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AMD Ryzen 9 7945HX

About processor

The AMD Ryzen 9 7945HX processor is a powerhouse in the world of laptop CPUs. With its 16 cores and 32 threads, this processor is capable of handling even the most demanding of tasks with ease. The 5nm TSMC FinFET technology ensures efficient performance and low power consumption, with a TDP of just 55W. The integrated AMD Radeon™ 610M graphics provide a solid gaming and multimedia experience, making it a great option for both productivity and entertainment purposes. The 64MB L3 cache further enhances the processor's ability to handle heavy workloads and multitasking. In terms of performance, the Ryzen 9 7945HX excels in both single-core and multi-core tasks, scoring an impressive 2694 in Geekbench 6 Single Core and 15258 in Geekbench 6 Multi Core tests. This puts it head and shoulders above many other laptop processors on the market. Overall, the AMD Ryzen 9 7945HX is a top-of-the-line processor that offers exceptional performance and efficiency. Whether you're a content creator, gamer, or simply in need of a high-powered laptop for work, this processor won't disappoint.

Basic

Label Name

AMD

Platform

Laptop

Launch Date

January 2023

Code Name

Dragon Range

CPU Specifications

Total Cores

Cores is a hardware term that describes the number of independent central processing units in a single computing component (die or chip).

Total Threads

Where applicable, Intel® Hyper-Threading Technology is only available on Performance-cores.

Basic Frequency

2.5GHz

Max Turbo Frequency

Max Turbo Frequency is the maximum single-core frequency at which the processor is capable of operating using Intel® Turbo Boost Technology and, if present, Intel® Turbo Boost Max Technology 3.0 and Intel® Thermal Velocity Boost. Frequency is typically measured in gigahertz (GHz), or billion cycles per second.

Up to 5.4GHz

L1 Cache

1024KB

L2 Cache

16MB

L3 Cache

64MB

CPU Socket

The socket is the component that provides the mechanical and electrical connections between the processor and motherboard.

FL1

Technology

Lithography refers to the semiconductor technology used to manufacture an integrated circuit, and is reported in nanometer (nm), indicative of the size of features built on the semiconductor.

TSMC 5nm FinFET

TDP

55W

Max. Operating Temperature

Junction Temperature is the maximum temperature allowed at the processor die.

100°C

PCI Express Version

PCI Express Revision is the supported version of the PCI Express standard. Peripheral Component Interconnect Express (or PCIe) is a high-speed serial computer expansion bus standard for attaching hardware devices to a computer. The different PCI Express versions support different data rates.

PCIe® 5.0

Memory Specifications

Memory Type

Intel® processors come in four different types: Single Channel, Dual Channel, Triple Channel, and Flex Mode. Maximum supported memory speed may be lower when populating multiple DIMMs per channel on products that support multiple memory channels.

DDR5

Memory Channels

The number of memory channels refers to the bandwidth operation for real world application.

GPU Specifications

Integrated Graphics Model

An integrated GPU refers to the graphics core that is integrated into the CPU processor. Leveraging the processor's powerful computational capabilities and intelligent power efficiency management, it delivers outstanding graphics performance and a smooth application experience at a lower power consumption.

AMD Radeon™ 610M

Graphics Frequency

Graphics max dynamic frequency refers to the maximum opportunistic graphics render clock frequency (in MHz) that can be supported using Intel® HD Graphics with Dynamic Frequency feature.

2200 MHz