Qualcomm Snapdragon X X1 26 100
About processor
The Qualcomm Snapdragon X X1 26 100 processor emerges as a formidable contender in the laptop CPU market, harnessing advanced 4 nm technology to deliver both power and efficiency. Featuring an 8-core, 8-thread configuration, it operates at a strong base frequency of 2.98 GHz, ensuring swift performance for multitasking and demanding applications. The generous 6 MB L3 cache further enhances its ability to handle complex tasks with ease, minimizing latency and boosting overall responsiveness.
Benchmark performance underscores its capabilities, with Geekbench 6 scores of 2166 in single-core and 10,313 in multi-core tests. These results position the Snapdragon X X1 26 100 competitively against other leading processors, making it a reliable choice for both everyday computing and more intensive workloads. The 30 W TDP reflects a thoughtful balance between performance and energy efficiency, ideal for sleek, portable laptops that require long battery life without sacrificing speed.
However, the absence of detailed integrated graphics specifications leaves some uncertainty regarding its graphical performance, which could be a consideration for users with visual-intensive tasks. Overall, the Snapdragon X X1 26 100 stands out as a versatile and powerful processor, well-suited for modern laptops aiming to blend high performance with energy-conscious design.
Basic
Label Name
Qualcomm
Platform
Laptop
Launch Date
January 2025
Model Name
?
The Intel processor number is just one of several factors - along with processor brand, system configurations, and system-level benchmarks - to be considered when choosing the right processor for your computing needs.
X1-26-100
Code Name
Snapdragon X
CPU Specifications
Total Cores
?
Cores is a hardware term that describes the number of independent central processing units in a single computing component (die or chip).
8
Total Threads
?
Where applicable, Intel® Hyper-Threading Technology is only available on Performance-cores.
8
Performance-cores
8
Performance-core Base Frequency
2.98 GHz
L2 Cache
1536 K per core
L3 Cache
6 MB shared
Unlocked Multiplier
No
Multiplier
29
CPU Socket
?
The socket is the component that provides the mechanical and electrical connections between the processor and motherboard.
Custom
Technology
?
Lithography refers to the semiconductor technology used to manufacture an integrated circuit, and is reported in nanometer (nm), indicative of the size of features built on the semiconductor.
4 nm
TDP
30
PCIe Version
?
PCI Express is a high-speed serial computer expansion bus standard used for connecting high-speed components, replacing older standards such as AGP, PCI, and PCI-X. It has gone through multiple revisions and improvements since its initial release. PCIe 1.0 was first introduced in 2002, and in order to meet the growing demand for higher bandwidth, subsequent versions have been released over time.
4.0
Instruction Set
?
The instruction set is a hard program stored inside the CPU that guides and optimizes CPU operations. With these instruction sets, the CPU can run more efficiently. There are many manufacturers that design CPUs, which results in different instruction sets, such as the 8086 instruction set for the Intel camp and the RISC instruction set for the ARM camp. x86, ARM v8, and MIPS are all codes for instruction sets. Instruction sets can be extended; for example, x86 added 64-bit support to create x86-64. Manufacturers developing CPUs that are compatible with a certain instruction set need authorization from the instruction set patent holder. A typical example is Intel authorizing AMD, enabling the latter to develop CPUs compatible with the x86 instruction set.
ARMv9
Memory Specifications
Memory Type
?
Intel® processors come in four different types: Single Channel, Dual Channel, Triple Channel, and Flex Mode. Maximum supported memory speed may be lower when populating multiple DIMMs per channel on products that support multiple memory channels.
LPDDR5X-8448
Max Memory Size
?
Max memory size refers to the maximum memory capacity supported by the processor.
64 GB
Memory Channels
?
The number of memory channels refers to the bandwidth operation for real world application.
8
Max Memory Bandwidth
?
Max Memory bandwidth is the maximum rate at which data can be read from or stored into a semiconductor memory by the processor (in GB/s).
135 GB/s
ECC Memory Support
No
GPU Specifications
Integrated Graphics Model
?
An integrated GPU refers to the graphics core that is integrated into the CPU processor. Leveraging the processor's powerful computational capabilities and intelligent power efficiency management, it delivers outstanding graphics performance and a smooth application experience at a lower power consumption.
true
GPU Base Frequency
280 MHz
GPU Max Dynamic Frequency
1107 MHz
Execution Units
?
The Execution Unit is the foundational building block of Intel’s graphics architecture. Execution Units are compute processors optimized for simultaneous Multi-Threading for high throughput compute power.
3
Graphics Performance
2.27 TFLOPS
Benchmarks
Cinebench R23
Single Core
Score
955
Cinebench R23
Multi Core
Score
7038
Geekbench 6
Single Core
Score
2166
Geekbench 6
Multi Core
Score
10313
Cinebench 2024
Single Core
Score
94
Cinebench 2024
Multi Core
Score
659
Compared to Other CPU
Cinebench R23 Single Core
Cinebench R23 Multi Core
Geekbench 6 Single Core
Geekbench 6 Multi Core
Cinebench 2024 Single Core
Cinebench 2024 Multi Core