Home / CPU Comparison / Qualcomm Snapdragon X X1-26-100 or AMD Ryzen 3 5300U: What's better?

Qualcomm Snapdragon X X1-26-100

vs

AMD Ryzen 3 5300U

CPU Comparison Result

Below are the results of a comparison of Qualcomm Snapdragon X X1-26-100 and AMD Ryzen 3 5300U processors based on key performance characteristics, as well as power consumption and much more.

Advantages

Qualcomm Snapdragon X X1-26-100

More Total Cores: 8 (8 vs 4)
Higher Technology: 4nm (4nm vs TSMC 7nm FinFET)
Higher Memory Type: LPDDR5x (LPDDR5x vs DDR4 - Up to 3200 MT/s, LPDDR4 - Up to 4266 MT/s)
Newer Launch Date: January 2025 (January 2025 vs January 2021)

Basic

Qualcomm

Label Name

AMD

January 2025

Launch Date

January 2021

Laptop

Platform

Laptop

64-bit architecture

CPU Architecture

Qualcomm Oryon CPU

CPU Name

X1-26-100

Part Number

Qualcomm Snapdragon X X1-26-100

Model Name

The Intel processor number is just one of several factors - along with processor brand, system configurations, and system-level benchmarks - to be considered when choosing the right processor for your computing needs.

Code Name

Lucienne

OS Support

Windows 11 - 64-Bit Edition, Windows 10 - 64-Bit Edition, RHEL x86 64-Bit, Ubuntu x86 64-Bit *Operating System (OS) support will vary by manufacturer.

CPU Specifications

None

Boost Frequency

Total Cores

Cores is a hardware term that describes the number of independent central processing units in a single computing component (die or chip).

Total Threads

Where applicable, Intel® Hyper-Threading Technology is only available on Performance-cores.

Basic Frequency

2.6GHz

Max Turbo Frequency

Max Turbo Frequency is the maximum single-core frequency at which the processor is capable of operating using Intel® Turbo Boost Technology and, if present, Intel® Turbo Boost Max Technology 3.0 and Intel® Thermal Velocity Boost. Frequency is typically measured in gigahertz (GHz), or billion cycles per second.

Up to 3.8GHz

L2 Cache

2MB

L3 Cache

4MB

30 MB

Cache

CPU Cache is an area of fast memory located on the processor. Intel® Smart Cache refers to the architecture that allows all cores to dynamically share access to the last level cache.

CPU Socket

The socket is the component that provides the mechanical and electrical connections between the processor and motherboard.

FP6

4nm

Technology

Lithography refers to the semiconductor technology used to manufacture an integrated circuit, and is reported in nanometer (nm), indicative of the size of features built on the semiconductor.

TSMC 7nm FinFET

TDP

15W

Max. Operating Temperature

Junction Temperature is the maximum temperature allowed at the processor die.

105°C

PCI Express Version

PCI Express Revision is the supported version of the PCI Express standard. Peripheral Component Interconnect Express (or PCIe) is a high-speed serial computer expansion bus standard for attaching hardware devices to a computer. The different PCI Express versions support different data rates.

PCIe® 3.0

Memory Specifications

16-bit x 8 channels

Memory Bus Width

LPDDR5x

Memory Type

Intel® processors come in four different types: Single Channel, Dual Channel, Triple Channel, and Flex Mode. Maximum supported memory speed may be lower when populating multiple DIMMs per channel on products that support multiple memory channels.

DDR4 - Up to 3200 MT/s, LPDDR4 - Up to 4266 MT/s

64 GB

Max Memory Size

Max memory size refers to the maximum memory capacity supported by the processor.

Memory Channels

The number of memory channels refers to the bandwidth operation for real world application.

135 GB/s

Max Memory Bandwidth

Max Memory bandwidth is the maximum rate at which data can be read from or stored into a semiconductor memory by the processor (in GB/s).

8448 MT/s

Maximum Memory Speed

GPU Specifications

Adreno DPU

Display Processing Unit

DisplayPort 1.4

External Display Standard

Qualcomm Adreno GPU

GPU Name

3 displays up to UHD 60 Hz HDR10; 2 displays up to 5K 60 Hz or UHD 120 Hz

Max External Display Resolution

Up to QHD+ 120 Hz HDR10

Max On-Device Display Resolution

eDP v1.4b

On-Device Display Standard

4K 30 FPS 8-bit decode + 1080p 30 FPS encode; 1080p 60 FPS 10-bit decode + 1080p 30 FPS encode

Video Concurrency

4K 30 FPS 10-bit playback: HEVC, VP9, AV1; 4K 60 FPS 8-bit playback: H.264, HEVC

Video Decode

4K UHD 30 FPS 8-bit recording: H.264, HEVC, AV1

Video Encode

Adreno VPU

Video Processing Unit

Integrated Graphics Model

An integrated GPU refers to the graphics core that is integrated into the CPU processor. Leveraging the processor's powerful computational capabilities and intelligent power efficiency management, it delivers outstanding graphics performance and a smooth application experience at a lower power consumption.

AMD Radeon™ Graphics

Graphics Frequency

Graphics max dynamic frequency refers to the maximum opportunistic graphics render clock frequency (in MHz) that can be supported using Intel® HD Graphics with Dynamic Frequency feature.

1500 MHz

Graphics Core Count

1.7 TFLOPS

Graphics Performance