HiSilicon Kirin 9010s vs Qualcomm Snapdragon 8 Gen 3
SoC Comparison Result
Below are the results of a comparison of
HiSilicon Kirin 9010s
and
Qualcomm Snapdragon 8 Gen 3
mobile processors based on key performance characteristics, as well as power consumption and much more.
Advantages
- Newer Launch Date: July 2025 (July 2025 vs October 2023)
- Higher Technology: 4 nm (7 nm vs 4 nm)
Basic
HiSilicon
Label Name
Qualcomm
July 2025
Launch Date
October 2023
SmartPhone Flagship
Platform
SmartPhone Flagship
-
Manufacturing
TSMC
Kirin 9010s
Model Name
SM8650-AB
2 cores x 2.5GHz + 6 cores x 2.05GHz + 4 cores x 1.50GHz
Architecture
1x 3.3 GHz – Cortex-X4 5x (3x3.2 GHz/2x3.0GHz) – Cortex-A720 2x 2.3 GHz – Cortex-A520
12
Cores
8
7 nm
Technology
4 nm
-
Frequency
3300 MHz
GPU Specifications
-
GPU name
Adreno 750
-
GPU frequency
770 MHz
-
OpenCL version
3.0 FP
-
Max display resolution
4K @ 60 Hz, QHD+ @ 144 Hz
Connectivity
Yes
4G support
LTE Cat. 24
-
5G support
Yes
Bluetooth 5.2, поддержка BLE, SBC, AAC, LDAC и L2HC.
Bluetooth
5.4
802.11a/b/g/n/ac/ax/be, 2 × 2 MIMO, EHT160
Wi-Fi
7
-
Navigation
GPS, GLONASS, Beidou, Galileo, QZSS, NAVIC
Memory Specifications
-
Memory type
LPDDR5X
-
Memory frequency
4800 MHz
-
Memory Bus
4x 16 Bit
Miscellaneous
-
Neural processor (NPU)
Hexagon
-
Audio codecs
AAC, AIFF, CAF, MP3, MP4, WAV
-
Max camera resolution
1x 200MP
-
Storage type
UFS 4.0
-
Video capture
8K at 30FPS, 4K at 120FPS
-
Video codecs
H.264, H.265, AV1, VP8, VP9
-
Video playback
8K at 30FPS, 4K at 120FPS
-
Instruction set
ARMv9
Benchmarks
Geekbench 6 Single Core
Kirin 9010s
1442
Snapdragon 8 Gen 3
2192
+52%
Geekbench 6 Multi Core
Kirin 9010s
4443
Snapdragon 8 Gen 3
7085
+59%
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