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AMD Ryzen 9 5900HX

vs

AMD Ryzen AI 9 HX 370

CPU Comparison Result

Below are the results of a comparison of AMD Ryzen 9 5900HX and AMD Ryzen AI 9 HX 370 processors based on key performance characteristics, as well as power consumption and much more.

Advantages

AMD Ryzen AI 9 HX 370

More Total Cores: 12 (8 vs 12)
Higher Max Turbo Frequency: Up to 5.1 GHz (Up to 4.6GHz vs Up to 5.1 GHz)
Larger L3 Cache: 24 MB (16MB vs 24 MB)
Higher Technology: TSMC 4nm FinFET (TSMC 7nm FinFET vs TSMC 4nm FinFET)
Newer PCI Express Version: PCIe® 4.0 (PCIe® 3.0 vs PCIe® 4.0)
Higher Memory Type: DDR5 (FP8), LPDDR5X (FP8) (DDR4 - Up to 3200 MT/s, LPDDR4 - Up to 4266 MT/s vs DDR5 (FP8), LPDDR5X (FP8))
Newer Launch Date: July 2025 (January 2021 vs July 2025)

Basic

AMD

Label Name

AMD

January 2021

Launch Date

July 2025

Laptop

Platform

Laptop

Model Name

Ryzen AI 9 HX 370

Cezanne

Code Name

Strix Point

Generation

4x Zen 5, 8x Zen 5c

Windows 10 - 64-Bit Edition, RHEL x86 64-Bit, Ubuntu x86 64-Bit *Operating System (OS) support will vary by manufacturer.

OS Support

Windows 11 - 64-Bit Edition, RHEL x86 64-Bit, Ubuntu x86 64-Bit

CPU Specifications

Total Cores

Cores is a hardware term that describes the number of independent central processing units in a single computing component (die or chip).

Total Threads

3.3GHz

Basic Frequency

2 GHz

Up to 4.6GHz

Max Turbo Frequency

Up to 5.1 GHz

4MB

L2 Cache

12 MB

16MB

L3 Cache

24 MB

FP6

CPU Socket

The socket is the component that provides the mechanical and electrical connections between the processor and motherboard.

FP8

TSMC 7nm FinFET

Technology

Lithography refers to the semiconductor technology used to manufacture an integrated circuit, and is reported in nanometer (nm), indicative of the size of features built on the semiconductor.

TSMC 4nm FinFET

45+W

TDP

28W

105°C

Max. Operating Temperature

Junction Temperature is the maximum temperature allowed at the processor die.

100°C

PCIe® 3.0

PCI Express Version

PCI Express Revision is the supported version of the PCI Express standard. Peripheral Component Interconnect Express (or PCIe) is a high-speed serial computer expansion bus standard for attaching hardware devices to a computer. The different PCI Express versions support different data rates.

PCIe® 4.0

Memory Specifications

DDR4 - Up to 3200 MT/s, LPDDR4 - Up to 4266 MT/s

Memory Type

DDR5 (FP8), LPDDR5X (FP8)

Max Memory Size

Max memory size refers to the maximum memory capacity supported by the processor.

256 GB

Memory Channels

The number of memory channels refers to the bandwidth operation for real world application.

Maximum Memory Speed

2x2R DDR5-5600

ECC Memory Support

ECC Memory Supported indicates processor support for Error-Correcting Code memory. ECC memory is a type of system memory that can detect and correct common kinds of internal data corruption. Note that ECC memory support requires both processor and chipset support.

GPU Specifications

AMD Radeon™ Graphics

Integrated Graphics Model

An integrated GPU refers to the graphics core that is integrated into the CPU processor. Leveraging the processor's powerful computational capabilities and intelligent power efficiency management, it delivers outstanding graphics performance and a smooth application experience at a lower power consumption.

AMD Radeon™ 890M

Graphics Core Count

2100 MHz

Graphics Frequency

2900 MHz