AMD EPYC 7402P
About processor
The AMD EPYC 7402P processor is a powerhouse for server applications, with a total of 24 cores and 48 threads. This high core count allows for exceptional parallel processing and multi-threaded performance, making it a great choice for heavily multi-threaded workloads such as virtualization, database management, and data analytics.
The 128MB of L3 cache ensures that frequently accessed data is readily available, further boosting overall performance. With a TDP of 180W, this processor is designed to handle intensive workloads without compromising on efficiency.
In terms of real-world performance, the EPYC 7402P excels in both single-core and multi-core tasks. In the Geekbench 6 benchmarks, it achieved an impressive score of 1144 in single-core performance and 3606 in multi-core performance, showcasing its versatility and ability to handle a wide range of tasks with ease.
Overall, the AMD EPYC 7402P processor is a top-of-the-line choice for server applications, offering exceptional multi-threaded performance, ample L3 cache, and impressive benchmark scores. Whether used for virtualization, database management, or other server workloads, this processor is sure to deliver outstanding results.
Basic
Label Name
AMD
Platform
Server
Launch Date
August 2019
Code Name
Rome
CPU Specifications
Total Cores
?
Cores is a hardware term that describes the number of independent central processing units in a single computing component (die or chip).
24
Total Threads
?
Where applicable, Intel® Hyper-Threading Technology is only available on Performance-cores.
48
Basic Frequency
2.8GHz
Max Turbo Frequency
?
Max Turbo Frequency is the maximum single-core frequency at which the processor is capable of operating using Intel® Turbo Boost Technology and, if present, Intel® Turbo Boost Max Technology 3.0 and Intel® Thermal Velocity Boost. Frequency is typically measured in gigahertz (GHz), or billion cycles per second.
Up to 3.35GHz
L3 Cache
128MB
CPU Socket
?
The socket is the component that provides the mechanical and electrical connections between the processor and motherboard.
SP3
Technology
?
Lithography refers to the semiconductor technology used to manufacture an integrated circuit, and is reported in nanometer (nm), indicative of the size of features built on the semiconductor.
7 nm
TDP
180W
PCI Express Version
?
PCI Express Revision is the supported version of the PCI Express standard. Peripheral Component Interconnect Express (or PCIe) is a high-speed serial computer expansion bus standard for attaching hardware devices to a computer. The different PCI Express versions support different data rates.
PCIe 4.0 x128
Memory Specifications
Memory Type
?
Intel® processors come in four different types: Single Channel, Dual Channel, Triple Channel, and Flex Mode. Maximum supported memory speed may be lower when populating multiple DIMMs per channel on products that support multiple memory channels.
DDR4
Memory Channels
?
The number of memory channels refers to the bandwidth operation for real world application.
8
Bus Speed
Up to 3200MT/s
Benchmarks
Geekbench 6
Single Core
Score
1321
Geekbench 6
Multi Core
Score
12601
Geekbench 5
Single Core
Score
879
Geekbench 5
Multi Core
Score
1714
Passmark CPU
Single Core
Score
1971
Passmark CPU
Multi Core
Score
42899
Compared to Other CPU
Geekbench 6 Single Core
Geekbench 6 Multi Core
Geekbench 5 Single Core
Geekbench 5 Multi Core
Passmark CPU Single Core
Passmark CPU Multi Core