AMD Ryzen 9 5900HS
About processor
The AMD Ryzen 9 5900HS is a powerful laptop processor built on TSMC's 7nm FinFET technology. With 8 total cores and 16 total threads, this processor is designed for high-performance computing tasks. The 16MB L3 cache ensures fast and efficient data retrieval, while the low 35W TDP makes it suitable for thin and light laptops.
One of the standout features of the Ryzen 9 5900HS is its integrated AMD Radeon™ Graphics, which provides excellent visuals for gaming, content creation, and multimedia tasks. With a Geekbench 6 Single Core score of 1892 and a Multi Core score of 7123, this processor delivers impressive performance across a range of applications.
In real-world usage, the Ryzen 9 5900HS excels at multitasking, video editing, and gaming, thanks to its high clock speeds and efficient multi-threading capabilities. Additionally, the power efficiency of this processor ensures longer battery life for on-the-go productivity.
Overall, the AMD Ryzen 9 5900HS is a top-of-the-line laptop processor that offers exceptional performance and power efficiency, making it a great choice for demanding users who require high-performance computing on the go.
Basic
Label Name
AMD
Platform
Laptop
Launch Date
January 2021
CPU Specifications
Total Cores
?
Cores is a hardware term that describes the number of independent central processing units in a single computing component (die or chip).
8
Total Threads
?
Where applicable, Intel® Hyper-Threading Technology is only available on Performance-cores.
16
Basic Frequency
3.0GHz
Max Turbo Frequency
?
Max Turbo Frequency is the maximum single-core frequency at which the processor is capable of operating using Intel® Turbo Boost Technology and, if present, Intel® Turbo Boost Max Technology 3.0 and Intel® Thermal Velocity Boost. Frequency is typically measured in gigahertz (GHz), or billion cycles per second.
Up to 4.6GHz
L1 Cache
8KB
L2 Cache
4MB
L3 Cache
16MB
CPU Socket
?
The socket is the component that provides the mechanical and electrical connections between the processor and motherboard.
FP6
Technology
?
Lithography refers to the semiconductor technology used to manufacture an integrated circuit, and is reported in nanometer (nm), indicative of the size of features built on the semiconductor.
TSMC 7nm FinFET
TDP
35W
Max. Operating Temperature
?
Junction Temperature is the maximum temperature allowed at the processor die.
105°C
PCI Express Version
?
PCI Express Revision is the supported version of the PCI Express standard. Peripheral Component Interconnect Express (or PCIe) is a high-speed serial computer expansion bus standard for attaching hardware devices to a computer. The different PCI Express versions support different data rates.
PCIe® 3.0
Memory Specifications
Memory Type
?
Intel® processors come in four different types: Single Channel, Dual Channel, Triple Channel, and Flex Mode. Maximum supported memory speed may be lower when populating multiple DIMMs per channel on products that support multiple memory channels.
DDR4 - Up to 3200 MT/s, LPDDR4 - Up to 4266 MT/s
GPU Specifications
Integrated Graphics Model
?
An integrated GPU refers to the graphics core that is integrated into the CPU processor. Leveraging the processor's powerful computational capabilities and intelligent power efficiency management, it delivers outstanding graphics performance and a smooth application experience at a lower power consumption.
AMD Radeon™ Graphics
Graphics Frequency
?
Graphics max dynamic frequency refers to the maximum opportunistic graphics render clock frequency (in MHz) that can be supported using Intel® HD Graphics with Dynamic Frequency feature.
2100 MHz
Benchmarks
Geekbench 6
Single Core
Score
1892
Geekbench 6
Multi Core
Score
7123
Geekbench 5
Single Core
Score
1326
Geekbench 5
Multi Core
Score
6597
Passmark CPU
Single Core
Score
3173
Passmark CPU
Multi Core
Score
21780
Compared to Other CPU
Geekbench 6 Single Core
Geekbench 6 Multi Core
Geekbench 5 Single Core
Geekbench 5 Multi Core
Passmark CPU Single Core
Passmark CPU Multi Core