AMD Ryzen 3 PRO 8300GE

AMD Ryzen 3 PRO 8300GE

AMD Ryzen 3 PRO 8300GE: Overview and Practical Assembly Tips

Energy Efficiency and Performance for Budget Systems


1. Key Features: Phoenix2 Architecture and Highlights

The AMD Ryzen 3 PRO 8300GE processor is built on the Zen 4 architecture (codename Phoenix2) and is manufactured using a 4nm process, ensuring high energy efficiency. This APU (Accelerated Processing Unit) is a hybrid of CPU and GPU, integrating Radeon 740M graphics.

Specifications:

- 4 cores / 8 threads with a frequency of 3.4–4.9 GHz.

- 8 MB L3 cache to accelerate tasks.

- TDP 35W — ideal for compact and quiet systems.

- Radeon 740M based on RDNA 2 architecture (4 compute units).

Key Features:

- Ryzen AI — support for artificial intelligence to optimize tasks (e.g., noise reduction in Zoom).

- AV1 Decoding — relevant for streaming and working with 4K video.

- Pro Features — hardware data protection (Memory Guard), useful for enterprise users.

Practical Example: In Geekbench 6 tests, the processor scores 2377 points in single-core and 6307 in multi-core modes, comparable to the Intel Core i5-12400, but with half the power consumption.


2. Compatible Motherboards: AM5 Socket and Chipsets

The processor uses the AM5 socket (LGA 1718), ensuring support for future Ryzen generations until 2025.

Recommended Chipsets:

- A620 — a budget option for basic builds (no overclocking).

- B650 — the optimal choice with support for PCIe 5.0 and USB4.

- X670 — for enthusiasts, but excessive for Ryzen 3.

What to Pay Attention To:

- Motherboards with active VRM cooling are not needed due to the processor's low TDP.

- To activate all features (e.g., Ryzen AI), update the BIOS to the latest version.

Tip: ASRock B650M-HDV/M.2 or Gigabyte A620I AX motherboards are suitable for compact PCs.


3. Supported Memory: DDR5 and Optimization

The Ryzen 3 PRO 8300GE works with DDR5-5200 MHz in dual-channel mode.

Recommendations:

- At least 16 GB (2×8 GB) for gaming and multitasking.

- Choose modules with low timings (CL30-CL32) — this will enhance the performance of the iGPU.

- DDR4 is not supported — this is exclusively an AM5 platform.

Example: In tests with DDR5-6000 CL30, the FPS boost in games (e.g., CS2) reaches up to 15% compared to standard DDR5-5200.


4. Power Supply Units: Power Calculation

With a TDP of 35W, the processor consumes little power, but it’s essential to account for other components:

Recommended PSUs:

- For systems without a discrete graphics card — 300–400W (e.g., be quiet! Pure Power 11 400W).

- With a GPU like the NVIDIA RTX 4060 — 500–600W.

- In mini-PCs, SFX format power supplies can be used (e.g., Corsair SF450).

Important: Even under heavy load (rendering + graphics), a system with Ryzen 3 PRO 8300GE rarely consumes more than 100W.


5. Pros and Cons of the Processor

Pros:

- Energy efficiency — suitable for passive cooling.

- Powerful integrated graphics (Radeon 740M).

- Support for modern standards (PCIe 5.0, USB4).

Cons:

- Only 4 cores — insufficient for heavy editing or streaming.

- No support for DDR4.

- High cost of the AM5 platform (compared to AM4).


6. Usage Scenarios: Gaming, Work, Multimedia

- Office Tasks: Handles 20+ browser tabs and Excel without issues.

- Gaming: In Full HD at low settings — Fortnite (60 FPS), GTA V (70 FPS), CS2 (90 FPS).

- Video Editing: Editing 1080p videos in DaVinci Resolve is fine, but 4K will require a discrete graphics card.

- HTPC: Support for AV1 and HDMI 2.1 — ideal for media centers.

Example: Users note smooth operation in Adobe Photoshop + Lightroom simultaneously.


7. Comparison with Competitors

- Intel Core i3-13100F: Better in single-threaded tasks but lacks integrated graphics.

- Ryzen 5 7600: 6 cores but more expensive and TDP of 65W.

- Apple M1: Comparable energy efficiency but limited software compatibility.

Conclusion: The Ryzen 3 PRO 8300GE stands out against competitors due to its balance of price, performance, and iGPU.


8. Practical Assembly Tips

- Case: Choose Mini-ITX (e.g., Cooler Master NR200) for compactness.

- Cooling: The stock cooler is sufficient, but for quiet operation, consider the Noctua NH-L9a.

- Storage: PCIe 4.0 NVMe SSD (e.g., WD Black SN770) will speed up system bootup.

- Networking: Motherboards with Wi-Fi 6E (e.g., ASUS TUF Gaming B650-Plus) eliminate the need for cables.


9. Final Conclusion: Who is the Ryzen 3 PRO 8300GE For?

This processor is ideal for:

- Office PCs with future-proofing in mind.

- Budget gaming systems without a discrete graphics card.

- Mini-PCs and media centers (HTPC).

- Corporate users due to Pro security features.

Why it? The combination of low power consumption, modern architecture, and powerful integrated graphics makes the Ryzen 3 PRO 8300GE a unique solution in its category. If you don't need 8 cores but value stability and quiet operation — this is your choice.

Basic

Label Name
AMD
Platform
Desktop
Launch Date
April 2024
Model Name
?
The Intel processor number is just one of several factors - along with processor brand, system configurations, and system-level benchmarks - to be considered when choosing the right processor for your computing needs.
Ryzen 3 PRO 8300GE
Code Name
Phoenix2
Foundry
TSMC
Generation
Ryzen 3 (Zen 4 (Phoenix))

CPU Specifications

Total Cores
?
Cores is a hardware term that describes the number of independent central processing units in a single computing component (die or chip).
4
Total Threads
?
Where applicable, Intel® Hyper-Threading Technology is only available on Performance-cores.
8
Performance-core Base Frequency
3.4 GHz
Efficient-core Base Frequency
3.2 GHz
Performance-core Max Turbo Frequency
?
Maximum P-core turbo frequency derived from Intel® Turbo Boost Technology.
4.9 GHz
L1 Cache
64 KB per core
L2 Cache
1 MB per core
L3 Cache
8 MB shared
Bus Frequency
100 MHz
Multiplier
40.0
Unlocked Multiplier
No
CPU Socket
?
The socket is the component that provides the mechanical and electrical connections between the processor and motherboard.
AMD Socket AM5
Technology
?
Lithography refers to the semiconductor technology used to manufacture an integrated circuit, and is reported in nanometer (nm), indicative of the size of features built on the semiconductor.
4 nm
TDP
35 W
Max. Operating Temperature
?
Junction Temperature is the maximum temperature allowed at the processor die.
95°C
PCIe Version
?
PCI Express is a high-speed serial computer expansion bus standard used for connecting high-speed components, replacing older standards such as AGP, PCI, and PCI-X. It has gone through multiple revisions and improvements since its initial release. PCIe 1.0 was first introduced in 2002, and in order to meet the growing demand for higher bandwidth, subsequent versions have been released over time.
4
Transistor Count
20.9 billions

Memory Specifications

Memory Type
?
Intel® processors come in four different types: Single Channel, Dual Channel, Triple Channel, and Flex Mode. Maximum supported memory speed may be lower when populating multiple DIMMs per channel on products that support multiple memory channels.
DDR5-5200
Memory Channels
?
The number of memory channels refers to the bandwidth operation for real world application.
2
ECC Memory Support
Yes

GPU Specifications

Integrated Graphics Model
?
An integrated GPU refers to the graphics core that is integrated into the CPU processor. Leveraging the processor's powerful computational capabilities and intelligent power efficiency management, it delivers outstanding graphics performance and a smooth application experience at a lower power consumption.
Radeon 740M

Miscellaneous

PCIe Lanes
14

Benchmarks

Geekbench 6
Single Core Score
2377
Geekbench 6
Multi Core Score
6307
Passmark CPU
Single Core Score
3893
Passmark CPU
Multi Core Score
14719

Compared to Other CPU

Geekbench 6 Single Core
2678 +12.7%
2530 +6.4%
2254 -5.2%
2170 -8.7%
Geekbench 6 Multi Core
6674 +5.8%
5866 -7%
5537 -12.2%
Passmark CPU Single Core
4139 +6.3%
4021 +3.3%
3815 -2%
3726 -4.3%
Passmark CPU Multi Core
16194 +10%
15429 +4.8%
14290 -2.9%
13679 -7.1%