Qualcomm Snapdragon X X1-26-100
vs
Apple M1
vs
CPU Comparison Result
Below are the results of a comparison of
Qualcomm Snapdragon X X1-26-100
and
Apple M1
processors based on key performance characteristics, as well as power consumption and much more.
Advantages
- Higher Technology: 4nm (4nm vs 5 nm)
- Higher Memory Type: LPDDR5x (LPDDR5x vs Unified LPDDR4X-4266)
- Newer Launch Date: January 2025 (January 2025 vs November 2020)
Basic
Qualcomm
Label Name
Apple
January 2025
Launch Date
November 2020
Laptop
Platform
Laptop
64-bit architecture
CPU Architecture
Apple Firestorm + Apple Icestorm
Qualcomm Oryon CPU
CPU Name
Apple M1
X1-26-100
Part Number
T8103
Qualcomm Snapdragon X X1-26-100
Model Name
?
The Intel processor number is just one of several factors - along with processor brand, system configurations, and system-level benchmarks - to be considered when choosing the right processor for your computing needs.
Apple M1
-
Foundry
TSMC
CPU Specifications
None
Boost Frequency
-
-
Performance Cores
4
8
Total Cores
?
Cores is a hardware term that describes the number of independent central processing units in a single computing component (die or chip).
8
-
Total Threads
?
Where applicable, Intel® Hyper-Threading Technology is only available on Performance-cores.
8
-
Efficient-cores
4
-
Efficient-core Max Turbo Frequency
?
Maximum E-core turbo frequency derived from Intel® Turbo Boost Technology.
2.064 GHz
-
Instruction Set Extensions
NEON
-
Performance-core Max Turbo Frequency
?
Maximum P-core turbo frequency derived from Intel® Turbo Boost Technology.
3.204 GHz
-
Extended Instruction Set
ARMv8.4-A, NEON
-
L1 Cache
P-cores: 192 KB instruction + 128 KB data per core; E-cores: 128 KB instruction + 64 KB data per core
-
L2 Cache
P-core cluster: 12 MB; E-core cluster: 4 MB
30 MB
Cache
?
CPU Cache is an area of fast memory located on the processor. Intel® Smart Cache refers to the architecture that allows all cores to dynamically share access to the last level cache.
-
4nm
Technology
?
Lithography refers to the semiconductor technology used to manufacture an integrated circuit, and is reported in nanometer (nm), indicative of the size of features built on the semiconductor.
5 nm
-
Instruction Set
?
The instruction set is a hard program stored inside the CPU that guides and optimizes CPU operations. With these instruction sets, the CPU can run more efficiently. There are many manufacturers that design CPUs, which results in different instruction sets, such as the 8086 instruction set for the Intel camp and the RISC instruction set for the ARM camp. x86, ARM v8, and MIPS are all codes for instruction sets. Instruction sets can be extended; for example, x86 added 64-bit support to create x86-64. Manufacturers developing CPUs that are compatible with a certain instruction set need authorization from the instruction set patent holder. A typical example is Intel authorizing AMD, enabling the latter to develop CPUs compatible with the x86 instruction set.
ARMv8.4-A
-
Transistor Count
16 billion
Memory Specifications
16-bit x 8 channels
Memory Bus Width
128-bit
LPDDR5x
Memory Type
?
Intel® processors come in four different types: Single Channel, Dual Channel, Triple Channel, and Flex Mode. Maximum supported memory speed may be lower when populating multiple DIMMs per channel on products that support multiple memory channels.
Unified LPDDR4X-4266
64 GB
Max Memory Size
?
Max memory size refers to the maximum memory capacity supported by the processor.
16 GB
8
Memory Channels
?
The number of memory channels refers to the bandwidth operation for real world application.
2
135 GB/s
Max Memory Bandwidth
?
Max Memory bandwidth is the maximum rate at which data can be read from or stored into a semiconductor memory by the processor (in GB/s).
68.25 GB/s
8448 MT/s
Maximum Memory Speed
-
-
ECC Memory Supported
?
ECC Memory Supported indicates processor support for Error-Correcting Code memory. ECC memory is a type of system memory that can detect and correct common kinds of internal data corruption. Note that ECC memory support requires both processor and chipset support.
No
GPU Specifications
Adreno DPU
Display Processing Unit
-
DisplayPort 1.4
External Display Standard
-
-
GPU APIs
Metal, OpenCL
Qualcomm Adreno GPU
GPU Name
Apple M1 GPU
3 displays up to UHD 60 Hz HDR10; 2 displays up to 5K 60 Hz or UHD 120 Hz
Max External Display Resolution
-
Up to QHD+ 120 Hz HDR10
Max On-Device Display Resolution
-
-
Media Engine
Media encode and decode engines
eDP v1.4b
On-Device Display Standard
-
-
ProRes Encode/Decode Engines
No
4K 30 FPS 8-bit decode + 1080p 30 FPS encode; 1080p 60 FPS 10-bit decode + 1080p 30 FPS encode
Video Concurrency
-
4K 30 FPS 10-bit playback: HEVC, VP9, AV1; 4K 60 FPS 8-bit playback: H.264, HEVC
Video Decode
H.264, HEVC (H.265); multiple 4K video streams / up to 4K 60 fps depending on codec, bitrate and app
-
Video Decode Engines
1
4K UHD 30 FPS 8-bit recording: H.264, HEVC, AV1
Video Encode
H.264, HEVC (H.265); up to 4K 60 fps depending on profile, level and app
-
Video Encode Engines
1
Adreno VPU
Video Processing Unit
-
-
Graphics Core Count
8
1.7 TFLOPS
Graphics Performance
Up to 2.6 TFLOPS FP32
AI Specifications
-
AI Engine
16-core Apple Neural Engine
Dual Micro NPU on the Qualcomm Sensing Hub
Micro NPU
-
-
Neural Engine Core Count
16
Qualcomm Hexagon NPU
NPU Name
Apple Neural Engine
45 TOPS
NPU Performance
11 TOPS
Connectivity
Bluetooth LE
Bluetooth Connection Technology
-
Bluetooth 5.4
Bluetooth Version
-
1000 MHz bandwidth mmWave, 300 MHz bandwidth sub-6 GHz
Cellular Bandwidth
-
10 Gbps
Cellular Peak Download Speed
-
3.5 Gbps
Cellular Peak Upload Speed
-
6 GHz, 5 GHz, 2.4 GHz
Wi-Fi Bands
-
Qualcomm FastConnect 7800 Mobile Connectivity System
Wireless System
-
Interfaces and Ports
NVMe SSD over PCIe Gen 4
NVMe Support
-
SD v3.0
SD Standard
-
-
Thunderbolt Support
Yes, up to 40 Gbps
3x USB4 40 Gbps, 2x USB 3.2 Gen2x1, 1x eUSB2
USB Interface Type
-
USB 4.0
USB Version
USB4
-
USB4 Support
Yes, up to 40 Gbps
Miscellaneous
Supported
Always Sensing
-
Qualcomm Aqstic audio technology, Qualcomm aptX Audio
Audio Technology
-
-
Hardware-Verified Secure Boot
Yes, Apple silicon secure boot chain of trust
Qualcomm Spectra ISP
Image Signal Processor
Apple image signal processor
-
Runtime Anti-Exploitation
KIP, FPR, SCIP, PAC, PPL
-
Security Processor
Secure Enclave
Up to 36 MP
Single Camera Support
-
4K HDR video capture
Video Capture
-
Benchmarks
Cinebench R23 Single Core
Snapdragon X X1-26-100
973
Apple M1
1512
+55%
Cinebench R23 Multi Core
Snapdragon X X1-26-100
7294
Apple M1
7728
+6%
Geekbench 6 Single Core
Snapdragon X X1-26-100
2248
Apple M1
2347
+4%
Geekbench 6 Multi Core
Snapdragon X X1-26-100
11665
+40%
Apple M1
8341
Geekbench 5 Single Core
Snapdragon X X1-26-100
1576
Apple M1
1729
+10%
Geekbench 5 Multi Core
Snapdragon X X1-26-100
6244
Apple M1
7501
+20%
Passmark CPU Single Core
Snapdragon X X1-26-100
2869
Apple M1
3674
+28%
Passmark CPU Multi Core
Snapdragon X X1-26-100
16359
+16%
Apple M1
14128
Cinebench 2024 Single Core
Snapdragon X X1-26-100
96
Apple M1
110
+15%
Cinebench 2024 Multi Core
Snapdragon X X1-26-100
684
+54%
Apple M1
444
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