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AMD Ryzen 9 7845HX

About processor

The AMD Ryzen 9 7845HX is a powerhouse of a processor designed for high-performance laptop applications. With a total of 12 cores and 24 threads, the Ryzen 9 7845HX is capable of handling even the most demanding workloads with ease. The TSMC 5nm FinFET technology ensures efficient power usage and excellent thermal management, making it an ideal choice for portable devices. The integrated AMD Radeon™ 610M graphics provide solid visual performance for gaming and content creation, offering a well-rounded experience for users who require both CPU and GPU power. The 64MB of L3 cache further enhances the overall system responsiveness and speed, ensuring smooth multitasking and performance. In benchmark tests, the Ryzen 9 7845HX excels, with Geekbench 6 scores of 2638 for single-core performance and an impressive 13649 for multi-core performance. This demonstrates the processor's ability to handle both single-threaded and multi-threaded tasks with exceptional efficiency. Overall, the AMD Ryzen 9 7845HX is a top-of-the-line processor that delivers exceptional performance for high-end laptops, making it a great choice for professionals and enthusiasts who require powerful computing on the go.

Basic

Label Name

AMD

Platform

Laptop

Launch Date

January 2023

Code Name

Dragon Range

CPU Specifications

Total Cores

Cores is a hardware term that describes the number of independent central processing units in a single computing component (die or chip).

Total Threads

Where applicable, Intel® Hyper-Threading Technology is only available on Performance-cores.

Basic Frequency

3.0GHz

Max Turbo Frequency

Max Turbo Frequency is the maximum single-core frequency at which the processor is capable of operating using Intel® Turbo Boost Technology and, if present, Intel® Turbo Boost Max Technology 3.0 and Intel® Thermal Velocity Boost. Frequency is typically measured in gigahertz (GHz), or billion cycles per second.

Up to 5.2GHz

L1 Cache

764KB

L2 Cache

12MB

L3 Cache

64MB

CPU Socket

The socket is the component that provides the mechanical and electrical connections between the processor and motherboard.

FL1

Technology

Lithography refers to the semiconductor technology used to manufacture an integrated circuit, and is reported in nanometer (nm), indicative of the size of features built on the semiconductor.

TSMC 5nm FinFET

TDP

55W

Max. Operating Temperature

Junction Temperature is the maximum temperature allowed at the processor die.

100°C

PCI Express Version

PCI Express Revision is the supported version of the PCI Express standard. Peripheral Component Interconnect Express (or PCIe) is a high-speed serial computer expansion bus standard for attaching hardware devices to a computer. The different PCI Express versions support different data rates.

PCIe® 5.0

Memory Specifications

Memory Type

Intel® processors come in four different types: Single Channel, Dual Channel, Triple Channel, and Flex Mode. Maximum supported memory speed may be lower when populating multiple DIMMs per channel on products that support multiple memory channels.

DDR5

Memory Channels

The number of memory channels refers to the bandwidth operation for real world application.

GPU Specifications

Integrated Graphics Model

An integrated GPU refers to the graphics core that is integrated into the CPU processor. Leveraging the processor's powerful computational capabilities and intelligent power efficiency management, it delivers outstanding graphics performance and a smooth application experience at a lower power consumption.

AMD Radeon™ 610M

Graphics Frequency

Graphics max dynamic frequency refers to the maximum opportunistic graphics render clock frequency (in MHz) that can be supported using Intel® HD Graphics with Dynamic Frequency feature.

2200 MHz