Qualcomm Snapdragon X X1-26-100
vs
Apple M2
vs
CPU Comparison Result
Below are the results of a comparison of
Qualcomm Snapdragon X X1-26-100
and
Apple M2
processors based on key performance characteristics, as well as power consumption and much more.
Advantages
- Higher Technology: 4nm (4nm vs 5 nm)
- Newer Launch Date: January 2025 (January 2025 vs June 2022)
Basic
Qualcomm
Label Name
Apple
January 2025
Launch Date
June 2022
Laptop
Platform
Laptop
64-bit architecture
CPU Architecture
Apple Avalanche + Apple Blizzard
Qualcomm Oryon CPU
CPU Name
Apple M2
X1-26-100
Part Number
-
Qualcomm Snapdragon X X1-26-100
Model Name
Apple M2
-
Foundry
TSMC
-
Generation
Apple M2 series
CPU Specifications
None
Boost Frequency
-
8
Total Cores
Cores is a hardware term that describes the number of independent central processing units in a single computing component (die or chip).
8
-
Total Threads
8
-
Performance-cores
4
-
Efficient-cores
4
-
Efficient-core Max Turbo Frequency
2.42 GHz
-
Instruction Set Extensions
NEON
-
Performance-core Max Turbo Frequency
3.48 GHz
-
Extended Instruction Set
ARMv8.6-A, NEON
-
L1 Cache
P-cores: 192 KB instruction + 128 KB data per core; E-cores: 128 KB instruction + 64 KB data per core
-
L2 Cache
P-core cluster: 16 MB; E-core cluster: 4 MB
-
L3 Cache
8 MB system level cache
30 MB
Cache
-
4nm
Technology
Lithography refers to the semiconductor technology used to manufacture an integrated circuit, and is reported in nanometer (nm), indicative of the size of features built on the semiconductor.
5 nm
-
Instruction Set
An instruction set architecture (ISA) defines the instructions a processor can execute. Common architectures include x86-64, ARM and RISC-V. The ISA determines software compatibility, while optional instruction extensions add specialized capabilities.
ARMv8.6-A
-
Transistor Count
20 billion
Memory Specifications
16-bit x 8 channels
Memory Bus Width
128-bit
LPDDR5x
Memory Type
Unified LPDDR5-6400
-
LPDDR5 Speed
LPDDR5-6400
64 GB
Max Memory Size
Max memory size refers to the maximum memory capacity supported by the processor.
24 GB
8
Memory Channels
The number of memory channels refers to the bandwidth operation for real world application.
-
135 GB/s
Max Memory Bandwidth
Max Memory bandwidth is the maximum rate at which data can be read from or stored into a semiconductor memory by the processor (in GB/s).
100 GB/s
8448 MT/s
Maximum Memory Speed
6400 MT/s
GPU Specifications
Adreno DPU
Display Processing Unit
-
DisplayPort 1.4
External Display Standard
Thunderbolt 3 / USB4 with DisplayPort
Qualcomm Adreno GPU
GPU Name
Apple M2 GPU
3 displays up to UHD 60 Hz HDR10; 2 displays up to 5K 60 Hz or UHD 120 Hz
Max External Display Resolution
Up to 6K 60Hz external display
Up to QHD+ 120 Hz HDR10
Max On-Device Display Resolution
-
eDP v1.4b
On-Device Display Standard
-
4K 30 FPS 8-bit decode + 1080p 30 FPS encode; 1080p 60 FPS 10-bit decode + 1080p 30 FPS encode
Video Concurrency
-
4K 30 FPS 10-bit playback: HEVC, VP9, AV1; 4K 60 FPS 8-bit playback: H.264, HEVC
Video Decode
H.264, HEVC, ProRes, ProRes RAW; up to 8K H.264 and HEVC decode; multiple 4K and 8K ProRes streams
4K UHD 30 FPS 8-bit recording: H.264, HEVC, AV1
Video Encode
H.264, HEVC, ProRes, ProRes RAW; up to 8K H.264 and HEVC decode
Adreno VPU
Video Processing Unit
Apple media engine with ProRes acceleration
-
GPU Max Dynamic Frequency
1398 MHz
-
Graphics Core Count
10
-
Number of Displays Supported
One external display up to 6K 60Hz
-
GPU APIs
Metal, OpenCL
1.7 TFLOPS
Graphics Performance
Up to 3.6 TFLOPS FP32
-
Media Engine
Hardware-accelerated H.264, HEVC, ProRes, and ProRes RAW
-
Video Decode Engines
1
-
Video Encode Engines
1
-
ProRes Encode/Decode Engines
1
-
OpenCL Support
OpenCL (Open Computing Language) is a multi-platform API (Application Programming Interface) for heterogeneous parallel programming.
Yes
AI Specifications
-
AI Engine
16-core Apple Neural Engine
Dual Micro NPU on the Qualcomm Sensing Hub
Micro NPU
-
-
Neural Engine Core Count
16
Qualcomm Hexagon NPU
NPU Name
Apple Neural Engine
45 TOPS
NPU Performance
15.8 TOPS
Connectivity
Bluetooth LE
Bluetooth Connection Technology
-
-
Bluetooth Support
Yes
Bluetooth 5.4
Bluetooth Version
Bluetooth 5.3
1000 MHz bandwidth mmWave, 300 MHz bandwidth sub-6 GHz
Cellular Bandwidth
-
10 Gbps
Cellular Peak Download Speed
-
3.5 Gbps
Cellular Peak Upload Speed
-
6 GHz, 5 GHz, 2.4 GHz
Wi-Fi Bands
-
-
Wi-Fi Standard
Wi-Fi 6 (802.11ax)
Qualcomm FastConnect 7800 Mobile Connectivity System
Wireless System
-
Interfaces and Ports
SD v3.0
SD Standard
-
-
Thunderbolt Support
Yes, Thunderbolt 3 up to 40 Gb/s
3x USB4 40 Gbps, 2x USB 3.2 Gen2x1, 1x eUSB2
USB Interface Type
-
USB 4.0
USB Version
USB4
-
USB4 Support
Yes, USB4 up to 40 Gb/s
Miscellaneous
Supported
Always Sensing
-
Qualcomm Aqstic audio technology, Qualcomm aptX Audio
Audio Technology
-
-
Hardware-Verified Secure Boot
Yes, Apple silicon secure boot chain of trust
Qualcomm Spectra ISP
Image Signal Processor
Apple image signal processor
-
Runtime Anti-Exploitation
Kernel Integrity Protection, Pointer Authentication Codes, Fast Permission Restrictions
Up to 36 MP
Single Camera Support
-
4K HDR video capture
Video Capture
-
Benchmarks
Cinebench R23 Single Core
Snapdragon X X1-26-100
973
Apple M2
1595
+64%
Cinebench R23 Multi Core
Snapdragon X X1-26-100
7294
Apple M2
8654
+19%
Geekbench 6 Single Core
Snapdragon X X1-26-100
2248
Apple M2
2597
+16%
Geekbench 6 Multi Core
Snapdragon X X1-26-100
11665
+20%
Apple M2
9707
Geekbench 5 Single Core
Snapdragon X X1-26-100
1576
Apple M2
1914
+21%
Geekbench 5 Multi Core
Snapdragon X X1-26-100
6244
Apple M2
8812
+41%
Passmark CPU Single Core
Snapdragon X X1-26-100
2869
Apple M2
3885
+35%
Passmark CPU Multi Core
Snapdragon X X1-26-100
16359
+5%
Apple M2
15654
Cinebench 2024 Single Core
Snapdragon X X1-26-100
96
Apple M2
120
+25%
Cinebench 2024 Multi Core
Snapdragon X X1-26-100
684
+23%
Apple M2
555
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