HiSilicon Kirin 9010s
vs
MediaTek Dimensity 8500
vs
SoC Comparison Result
Below are the results of a comparison of
HiSilicon Kirin 9010s
and
MediaTek Dimensity 8500
mobile processors based on key performance characteristics, as well as power consumption and much more.
Advantages
- Higher Technology: 4 nm (7 nm vs 4 nm)
- Newer Launch Date: January 2026 (July 2025 vs January 2026)
Basic
HiSilicon
Label Name
MediaTek
July 2025
Launch Date
January 2026
SmartPhone Flagship
Platform
SmartPhone Mid range
-
Manufacturing
TSMC
Kirin 9010s
Model Name
Dimensity 8500
2 cores x 2.5GHz + 6 cores x 2.05GHz + 4 cores x 1.50GHz
Architecture
1x 3.4 GHz – Cortex-A725, 3x 3.2 GHz – Cortex-A725, 4x 2.2 GHz – Cortex-A725
12
Cores
8
7 nm
Technology
4 nm
-
Frequency
3400 MHz
GPU Specifications
-
GPU name
Mali-G720 MС8
-
Shading units
128
-
OpenCL version
3.2
-
Vulkan version
1.3
-
Max display resolution
2960 x 1440
Connectivity
Yes
4G support
-
-
5G support
Yes
Bluetooth 5.2, поддержка BLE, SBC, AAC, LDAC и L2HC.
Bluetooth
5.4
802.11a/b/g/n/ac/ax/be, 2 × 2 MIMO, EHT160
Wi-Fi
Wi-Fi 6E (a/b/g/n/ac/ax)
-
Navigation
GPS, GLONASS, Beidou, Galileo, QZSS, NAVIC
Memory Specifications
-
Memory type
LPDDR5X
-
Memory frequency
4800 MHz
-
Memory Bus
4x 16 Bit
Miscellaneous
-
Audio codecs
- AAC LC - FLAC - HE-AACv1 - HE-AACv2 - MP3
-
Max camera resolution
1x 320MP, 3x 32MP
-
Storage type
UFS 4 + MCQ
-
Video capture
4K at 60FPS
-
Video codecs
- H.264 - H.265 - AV1 - VP9
-
Video playback
4K at 60FPS
-
Instruction set
ARMv9.2-A
-
Neural processor (NPU)
MediaTek NPU 880
Benchmarks
Geekbench 6 Single Core
Kirin 9010s
1442
Dimensity 8500
1693
+17%
Geekbench 6 Multi Core
Kirin 9010s
4443
Dimensity 8500
6897
+55%
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