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AMD Ryzen 9 5900HX

About processor

The AMD Ryzen 9 5900HX processor is a powerhouse for high-performance laptops. With its 8 cores and 16 threads, this processor delivers exceptional multitasking capabilities and excellent performance for demanding tasks such as gaming, content creation, and productivity. The 7nm FinFET technology from TSMC ensures efficient power consumption and thermal management, making it suitable for both gaming laptops and professional workstations. The inclusion of 16MB of L3 cache further enhances the processor's ability to handle large amounts of data, resulting in smoother overall performance. The integrated AMD Radeon™ Graphics also provides solid graphical capabilities, allowing for smooth gaming and graphic-intensive tasks without the need for a dedicated GPU. In terms of benchmarks, the Ryzen 9 5900HX performs admirably. With a Geekbench 6 Single Core score of 1835 and a Multi-Core score of 7485, it outperforms many of its competitors in both single-threaded and multi-threaded workloads. Overall, the AMD Ryzen 9 5900HX is a top-of-the-line processor that offers desktop-class performance in a mobile platform, making it an excellent choice for users who need uncompromising performance on the go.

Basic

Label Name

AMD

Platform

Laptop

Launch Date

January 2021

Code Name

Cezanne

CPU Specifications

Total Cores

Cores is a hardware term that describes the number of independent central processing units in a single computing component (die or chip).

Total Threads

Where applicable, Intel® Hyper-Threading Technology is only available on Performance-cores.

Basic Frequency

3.3GHz

Max Turbo Frequency

Max Turbo Frequency is the maximum single-core frequency at which the processor is capable of operating using Intel® Turbo Boost Technology and, if present, Intel® Turbo Boost Max Technology 3.0 and Intel® Thermal Velocity Boost. Frequency is typically measured in gigahertz (GHz), or billion cycles per second.

Up to 4.6GHz

L2 Cache

4MB

L3 Cache

16MB

CPU Socket

The socket is the component that provides the mechanical and electrical connections between the processor and motherboard.

FP6

Technology

Lithography refers to the semiconductor technology used to manufacture an integrated circuit, and is reported in nanometer (nm), indicative of the size of features built on the semiconductor.

TSMC 7nm FinFET

TDP

45+W

Max. Operating Temperature

Junction Temperature is the maximum temperature allowed at the processor die.

105°C

PCI Express Version

PCI Express Revision is the supported version of the PCI Express standard. Peripheral Component Interconnect Express (or PCIe) is a high-speed serial computer expansion bus standard for attaching hardware devices to a computer. The different PCI Express versions support different data rates.

PCIe® 3.0

Memory Specifications

Memory Type

Intel® processors come in four different types: Single Channel, Dual Channel, Triple Channel, and Flex Mode. Maximum supported memory speed may be lower when populating multiple DIMMs per channel on products that support multiple memory channels.

DDR4 - Up to 3200 MT/s, LPDDR4 - Up to 4266 MT/s

GPU Specifications

Integrated Graphics Model

An integrated GPU refers to the graphics core that is integrated into the CPU processor. Leveraging the processor's powerful computational capabilities and intelligent power efficiency management, it delivers outstanding graphics performance and a smooth application experience at a lower power consumption.

AMD Radeon™ Graphics

Graphics Frequency

Graphics max dynamic frequency refers to the maximum opportunistic graphics render clock frequency (in MHz) that can be supported using Intel® HD Graphics with Dynamic Frequency feature.

2100 MHz

Graphics Core Count