or chip).
16
Total Threads
?
Where applicable, Intel® Hyper-Threading Technology is only available on Performance-cores.
32
Basic Frequency
3.0GHz
Max Turbo Frequency
?
Max Turbo Frequency is the maximum single-core frequency at which the processor is capable of operating using Intel® Turbo Boost Technology and, if present, Intel® Turbo Boost Max Technology 3.0 and Intel® Thermal Velocity Boost. Frequency is typically measured in gigahertz (GHz), or billion cycles per second.
Up to 3.7GHz
L3 Cache
128MB
CPU Socket
?
The socket is the component that provides the mechanical and electrical connections between the processor and motherboard.
SP3
Technology
?
Lithography refers to the semiconductor technology used to manufacture an integrated circuit, and is reported in nanometer (nm), indicative of the size of features built on the semiconductor.
7 nm
TDP
155W
PCI Express Version
?
PCI Express Revision is the supported version of the PCI Express standard. Peripheral Component Interconnect Express (or PCIe) is a high-speed serial computer expansion bus standard for attaching hardware devices to a computer. The different PCI Express versions support different data rates.
PCIe 4.0 x128
Memory Specifications
Memory Type
?
Intel® processors come in four different types: Single Channel, Dual Channel, Triple Channel, and Flex Mode. Maximum supported memory speed may be lower when populating multiple DIMMs per channel on products that support multiple memory channels.
DDR4
Memory Channels
?
The number of memory channels refers to the bandwidth operation for real world application.
8
Bus Speed
Up to 3200MT/s
Benchmarks
Geekbench 6
Single Core
Score
1564
Geekbench 6
Multi Core
Score
12471
Geekbench 5
Single Core
Score
1274
Geekbench 5
Multi Core
Score
14290
Passmark CPU
Single Core
Score
2704
Passmark CPU
Multi Core
Score
42032
Compared to Other CPU
Geekbench 6 Single Core
Geekbench 6 Multi Core
Geekbench 5 Single Core
Geekbench 5 Multi Core
Passmark CPU Single Core
Passmark CPU Multi Core