HiSilicon Kirin 9010s
vs
MediaTek Helio G200

vs

SoC Comparison Result

Below are the results of a comparison of HiSilicon Kirin 9010s and MediaTek Helio G200 mobile processors based on key performance characteristics, as well as power consumption and much more.

Advantages

  • Newer Launch Date: July 2025 (July 2025 vs May 2025)
  • Higher Technology: 6 nm (7 nm vs 6 nm)

Basic

HiSilicon
Label Name
MediaTek
July 2025
Launch Date
May 2025
SmartPhone Flagship
Platform
SmartPhone Mid range
-
Manufacturing
TSMC
Kirin 9010s
Model Name
Helio G200
2 cores x 2.5GHz + 6 cores x 2.05GHz + 4 cores x 1.50GHz
Architecture
2x 2.2 GHz – Cortex-A76, 6x 2 GHz – Cortex-A55
12
Cores
8
7 nm
Technology
6 nm
-
Frequency
2200 MHz

GPU Specifications

-
GPU name
Mali-G57 MP2
-
GPU frequency
1100 MHz
-
FLOPS
0.1408 TFLOPS
-
Shading units
32
-
OpenCL version
2.0
-
Vulkan version
1.3
-
Max display resolution
2520 x 1080
-
DirectX version
12

Connectivity

-
Download speed
Up to 650 Mbps
Yes
4G support
LTE Cat. 13
-
5G support
No
Bluetooth 5.2, поддержка BLE, SBC, AAC, LDAC и L2HC.
Bluetooth
5.4
802.11a/b/g/n/ac/ax/be, 2 × 2 MIMO, EHT160
Wi-Fi
5
-
Navigation
GPS, GLONASS, Beidou, Galileo, QZSS, NAVIC

Memory Specifications

-
Memory type
LPDDR4X
-
Memory frequency
2133 MHz
-
Memory Bus
2x 16 Bit

Miscellaneous

-
Audio codecs
- AAC
- AIFF
- CAF
- MP3
- MP4
- WAV
-
Max camera resolution
1x 200MP, 2x 16MP
-
Storage type
UFS 2.2
-
Video capture
2K at 30FPS, 1K at 60FPS
-
Video codecs
- H.264
- H.265
- VP9
-
Video playback
2K at 30FPS, 1080p at 60FPS
-
Instruction set
ARMv8.2-A
-
Neural processor (NPU)
Yes

Benchmarks

Geekbench 6 Single Core
Kirin 9010s
1442 +91%
Helio G200
755
Geekbench 6 Multi Core
Kirin 9010s
4443 +118%
Helio G200
2038