HiSilicon Kirin 9010s
vs
MediaTek Dimensity 9400
vs
SoC Comparison Result
Below are the results of a comparison of
HiSilicon Kirin 9010s
and
MediaTek Dimensity 9400
mobile processors based on key performance characteristics, as well as power consumption and much more.
Advantages
- Newer Launch Date: July 2025 (July 2025 vs November 2024)
- Higher Technology: 3 nm (7 nm vs 3 nm)
Basic
HiSilicon
Label Name
MediaTek
July 2025
Launch Date
November 2024
SmartPhone Flagship
Platform
SmartPhone Flagship
-
Manufacturing
TSMC
Kirin 9010s
Model Name
Dimensity 9400
2 cores x 2.5GHz + 6 cores x 2.05GHz + 4 cores x 1.50GHz
Architecture
1x 3.4 GHz – Cortex-X5
3x 2.96 GHz – Cortex-X4
4x 2.27 GHz – Cortex-A730
3x 2.96 GHz – Cortex-X4
4x 2.27 GHz – Cortex-A730
12
Cores
8
7 nm
Technology
3 nm
-
Frequency
3400 MHz
GPU Specifications
-
GPU frequency
1300 MHz
-
Max display resolution
3840 x 2160
Connectivity
Yes
4G support
LTE Cat. 24
-
5G support
Yes
Bluetooth 5.2, поддержка BLE, SBC, AAC, LDAC и L2HC.
Bluetooth
5.4
802.11a/b/g/n/ac/ax/be, 2 × 2 MIMO, EHT160
Wi-Fi
7
-
Navigation
GPS, GLONASS, Beidou, Galileo, QZSS, NAVIC
Memory Specifications
-
Memory type
LPDDR5T
-
Memory frequency
4800 MHz
-
Memory Bus
4x 16 Bit
Miscellaneous
-
Audio codecs
AAC LC, MP3, HE-AACv1, HE-AACv2, FLAC
-
Max camera resolution
1x 320MP
-
Storage type
UFS 4.0
-
Video capture
8K at 30FPS, 4K at 120FPS
-
Video codecs
H.264, H.265, AV1, VP8, VP9
-
Video playback
8K at 30FPS, 4K at 120FPS
-
Instruction set
ARMv9.2-A
-
Neural processor (NPU)
Yes
Benchmarks
Geekbench 6 Single Core
Kirin 9010s
1442
Dimensity 9400
2832
+96%
Geekbench 6 Multi Core
Kirin 9010s
4443
Dimensity 9400
11974
+170%
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