AMD Ryzen AI 9 HX 370
The AMD Ryzen 9 HX 370 processor is a powerhouse of a CPU, designed to deliver exceptional performance for high-end laptops. With a total of 12 cores and 24 threads, this processor is capable of handling even the most demanding tasks with ease. The 4nm technology ensures efficient power usage and excellent thermal performance, making it suitable for portable devices.
The performance-core base frequency of 2 GHz and a max turbo frequency of 5.1 GHz ensure that the Ryzen 9 HX 370 can handle both single-threaded and multi-threaded workloads effortlessly. The generous 24MB of L3 cache further enhances its ability to handle large amounts of data quickly and efficiently.
One of the standout features of this processor is the integrated graphics, which provides solid performance for gaming and content creation without the need for a dedicated GPU. This makes it an attractive option for those who want a powerful laptop that can handle both work and play.
Overall, the AMD Ryzen 9 HX 370 processor is a top-of-the-line option for high-performance laptops, delivering exceptional multitasking capabilities and solid graphics performance in a power-efficient package.
CPU Comparison
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Basic
Label Name
AMD
Platform
Laptop
Launch Date
July 2025
Model Name
Ryzen AI 9 HX 370
Code Name
Strix Point
Generation
4x Zen 5, 8x Zen 5c
OS Support
Windows 11 - 64-Bit Edition, RHEL x86 64-Bit, Ubuntu x86 64-Bit
CPU Specifications
Total Cores
Cores is a hardware term that describes the number of independent central processing units in a single computing component (die or chip).
12
Total Threads
24
Basic Frequency
2 GHz
Max Turbo Frequency
Up to 5.1 GHz
L2 Cache
12 MB
L3 Cache
24 MB
CPU Socket
The socket is the component that provides the mechanical and electrical connections between the processor and motherboard.
FP8
Technology
Lithography refers to the semiconductor technology used to manufacture an integrated circuit, and is reported in nanometer (nm), indicative of the size of features built on the semiconductor.
TSMC 4nm FinFET
TDP
28W
Max. Operating Temperature
Junction Temperature is the maximum temperature allowed at the processor die.
100°C
PCI Express Version
PCI Express Revision is the supported version of the PCI Express standard. Peripheral Component Interconnect Express (or PCIe) is a high-speed serial computer expansion bus standard for attaching hardware devices to a computer. The different PCI Express versions support different data rates.
PCIe® 4.0
Memory Specifications
Memory Type
DDR5 (FP8), LPDDR5X (FP8)
Max Memory Size
Max memory size refers to the maximum memory capacity supported by the processor.
256 GB
Memory Channels
The number of memory channels refers to the bandwidth operation for real world application.
2
Maximum Memory Speed
2x2R DDR5-5600
ECC Memory Support
ECC Memory Supported indicates processor support for Error-Correcting Code memory. ECC memory is a type of system memory that can detect and correct common kinds of internal data corruption. Note that ECC memory support requires both processor and chipset support.
No
GPU Specifications
Integrated Graphics Model
An integrated GPU refers to the graphics core that is integrated into the CPU processor. Leveraging the processor's powerful computational capabilities and intelligent power efficiency management, it delivers outstanding graphics performance and a smooth application experience at a lower power consumption.
Graphics Core Count
16
Graphics Frequency
2900 MHz
Miscellaneous
Official Website
Benchmarks
Geekbench 6
Single Core
Score
2689
Geekbench 6
Multi Core
Score
13515
Geekbench 7
Single Core
Score
2646
Geekbench 7
Multi Core
Score
16665
Passmark CPU
Single Core
Score
4213
Passmark CPU
Multi Core
Score
37699
3DMark CPU Profile
Single Core
Score
1161
3DMark CPU Profile
Multi Core
Score
9472
Compared to Other CPU
Geekbench 6 Single Core
Geekbench 6 Multi Core
Geekbench 7 Single Core
Geekbench 7 Multi Core
Passmark CPU Single Core
Passmark CPU Multi Core
3DMark CPU Profile Single Core
3DMark CPU Profile Multi Core
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