MediaTek Dimensity 7060

MediaTek Dimensity 7060 — 6 nm octa-core mid-range SoC

MediaTek Dimensity 7060 is a mobile system-on-chip for mid-range smartphones. The CPU configuration comprises 2× Cortex-A78 and 6× Cortex-A55, with peak frequency up to 2.6 GHz on the performance cores. The chip is manufactured on TSMC’s 6 nm process and integrates a 5G modem.

Key specifications

• Process & foundry: 6 nm, TSMC

• CPU: 2× Cortex-A78 @ 2.6 GHz + 6× Cortex-A55 @ 2.0 GHz

• Memory: LPDDR5

• Storage: UFS up to 3.1

• Displays: up to 2520×1080

• Video & codecs: recording/playback up to 4K @ 30 fps; hardware H.264/H.265 (decode/encode), VP9 (decode)

• Cellular: 5G (sub-6), LTE Cat.18

• Wireless: Wi-Fi 6, Bluetooth 5.2

• Navigation: GPS, GLONASS, BeiDou, Galileo, QZSS, NavIC

Architecture and process

The 2× Cortex-A78 plus 6× Cortex-A55 layout targets a balance of performance and efficiency. The 6 nm TSMC process helps maintain a moderate thermal budget within the smartphone form factor.

Performance

Typical synthetic benchmarks indicate mid-range positioning:

• Geekbench 6: ~1000 (single-core) and ~2400–2460 (multi-core)

• AnTuTu v10: around ~424,000
  Actual scores depend on device implementation and firmware.

Memory, multimedia, and displays

The memory controller supports LPDDR5, and storage connects via UFS up to 3.1. The video subsystem provides hardware encode/decode for H.264/H.265 and VP9 decode, with limits up to 4K @ 30 fps. The display controller targets FHD+ panels up to 2520×1080.

Connectivity and wireless

The integrated modem supports 5G (sub-6) and LTE Cat.18. Wireless connectivity includes Wi-Fi 6 and Bluetooth 5.2. The navigation block supports major global GNSS constellations, including NavIC.

Conclusion

Dimensity 7060 combines TSMC’s 6 nm process, a “2+6” CPU configuration, LPDDR5 and UFS 3.1 support, modern 5G/Wi-Fi 6/BT 5.2 connectivity, and video capabilities up to 4K @ 30 fps. The feature set makes it a practical foundation for mid-range devices.