AMD Ryzen 3 PRO 7330U
About processor
The AMD Ryzen 3 PRO 7330U processor is a solid choice for those in need of a reliable and efficient CPU for their laptop. With its TSMC 7nm FinFET technology, this processor offers impressive performance while maintaining a low power consumption of 15W. The total of 4 cores and 8 threads allows for smooth multitasking and efficient processing of tasks.
The integrated AMD Radeon™ Graphics provide a good level of graphical performance, making it capable of handling casual gaming and HD video playback. The 8MB of L3 cache further enhances the overall performance of the processor by allowing for quick access to frequently used data.
In terms of benchmark results, the Geekbench 6 scores of 1599 for single-core performance and 3862 for multi-core performance demonstrate the capabilities of the Ryzen 3 PRO 7330U. These scores reflect its ability to handle everyday computing tasks with ease and efficiency.
Overall, the AMD Ryzen 3 PRO 7330U processor is a reliable and capable option for those in need of a efficient CPU for their laptop, offering solid performance and power efficiency.
Basic
Label Name
AMD
Platform
Laptop
Launch Date
January 2023
Code Name
Barcelo-R
CPU Specifications
Total Cores
?
Cores is a hardware term that describes the number of independent central processing units in a single computing component (die or chip).
4
Total Threads
?
Where applicable, Intel® Hyper-Threading Technology is only available on Performance-cores.
8
Basic Frequency
2.3GHz
Max Turbo Frequency
?
Max Turbo Frequency is the maximum single-core frequency at which the processor is capable of operating using Intel® Turbo Boost Technology and, if present, Intel® Turbo Boost Max Technology 3.0 and Intel® Thermal Velocity Boost. Frequency is typically measured in gigahertz (GHz), or billion cycles per second.
Up to 4.3GHz
L1 Cache
256KB
L2 Cache
2MB
L3 Cache
8MB
CPU Socket
?
The socket is the component that provides the mechanical and electrical connections between the processor and motherboard.
FP6
Technology
?
Lithography refers to the semiconductor technology used to manufacture an integrated circuit, and is reported in nanometer (nm), indicative of the size of features built on the semiconductor.
TSMC 7nm FinFET
TDP
15W
Max. Operating Temperature
?
Junction Temperature is the maximum temperature allowed at the processor die.
95°C
PCI Express Version
?
PCI Express Revision is the supported version of the PCI Express standard. Peripheral Component Interconnect Express (or PCIe) is a high-speed serial computer expansion bus standard for attaching hardware devices to a computer. The different PCI Express versions support different data rates.
PCIe® 3.0
Memory Specifications
Memory Type
?
Intel® processors come in four different types: Single Channel, Dual Channel, Triple Channel, and Flex Mode. Maximum supported memory speed may be lower when populating multiple DIMMs per channel on products that support multiple memory channels.
DDR4
Memory Channels
?
The number of memory channels refers to the bandwidth operation for real world application.
2
GPU Specifications
Integrated Graphics Model
?
An integrated GPU refers to the graphics core that is integrated into the CPU processor. Leveraging the processor's powerful computational capabilities and intelligent power efficiency management, it delivers outstanding graphics performance and a smooth application experience at a lower power consumption.
AMD Radeon™ Graphics
Graphics Frequency
?
Graphics max dynamic frequency refers to the maximum opportunistic graphics render clock frequency (in MHz) that can be supported using Intel® HD Graphics with Dynamic Frequency feature.
1800 MHz
Benchmarks
Geekbench 6
Single Core
Score
1599
Geekbench 6
Multi Core
Score
3862
Geekbench 5
Single Core
Score
1239
Geekbench 5
Multi Core
Score
4074
Passmark CPU
Single Core
Score
3183
Passmark CPU
Multi Core
Score
12758
Compared to Other CPU
Geekbench 6 Single Core
Geekbench 6 Multi Core
Geekbench 5 Single Core
Geekbench 5 Multi Core
Passmark CPU Single Core
Passmark CPU Multi Core