Qualcomm Snapdragon 888
vs
HiSilicon Kirin 9010

vs

SoC Comparison Result

Below are the results of a comparison of Qualcomm Snapdragon 888 and HiSilicon Kirin 9010 mobile processors based on key performance characteristics, as well as power consumption and much more.

Advantages

  • Higher Technology: 5 nm (5 nm vs 7 nm)
  • Higher Frequency: 2840 MHz (2840 MHz vs 2300 MHz)
  • Newer Launch Date: April 2024 (December 2020 vs April 2024)

Basic

Qualcomm
Label Name
HiSilicon
December 2020
Launch Date
April 2024
SmartPhone Flagship
Platform
SmartPhone Flagship
-
Manufacturing
SMIC
SM8350
Model Name
Kirin 9010
1x 2.84 GHz – Kryo 680 Prime (Cortex-X1)
3x 2.42 GHz – Kryo 680 Gold (Cortex-A78)
4x 1.8 GHz – Kryo 680 Silver (Cortex-A55)
Architecture
2x 2.3 GHz – TaiShan V121
4x 1.55 GHz – TaiShan V121
6x 2.18 GHz – Cortex-A510
8
Cores
12
5 nm
Technology
7 nm
2840 MHz
Frequency
2300 MHz

GPU Specifications

Adreno 660
GPU name
Maleoon 910
840 MHz
GPU frequency
750 MHz
1.72 TFLOPS
FLOPS
-
512
Shading units
-
2
Execution units
-
2.0
OpenCL version
-
1.1
Vulkan version
-
3840 x 2160
Max display resolution
-
12
DirectX version
-

Connectivity

Up to 2500 Mbps
Download speed
-
LTE Cat. 22
4G support
-
5.2
Bluetooth
-
6
Wi-Fi
-
GPS, GLONASS, Beidou, Galileo, QZSS, SBAS, NAVIC
Navigation
-

Memory Specifications

LPDDR5
Memory type
-
3200 MHz
Memory frequency
2750 MHz
4x 16 Bit
Memory Bus
4x 16 Bit

Miscellaneous

1 MB
L2 Cache
-
AAC, AIFF, CAF, MP3, MP4, WAV
Audio codecs
-
1x 200MP, 2x 25MP
Max camera resolution
-
UFS 3.0, UFS 3.1
Storage type
-
8K at 30FPS, 4K at 120FPS
Video capture
-
H.264, H.265, VP8, VP9
Video codecs
-
8K at 30FPS
Video playback
-
10 W
TDP
-
ARMv8.4-A
Instruction set
-
Hexagon 780
Neural processor (NPU)
-

Benchmarks

Geekbench 6 Single Core
Snapdragon 888
1481 +5%
Kirin 9010
1413
Geekbench 6 Multi Core
Snapdragon 888
3794
Kirin 9010
4560 +20%