MediaTek Dimensity 6400
vs
HiSilicon Kirin 9010

vs

SoC Comparison Result

Below are the results of a comparison of MediaTek Dimensity 6400 and HiSilicon Kirin 9010 mobile processors based on key performance characteristics, as well as power consumption and much more.

Advantages

  • Higher Technology: 6 nm (6 nm vs 7 nm)
  • Higher Frequency: 2500 MHz (2500 MHz vs 2300 MHz)
  • Newer Launch Date: February 2025 (February 2025 vs April 2024)

Basic

MediaTek
Label Name
HiSilicon
February 2025
Launch Date
April 2024
SmartPhone Mid range
Platform
SmartPhone Flagship
TSMC
Manufacturing
SMIC
Dimensity 6400
Model Name
Kirin 9010
2x 2.5 GHz – Cortex-A766x 2 GHz – Cortex-A55
Architecture
2x 2.3 GHz – TaiShan V121
4x 1.55 GHz – TaiShan V121
6x 2.18 GHz – Cortex-A510
8
Cores
12
6 nm
Technology
7 nm
2500 MHz
Frequency
2300 MHz

GPU Specifications

Mali-G57 MP2
GPU name
Maleoon 910
-
GPU frequency
750 MHz
64
Shading units
-
2.0
OpenCL version
-
1.3
Vulkan version
-
2520 x 1080
Max display resolution
-
12
DirectX version
-

Connectivity

Up to 3300 Mbps
Download speed
-
Yes
5G support
-
5.4
Bluetooth
-
5
Wi-Fi
-
GPS, GLONASS, Beidou, Galileo, QZSS, NAVIC
Navigation
-

Memory Specifications

LPDDR4X
Memory type
-
2133 MHz
Memory frequency
2750 MHz
2x 16 Bit
Memory Bus
4x 16 Bit

Miscellaneous

1 MB
L2 Cache
-
2 MB
L3 cache
-
- AAC LC - FLAC - HE-AACv1 - HE-AACv2 - MP3
Audio codecs
-
1x 108MP, 2x 16MP
Max camera resolution
-
UFS 2.2
Storage type
-
2K at 30FPS
Video capture
-
- H.264 - H.265 - VP9
Video codecs
-
2K at 30FPS
Video playback
-
ARMv8.2-A
Instruction set
-
Yes
Neural processor (NPU)
-

Benchmarks

Geekbench 6 Single Core
Dimensity 6400
819
Kirin 9010
1413 +73%
Geekbench 6 Multi Core
Dimensity 6400
2116
Kirin 9010
4560 +116%
AnTuTu 10
Dimensity 6400
437112
Kirin 9010
959921 +120%