Home / CPU Comparison / Apple M1 or Qualcomm Snapdragon X Elite X1E-78-100: What's better?

Apple M1

vs

Qualcomm Snapdragon X Elite X1E-78-100

CPU Comparison Result

Below are the results of a comparison of Apple M1 and Qualcomm Snapdragon X Elite X1E-78-100 processors based on key performance characteristics, as well as power consumption and much more.

Advantages

Qualcomm Snapdragon X Elite X1E-78-100

More Total Cores: 12 (8 vs 12)
Higher Technology: 4 nm (5 nm vs 4 nm)
Higher Memory Type: LPDDR5x-8448 (Unified LPDDR4X-4266 vs LPDDR5x-8448)
Newer Launch Date: October 2023 (November 2020 vs October 2023)

Basic

Apple

Label Name

Qualcomm

November 2020

Launch Date

October 2023

Laptop

Platform

Laptop

Apple Firestorm + Apple Icestorm

CPU Architecture

Apple M1

CPU Name

T8103

Part Number

Apple M1

Model Name

The Intel processor number is just one of several factors - along with processor brand, system configurations, and system-level benchmarks - to be considered when choosing the right processor for your computing needs.

X1E-78-100

Code Name

Oryon

TSMC

Foundry

Samsung TSMC

Generation

Oryon

CPU Specifications

Total Cores

Cores is a hardware term that describes the number of independent central processing units in a single computing component (die or chip).

Total Threads

Where applicable, Intel® Hyper-Threading Technology is only available on Performance-cores.

Performance-cores

Efficient-cores

Performance-core Base Frequency

3.4 GHz

2.064 GHz

Efficient-core Max Turbo Frequency

Maximum E-core turbo frequency derived from Intel® Turbo Boost Technology.

NEON

Instruction Set Extensions

3.204 GHz

Performance-core Max Turbo Frequency

Maximum P-core turbo frequency derived from Intel® Turbo Boost Technology.

ARMv8.4-A, NEON

Extended Instruction Set

P-cores: 192 KB instruction + 128 KB data per core; E-cores: 128 KB instruction + 64 KB data per core

L1 Cache

P-core cluster: 12 MB; E-core cluster: 4 MB

L2 Cache

L3 Cache

42MB

Bus Frequency

100MHz

Unlocked Multiplier

5 nm

Technology

Lithography refers to the semiconductor technology used to manufacture an integrated circuit, and is reported in nanometer (nm), indicative of the size of features built on the semiconductor.

4 nm

TDP

23-65 W

PCI Express Version

PCI Express Revision is the supported version of the PCI Express standard. Peripheral Component Interconnect Express (or PCIe) is a high-speed serial computer expansion bus standard for attaching hardware devices to a computer. The different PCI Express versions support different data rates.

4.0

PCIe Version

PCI Express is a high-speed serial computer expansion bus standard used for connecting high-speed components, replacing older standards such as AGP, PCI, and PCI-X. It has gone through multiple revisions and improvements since its initial release. PCIe 1.0 was first introduced in 2002, and in order to meet the growing demand for higher bandwidth, subsequent versions have been released over time.

4.0

ARMv8.4-A

Instruction Set

The instruction set is a hard program stored inside the CPU that guides and optimizes CPU operations. With these instruction sets, the CPU can run more efficiently. There are many manufacturers that design CPUs, which results in different instruction sets, such as the 8086 instruction set for the Intel camp and the RISC instruction set for the ARM camp. x86, ARM v8, and MIPS are all codes for instruction sets. Instruction sets can be extended; for example, x86 added 64-bit support to create x86-64. Manufacturers developing CPUs that are compatible with a certain instruction set need authorization from the instruction set patent holder. A typical example is Intel authorizing AMD, enabling the latter to develop CPUs compatible with the x86 instruction set.

Arm-64

16 billion

Transistor Count

Memory Specifications

128-bit

Memory Bus Width

Unified LPDDR4X-4266

Memory Type

Intel® processors come in four different types: Single Channel, Dual Channel, Triple Channel, and Flex Mode. Maximum supported memory speed may be lower when populating multiple DIMMs per channel on products that support multiple memory channels.

LPDDR5x-8448

16 GB

Max Memory Size

Max memory size refers to the maximum memory capacity supported by the processor.

64GB

Memory Channels

The number of memory channels refers to the bandwidth operation for real world application.

68.25 GB/s

Max Memory Bandwidth

Max Memory bandwidth is the maximum rate at which data can be read from or stored into a semiconductor memory by the processor (in GB/s).

135 GB/s

ECC Memory Support

ECC Memory Supported indicates processor support for Error-Correcting Code memory. ECC memory is a type of system memory that can detect and correct common kinds of internal data corruption. Note that ECC memory support requires both processor and chipset support.

GPU Specifications

Apple M1 GPU

GPU Name

Qualcomm Adreno

H.264, HEVC (H.265); multiple 4K video streams / up to 4K 60 fps depending on codec, bitrate and app

Video Decode

H.264, HEVC (H.265); up to 4K 60 fps depending on profile, level and app

Video Encode

Integrated Graphics Model

An integrated GPU refers to the graphics core that is integrated into the CPU processor. Leveraging the processor's powerful computational capabilities and intelligent power efficiency management, it delivers outstanding graphics performance and a smooth application experience at a lower power consumption.

True

Graphics Core Count

Metal, OpenCL

GPU APIs

Up to 2.6 TFLOPS FP32

Graphics Performance

3.8 TFLOPS

Media encode and decode engines

Media Engine

Video Decode Engines

Video Encode Engines

ProRes Encode/Decode Engines