HiSilicon Kirin 9010s
vs
Qualcomm Snapdragon 7 Plus Gen 2
vs
SoC Comparison Result
Below are the results of a comparison of
HiSilicon Kirin 9010s
and
Qualcomm Snapdragon 7 Plus Gen 2
mobile processors based on key performance characteristics, as well as power consumption and much more.
Advantages
- Newer Launch Date: July 2025 (July 2025 vs March 2023)
- Higher Technology: 4 nm (7 nm vs 4 nm)
Basic
HiSilicon
Label Name
Qualcomm
July 2025
Launch Date
March 2023
SmartPhone Flagship
Platform
SmartPhone Mid range
-
Manufacturing
TSMC
Kirin 9010s
Model Name
SM7475-AB
2 cores x 2.5GHz + 6 cores x 2.05GHz + 4 cores x 1.50GHz
Architecture
1x 2.91 GHz – Cortex-X2
3x 2.49 GHz – Cortex-A710
4x 1.8 GHz – Cortex-A510
3x 2.49 GHz – Cortex-A710
4x 1.8 GHz – Cortex-A510
12
Cores
8
7 nm
Technology
4 nm
-
Frequency
2910 MHz
-
Transistor count
10.2
GPU Specifications
-
GPU name
Adreno 725
-
GPU frequency
580 MHz
-
FLOPS
1.7817 TFLOPS
-
Shading units
768
-
Execution units
2
-
OpenCL version
2.0
-
Vulkan version
1.1
-
Max display resolution
3360 x 1600
-
DirectX version
12.1
Connectivity
Yes
4G support
LTE Cat. 24
-
5G support
Yes
Bluetooth 5.2, поддержка BLE, SBC, AAC, LDAC и L2HC.
Bluetooth
5.3
802.11a/b/g/n/ac/ax/be, 2 × 2 MIMO, EHT160
Wi-Fi
6
-
Navigation
GPS, GLONASS, Beidou, Galileo, QZSS, NAVIC
Memory Specifications
-
Memory type
LPDDR5
-
Memory frequency
3200 MHz
-
Memory Bus
2x 16 Bit
Miscellaneous
-
Neural processor (NPU)
Yes
-
L2 Cache
2 MB
-
Audio codecs
AAC, AIFF, CAF, MP3, MP4, WAV
-
Max camera resolution
1x 200MP
-
Storage type
UFS 3.1
-
Video capture
4K at 60FPS
-
Video codecs
H.264, H.265, VP8, VP9
-
Video playback
4K at 60FPS
-
TDP
6 W
-
Instruction set
ARMv9-A
Benchmarks
Geekbench 6 Single Core
Kirin 9010s
1442
Snapdragon 7 Plus Gen 2
1699
+18%
Geekbench 6 Multi Core
Kirin 9010s
4443
+1%
Snapdragon 7 Plus Gen 2
4419
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