Advantages
- Higher Technology: 3 nm (3 nm vs 7 nm)
- Newer Launch Date: September 2025 (September 2025 vs July 2025)
Basic
MediaTek
Label Name
HiSilicon
September 2025
Launch Date
July 2025
SmartPhone Flagship
Platform
SmartPhone Flagship
TSMC
Manufacturing
-
-
Model Name
Kirin 9010s
1x 4.21 GHz – C1-Ultra, 3x 3.5 GHz – C1-Premium, 4x 2.7 GHz – C1-Pro
Architecture
2 cores x 2.5GHz + 6 cores x 2.05GHz + 4 cores x 1.50GHz
8
Cores
12
3 nm
Technology
7 nm
4210
Frequency
-
GPU Specifications
GPU Arm Mali-G1 Ultra MC12
GPU name
-
1750 MHz
GPU frequency
-
128
Shading units
-
WQHD+ 180Hz
Max display resolution
-
Connectivity
Yes
4G support
Yes
Yes
5G support
-
6.0
Bluetooth
Bluetooth 5.2, поддержка BLE, SBC, AAC, LDAC и L2HC.
7
Wi-Fi
802.11a/b/g/n/ac/ax/be, 2 × 2 MIMO, EHT160
GPS, GLONASS, Beidou, Galileo, QZSS, NAVIC
Navigation
-
Memory Specifications
LPDDR5X
Memory type
-
5333 MHz
Memory frequency
-
4x 16 Bit
Memory Bus
-
Miscellaneous
2MB/1MB/512KB
L2 Cache
-
- AAC LC
- FLAC
- HE-AACv1
- HE-AACv2
- MP3
- FLAC
- HE-AACv1
- HE-AACv2
- MP3
Audio codecs
-
320 MP
Max camera resolution
-
8K at 60FPS, 4K at 120FPS
Video capture
-
- H.264
- H.265
- AV1
- VP9
- H.265
- AV1
- VP9
Video codecs
-
8K at 60FPS, 4K at 120FPS
Video playback
-
ARMv9.3
Instruction set
-
MediaTek NPU 990
Neural processor (NPU)
-
Benchmarks
Geekbench 6 Single Core
Dimensity 9500
4007
+178%
Kirin 9010s
1442
Geekbench 6 Multi Core
Dimensity 9500
11217
+152%
Kirin 9010s
4443
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<a href="https://cputronic.com/soc/compare/mediatek-dimensity-9500-vs-hisilicon-kirin-9010s" target="_blank">MediaTek Dimensity 9500 vs HiSilicon Kirin 9010s</a>