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AMD Ryzen 9 7900

About processor

The AMD Ryzen 9 7900 processor is a powerhouse of a CPU, ideal for demanding workloads and high-performance gaming. With a total of 12 cores and 24 threads, this processor delivers exceptional multitasking capabilities and overall processing power. The 64MB of L3 cache ensures quick access to frequently used data, further enhancing the CPU's performance. The 5nm TSMC FinFET technology utilized in the Ryzen 9 7900 results in improved power efficiency and overall performance, making it a great choice for environmentally conscious users. Despite its impressive capabilities, the processor maintains a TDP of just 65W, showcasing its energy-efficient design. The integrated AMD Radeon™ Graphics provide solid graphics performance, making the Ryzen 9 7900 suitable for gaming and content creation without the need for a dedicated GPU. Benchmark tests further demonstrate the processor's capabilities, with Geekbench 6 Single Core score of 2829 and Multi-Core score of 16754, indicating strong single-threaded performance and exceptional multi-threaded performance. Overall, the AMD Ryzen 9 7900 processor is a top-of-the-line option for users seeking uncompromising performance, efficiency, and multitasking capabilities for their desktop systems.

Basic

Label Name

AMD

Platform

Desktop

Launch Date

January 2023

Code Name

Raphael

CPU Specifications

Total Cores

Cores is a hardware term that describes the number of independent central processing units in a single computing component (die or chip).

Total Threads

Where applicable, Intel® Hyper-Threading Technology is only available on Performance-cores.

Basic Frequency

3.7GHz

Max Turbo Frequency

Max Turbo Frequency is the maximum single-core frequency at which the processor is capable of operating using Intel® Turbo Boost Technology and, if present, Intel® Turbo Boost Max Technology 3.0 and Intel® Thermal Velocity Boost. Frequency is typically measured in gigahertz (GHz), or billion cycles per second.

Up to 5.4GHz

L1 Cache

768KB

L2 Cache

12MB

L3 Cache

64MB

CPU Socket

The socket is the component that provides the mechanical and electrical connections between the processor and motherboard.

AM5

Technology

Lithography refers to the semiconductor technology used to manufacture an integrated circuit, and is reported in nanometer (nm), indicative of the size of features built on the semiconductor.

TSMC 5nm FinFET

TDP

65W

Max. Operating Temperature

Junction Temperature is the maximum temperature allowed at the processor die.

95°C

PCI Express Version

PCI Express Revision is the supported version of the PCI Express standard. Peripheral Component Interconnect Express (or PCIe) is a high-speed serial computer expansion bus standard for attaching hardware devices to a computer. The different PCI Express versions support different data rates.

PCIe® 5.0

Memory Specifications

Memory Type

Intel® processors come in four different types: Single Channel, Dual Channel, Triple Channel, and Flex Mode. Maximum supported memory speed may be lower when populating multiple DIMMs per channel on products that support multiple memory channels.

DDR5

Memory Channels

The number of memory channels refers to the bandwidth operation for real world application.

GPU Specifications

Integrated Graphics Model

An integrated GPU refers to the graphics core that is integrated into the CPU processor. Leveraging the processor's powerful computational capabilities and intelligent power efficiency management, it delivers outstanding graphics performance and a smooth application experience at a lower power consumption.

AMD Radeon™ Graphics

Graphics Frequency

Graphics max dynamic frequency refers to the maximum opportunistic graphics render clock frequency (in MHz) that can be supported using Intel® HD Graphics with Dynamic Frequency feature.

2200 MHz