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AMD Ryzen 9 7900X3D

About processor

The AMD Ryzen 9 7900X3D processor is a powerhouse performer that brings next-level performance to desktop computing. With its 12 cores, 24 threads, and TSMC 5nm FinFET technology, this processor delivers exceptional speed and efficiency for all types of tasks, from gaming to content creation. One of the standout features of the Ryzen 9 7900X3D is its massive 128MB L3 cache, which allows for lightning-fast data access and significantly improves overall system responsiveness. Additionally, the integrated AMD Radeon™ Graphics provide solid visual performance without the need for a separate graphics card. In real-world performance, the Ryzen 9 7900X3D excels in both single-threaded and multi-threaded workloads. Its Geekbench 6 scores of 2803 for single-core and 17397 for multi-core performance are a testament to its capabilities in handling even the most demanding applications and games. Despite its high performance, the Ryzen 9 7900X3D maintains a reasonable 120W TDP, making it a relatively power-efficient option for a high-end desktop processor. Overall, the AMD Ryzen 9 7900X3D processor is a top-of-the-line choice for anyone seeking unmatched performance and efficiency in their desktop system. Whether you're a hardcore gamer, a professional content creator, or a power user, this processor has the capabilities to handle it all.

Basic

Label Name

AMD

Platform

Desktop

Launch Date

January 2023

Code Name

Raphael

CPU Specifications

Total Cores

Cores is a hardware term that describes the number of independent central processing units in a single computing component (die or chip).

Total Threads

Where applicable, Intel® Hyper-Threading Technology is only available on Performance-cores.

Basic Frequency

4.4GHz

Max Turbo Frequency

Max Turbo Frequency is the maximum single-core frequency at which the processor is capable of operating using Intel® Turbo Boost Technology and, if present, Intel® Turbo Boost Max Technology 3.0 and Intel® Thermal Velocity Boost. Frequency is typically measured in gigahertz (GHz), or billion cycles per second.

Up to 5.6GHz

L1 Cache

768KB

L2 Cache

12MB

L3 Cache

128MB

CPU Socket

The socket is the component that provides the mechanical and electrical connections between the processor and motherboard.

AM5

Technology

Lithography refers to the semiconductor technology used to manufacture an integrated circuit, and is reported in nanometer (nm), indicative of the size of features built on the semiconductor.

TSMC 5nm FinFET

TDP

120W

Max. Operating Temperature

Junction Temperature is the maximum temperature allowed at the processor die.

89°C

PCI Express Version

PCI Express Revision is the supported version of the PCI Express standard. Peripheral Component Interconnect Express (or PCIe) is a high-speed serial computer expansion bus standard for attaching hardware devices to a computer. The different PCI Express versions support different data rates.

PCIe® 5.0

Memory Specifications

Memory Type

Intel® processors come in four different types: Single Channel, Dual Channel, Triple Channel, and Flex Mode. Maximum supported memory speed may be lower when populating multiple DIMMs per channel on products that support multiple memory channels.

DDR5

Memory Channels

The number of memory channels refers to the bandwidth operation for real world application.

GPU Specifications

Integrated Graphics Model

An integrated GPU refers to the graphics core that is integrated into the CPU processor. Leveraging the processor's powerful computational capabilities and intelligent power efficiency management, it delivers outstanding graphics performance and a smooth application experience at a lower power consumption.

AMD Radeon™ Graphics

Graphics Frequency

Graphics max dynamic frequency refers to the maximum opportunistic graphics render clock frequency (in MHz) that can be supported using Intel® HD Graphics with Dynamic Frequency feature.

2200 MHz