Home / AMD Ryzen 7 / AMD Ryzen 7 7745HX: Performance and Specs

AMD Ryzen 7 7745HX

About processor

The AMD Ryzen 7 7745HX processor is a powerful and efficient CPU designed for laptops. Built on the TSMC 5nm FinFET technology, this processor offers excellent performance while maintaining a low thermal design power (TDP) of just 55W. The Ryzen 7 7745HX features 8 cores and 16 threads, making it well-suited for multitasking and demanding workloads. One of the standout features of this processor is its impressive L3 cache of 32MB, which allows for fast data access and smooth overall performance. Additionally, the integrated AMD Radeon™ 610M graphics provide decent visuals for light gaming and multimedia tasks. In terms of benchmarks, the AMD Ryzen 7 7745HX excels with a Geekbench 6 single-core score of 2678 and a multi-core score of 13181. These results showcase the CPU's ability to handle both single-threaded and multi-threaded tasks with ease. Overall, the AMD Ryzen 7 7745HX is a top-of-the-line processor that offers exceptional performance, power efficiency, and impressive multi-core capabilities. Whether you're a content creator, gamer, or professional in need of a high-performance laptop CPU, the Ryzen 7 7745HX is definitely worth considering.

Basic

Label Name

AMD

Platform

Laptop

Launch Date

January 2023

Code Name

Dragon Range

CPU Specifications

Total Cores

Cores is a hardware term that describes the number of independent central processing units in a single computing component (die or chip).

Total Threads

Where applicable, Intel® Hyper-Threading Technology is only available on Performance-cores.

Basic Frequency

3.6GHz

Max Turbo Frequency

Max Turbo Frequency is the maximum single-core frequency at which the processor is capable of operating using Intel® Turbo Boost Technology and, if present, Intel® Turbo Boost Max Technology 3.0 and Intel® Thermal Velocity Boost. Frequency is typically measured in gigahertz (GHz), or billion cycles per second.

Up to 5.1GHz

L1 Cache

512KB

L2 Cache

8MB

L3 Cache

32MB

CPU Socket

The socket is the component that provides the mechanical and electrical connections between the processor and motherboard.

FL1

Technology

Lithography refers to the semiconductor technology used to manufacture an integrated circuit, and is reported in nanometer (nm), indicative of the size of features built on the semiconductor.

TSMC 5nm FinFET

TDP

55W

Max. Operating Temperature

Junction Temperature is the maximum temperature allowed at the processor die.

100°C

PCI Express Version

PCI Express Revision is the supported version of the PCI Express standard. Peripheral Component Interconnect Express (or PCIe) is a high-speed serial computer expansion bus standard for attaching hardware devices to a computer. The different PCI Express versions support different data rates.

PCIe® 5.0

Memory Specifications

Memory Type

Intel® processors come in four different types: Single Channel, Dual Channel, Triple Channel, and Flex Mode. Maximum supported memory speed may be lower when populating multiple DIMMs per channel on products that support multiple memory channels.

DDR5

Memory Channels

The number of memory channels refers to the bandwidth operation for real world application.

GPU Specifications

Integrated Graphics Model

An integrated GPU refers to the graphics core that is integrated into the CPU processor. Leveraging the processor's powerful computational capabilities and intelligent power efficiency management, it delivers outstanding graphics performance and a smooth application experience at a lower power consumption.

AMD Radeon™ 610M

Graphics Frequency

Graphics max dynamic frequency refers to the maximum opportunistic graphics render clock frequency (in MHz) that can be supported using Intel® HD Graphics with Dynamic Frequency feature.

2200 MHz