HiSilicon Kirin 9010s
vs
MediaTek Dimensity 8100
vs
SoC Comparison Result
Below are the results of a comparison of
HiSilicon Kirin 9010s
and
MediaTek Dimensity 8100
mobile processors based on key performance characteristics, as well as power consumption and much more.
Advantages
- Newer Launch Date: July 2025 (July 2025 vs March 2022)
- Higher Technology: 5 nm (7 nm vs 5 nm)
Basic
HiSilicon
Label Name
MediaTek
July 2025
Launch Date
March 2022
SmartPhone Flagship
Platform
SmartPhone Flagship
-
Manufacturing
TSMC
Kirin 9010s
Model Name
MT6895Z/TCZA
2 cores x 2.5GHz + 6 cores x 2.05GHz + 4 cores x 1.50GHz
Architecture
4x 2.85 GHz – Cortex-A78
4x 2 GHz – Cortex-A55
4x 2 GHz – Cortex-A55
12
Cores
8
7 nm
Technology
5 nm
-
Frequency
2850 MHz
GPU Specifications
-
GPU name
Mali-G610 MP6
-
GPU frequency
860 MHz
-
FLOPS
1.309 TFLOPS
-
Execution units
6
-
OpenCL version
2.0
-
Vulkan version
1.3
-
Max display resolution
2960 x 1440
-
DirectX version
12
Connectivity
-
Download speed
Up to 4700 Mbps
Yes
4G support
LTE Cat. 21
-
5G support
Yes
Bluetooth 5.2, поддержка BLE, SBC, AAC, LDAC и L2HC.
Bluetooth
5.3
802.11a/b/g/n/ac/ax/be, 2 × 2 MIMO, EHT160
Wi-Fi
6
-
Navigation
GPS, GLONASS, Beidou, Galileo, QZSS, NAVIC
Memory Specifications
-
Memory type
LPDDR5
-
Memory frequency
3200 MHz
-
Memory Bus
4x 16 Bit
Miscellaneous
-
Audio codecs
AAC LC, MP3, HE-AACv1, HE-AACv2, FLAC
-
Max camera resolution
1x 200MP
-
Storage type
UFS 3.1
-
Video capture
4K at 60FPS
-
Video codecs
H.264, H.265, AV1, VP9
-
Video playback
4K at 60FPS
-
TDP
6 W
-
Instruction set
ARMv8.2-A
-
Neural processor (NPU)
Yes
Benchmarks
Geekbench 6 Single Core
Kirin 9010s
1442
+26%
Dimensity 8100
1141
Geekbench 6 Multi Core
Kirin 9010s
4443
+22%
Dimensity 8100
3640
Related SoC Comparisons
Share in social media
Or Link To Us
<a href="https://cputronic.com/soc/compare/hisilicon-kirin-9010s-vs-mediatek-dimensity-8100" target="_blank">HiSilicon Kirin 9010s vs MediaTek Dimensity 8100</a>