HiSilicon Kirin 9050 Pro
vs
MediaTek Dimensity 8500

vs

SoC Comparison Result

Below are the results of a comparison of HiSilicon Kirin 9050 Pro and MediaTek Dimensity 8500 mobile processors based on key performance characteristics, as well as power consumption and much more.

Advantages

  • Newer Launch Date: September 2026 (September 2026 vs January 2026)
  • Higher Frequency: 3400 MHz (3100 MHz vs 3400 MHz)

Basic

HiSilicon
Label Name
MediaTek
September 2026
Launch Date
January 2026
SmartPhone Flagship
Platform
SmartPhone Mid range
SMIC
Manufacturing
TSMC
HiSilicon Kirin 9050 Pro
Model Name
Dimensity 8500
1x 3.1 GHz, 2x 2.7 GHz, 4x 2.2 GHz, 2x 1.75 GHz
Architecture
1x 3.4 GHz – Cortex-A725, 3x 3.2 GHz – Cortex-A725, 4x 2.2 GHz – Cortex-A725
9
Cores
8
-
Technology
4 nm
3100 MHz
Frequency
3400 MHz

GPU Specifications

Maleoon 955
GPU name
Mali-G720 MС8
1050 MHz
GPU frequency
-
-
Shading units
128
6
Execution units
-
-
OpenCL version
3.2
-
Vulkan version
1.3
-
Max display resolution
2960 x 1440

Connectivity

Yes
5G support
Yes
Bluetooth 6.0
Bluetooth
5.4
Wi-Fi 7
Wi-Fi
Wi-Fi 6E (a/b/g/n/ac/ax)
GPS, GLONASS, BeiDou, Galileo, QZSS, SBAS, NavIC
Navigation
GPS, GLONASS, Beidou, Galileo, QZSS, NAVIC

Memory Specifications

-
Memory type
LPDDR5X
-
Memory frequency
4800 MHz
-
Memory Bus
4x 16 Bit

Miscellaneous

-
Audio codecs
- AAC LC - FLAC - HE-AACv1 - HE-AACv2 - MP3
-
Max camera resolution
1x 320MP, 3x 32MP
-
Storage type
UFS 4 + MCQ
-
Video capture
4K at 60FPS
-
Video codecs
- H.264 - H.265 - AV1 - VP9
-
Video playback
4K at 60FPS
-
Instruction set
ARMv9.2-A
Da Vinci
Neural processor (NPU)
MediaTek NPU 880

Benchmarks

Geekbench 6 Single Core
Kirin 9050 Pro
1636
Dimensity 8500
1693 +3%
Geekbench 6 Multi Core
Kirin 9050 Pro
5775
Dimensity 8500
6897 +19%
AntuTu 11
Kirin 9050 Pro
1902468
Dimensity 8500
2120347 +11%