Advantages
- Higher Technology: 4 nm (4 nm vs 5 nm)
- Higher Memory Type: LPDDR5X-8448 (LPDDR5X-8448 vs LPDDR4X-4266)
- Newer Launch Date: January 2025 (January 2025 vs November 2020)
Basic
Qualcomm
Label Name
Apple
January 2025
Launch Date
November 2020
Laptop
Platform
Laptop
X1-26-100
Model Name
?
The Intel processor number is just one of several factors - along with processor brand, system configurations, and system-level benchmarks - to be considered when choosing the right processor for your computing needs.
M1
Snapdragon X
Code Name
Icestorm and Firestorm
CPU Specifications
8
Total Cores
?
Cores is a hardware term that describes the number of independent central processing units in a single computing component (die or chip).
8
8
Total Threads
?
Where applicable, Intel® Hyper-Threading Technology is only available on Performance-cores.
8
8
Performance-cores
8
2.98 GHz
Performance-core Base Frequency
2.1 GHz
-
Performance-core Max Turbo Frequency
?
Maximum P-core turbo frequency derived from Intel® Turbo Boost Technology.
3.2 GHz
-
L1 Cache
192K per core
1536 K per core
L2 Cache
12MB shared
6 MB shared
L3 Cache
-
29
Multiplier
-
No
Unlocked Multiplier
-
Custom
CPU Socket
?
The socket is the component that provides the mechanical and electrical connections between the processor and motherboard.
Apple M-Socket
4 nm
Technology
?
Lithography refers to the semiconductor technology used to manufacture an integrated circuit, and is reported in nanometer (nm), indicative of the size of features built on the semiconductor.
5 nm
30
TDP
15 W
4.0
PCIe Version
?
PCI Express is a high-speed serial computer expansion bus standard used for connecting high-speed components, replacing older standards such as AGP, PCI, and PCI-X. It has gone through multiple revisions and improvements since its initial release. PCIe 1.0 was first introduced in 2002, and in order to meet the growing demand for higher bandwidth, subsequent versions have been released over time.
-
ARMv9
Instruction Set
?
The instruction set is a hard program stored inside the CPU that guides and optimizes CPU operations. With these instruction sets, the CPU can run more efficiently. There are many manufacturers that design CPUs, which results in different instruction sets, such as the 8086 instruction set for the Intel camp and the RISC instruction set for the ARM camp. x86, ARM v8, and MIPS are all codes for instruction sets. Instruction sets can be extended; for example, x86 added 64-bit support to create x86-64. Manufacturers developing CPUs that are compatible with a certain instruction set need authorization from the instruction set patent holder. A typical example is Intel authorizing AMD, enabling the latter to develop CPUs compatible with the x86 instruction set.
-
Memory Specifications
LPDDR5X-8448
Memory Type
?
Intel® processors come in four different types: Single Channel, Dual Channel, Triple Channel, and Flex Mode. Maximum supported memory speed may be lower when populating multiple DIMMs per channel on products that support multiple memory channels.
LPDDR4X-4266
64 GB
Max Memory Size
?
Max memory size refers to the maximum memory capacity supported by the processor.
16GB
8
Memory Channels
?
The number of memory channels refers to the bandwidth operation for real world application.
2
135 GB/s
Max Memory Bandwidth
?
Max Memory bandwidth is the maximum rate at which data can be read from or stored into a semiconductor memory by the processor (in GB/s).
-
No
ECC Memory Support
-
GPU Specifications
true
Integrated Graphics Model
?
An integrated GPU refers to the graphics core that is integrated into the CPU processor. Leveraging the processor's powerful computational capabilities and intelligent power efficiency management, it delivers outstanding graphics performance and a smooth application experience at a lower power consumption.
True
280 MHz
GPU Base Frequency
-
1107 MHz
GPU Max Dynamic Frequency
-
3
Execution Units
?
The Execution Unit is the foundational building block of Intel’s graphics architecture. Execution Units are compute processors optimized for simultaneous Multi-Threading for high throughput compute power.
-
2.27 TFLOPS
Graphics Performance
-
Benchmarks
Cinebench R23 Single Core
Snapdragon X X1-26-100
955
Apple M1
1530
+60%
Cinebench R23 Multi Core
Snapdragon X X1-26-100
7038
Apple M1
7571
+8%
Geekbench 6 Single Core
Snapdragon X X1-26-100
2120
Apple M1
2318
+9%
Geekbench 6 Multi Core
Snapdragon X X1-26-100
10339
+27%
Apple M1
8142
Cinebench 2024 Single Core
Snapdragon X X1-26-100
94
Apple M1
110
+17%
Cinebench 2024 Multi Core
Snapdragon X X1-26-100
659
+27%
Apple M1
519
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