HiSilicon Kirin 9010s
vs
Qualcomm Snapdragon 685
vs
SoC Comparison Result
Below are the results of a comparison of
HiSilicon Kirin 9010s
and
Qualcomm Snapdragon 685
mobile processors based on key performance characteristics, as well as power consumption and much more.
Advantages
- Newer Launch Date: July 2025 (July 2025 vs March 2023)
- Higher Technology: 6 nm (7 nm vs 6 nm)
Basic
HiSilicon
Label Name
Qualcomm
July 2025
Launch Date
March 2023
SmartPhone Flagship
Platform
SmartPhone Low end
-
Manufacturing
TSMC
Kirin 9010s
Model Name
SM6225-AD
2 cores x 2.5GHz + 6 cores x 2.05GHz + 4 cores x 1.50GHz
Architecture
4x 2.8 GHz – Cortex-A734x 1.9 GHz – Cortex-A53
12
Cores
8
7 nm
Technology
6 nm
-
Frequency
2800 MHz
GPU Specifications
-
GPU name
Adreno 610
-
GPU frequency
950 MHz
-
FLOPS
0.2432 TFLOPS
-
Shading units
128
-
Execution units
1
-
OpenCL version
2.0
-
Vulkan version
1.1
-
Max display resolution
2520 x 1080
-
DirectX version
12.1
Connectivity
-
Download speed
Up to 390 Mbps
Yes
4G support
LTE Cat. 13
-
5G support
No
Bluetooth 5.2, поддержка BLE, SBC, AAC, LDAC и L2HC.
Bluetooth
5.2
802.11a/b/g/n/ac/ax/be, 2 × 2 MIMO, EHT160
Wi-Fi
5
-
Navigation
GPS, GLONASS, Beidou, Galileo, QZSS, NAVIC
Memory Specifications
-
Memory type
LPDDR4X
-
Memory frequency
2133 MHz
-
Memory Bus
2x 16 Bit
Miscellaneous
-
Audio codecs
AIFF, CAF, MP3, MP4, WAV
-
Max camera resolution
1x 108MP, 2x 16MP
-
Storage type
UFS 2.2
-
Video capture
1K at 60FPS
-
Video codecs
H.264, H.265, VP8, VP9
-
Video playback
1080p at 60FPS
-
Instruction set
ARMv8.2-A
-
Neural processor (NPU)
Hexagon 686
Benchmarks
Geekbench 6 Single Core
Kirin 9010s
1442
+204%
Snapdragon 685
475
Geekbench 6 Multi Core
Kirin 9010s
4443
+193%
Snapdragon 685
1517
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