Home / CPU Comparison / AMD Ryzen 5 5600H or Apple M1: What's better?

AMD Ryzen 5 5600H

vs

Apple M1

CPU Comparison Result

Below are the results of a comparison of AMD Ryzen 5 5600H and Apple M1 processors based on key performance characteristics, as well as power consumption and much more.

Advantages

AMD Ryzen 5 5600H

Newer Launch Date: January 2021 (January 2021 vs November 2020)

Apple M1

More Total Cores: 8 (6 vs 8)
Higher Technology: 5 nm (TSMC 7nm FinFET vs 5 nm)

Basic

AMD

Label Name

Apple

January 2021

Launch Date

November 2020

Laptop

Platform

Laptop

CPU Architecture

Apple Firestorm + Apple Icestorm

CPU Name

Apple M1

Part Number

T8103

Model Name

The Intel processor number is just one of several factors - along with processor brand, system configurations, and system-level benchmarks - to be considered when choosing the right processor for your computing needs.

Apple M1

Cezanne

Code Name

Foundry

TSMC

Windows 11 - 64-Bit Edition, Windows 10 - 64-Bit Edition, RHEL x86 64-Bit, Ubuntu x86 64-Bit *Operating System (OS) support will vary by manufacturer.

OS Support

CPU Specifications

Performance Cores

Total Cores

Cores is a hardware term that describes the number of independent central processing units in a single computing component (die or chip).

Total Threads

Where applicable, Intel® Hyper-Threading Technology is only available on Performance-cores.

Efficient-cores

3.3GHz

Basic Frequency

Up to 4.2GHz

Max Turbo Frequency

Max Turbo Frequency is the maximum single-core frequency at which the processor is capable of operating using Intel® Turbo Boost Technology and, if present, Intel® Turbo Boost Max Technology 3.0 and Intel® Thermal Velocity Boost. Frequency is typically measured in gigahertz (GHz), or billion cycles per second.

Efficient-core Max Turbo Frequency

Maximum E-core turbo frequency derived from Intel® Turbo Boost Technology.

2.064 GHz

Instruction Set Extensions

NEON

Performance-core Max Turbo Frequency

Maximum P-core turbo frequency derived from Intel® Turbo Boost Technology.

3.204 GHz

Extended Instruction Set

ARMv8.4-A, NEON

L1 Cache

P-cores: 192 KB instruction + 128 KB data per core; E-cores: 128 KB instruction + 64 KB data per core

3MB

L2 Cache

P-core cluster: 12 MB; E-core cluster: 4 MB

16MB

L3 Cache

FP6

CPU Socket

The socket is the component that provides the mechanical and electrical connections between the processor and motherboard.

TSMC 7nm FinFET

Technology

Lithography refers to the semiconductor technology used to manufacture an integrated circuit, and is reported in nanometer (nm), indicative of the size of features built on the semiconductor.

5 nm

45W

TDP

105°C

Max. Operating Temperature

Junction Temperature is the maximum temperature allowed at the processor die.

PCIe® 3.0

PCI Express Version

PCI Express Revision is the supported version of the PCI Express standard. Peripheral Component Interconnect Express (or PCIe) is a high-speed serial computer expansion bus standard for attaching hardware devices to a computer. The different PCI Express versions support different data rates.

Instruction Set

The instruction set is a hard program stored inside the CPU that guides and optimizes CPU operations. With these instruction sets, the CPU can run more efficiently. There are many manufacturers that design CPUs, which results in different instruction sets, such as the 8086 instruction set for the Intel camp and the RISC instruction set for the ARM camp. x86, ARM v8, and MIPS are all codes for instruction sets. Instruction sets can be extended; for example, x86 added 64-bit support to create x86-64. Manufacturers developing CPUs that are compatible with a certain instruction set need authorization from the instruction set patent holder. A typical example is Intel authorizing AMD, enabling the latter to develop CPUs compatible with the x86 instruction set.

ARMv8.4-A

Transistor Count

16 billion

Memory Specifications

Memory Bus Width

128-bit

DDR4 - Up to 3200 MT/s, LPDDR4 - Up to 4266 MT/s

Memory Type

Intel® processors come in four different types: Single Channel, Dual Channel, Triple Channel, and Flex Mode. Maximum supported memory speed may be lower when populating multiple DIMMs per channel on products that support multiple memory channels.

Unified LPDDR4X-4266

Max Memory Size

Max memory size refers to the maximum memory capacity supported by the processor.

16 GB

Memory Channels

The number of memory channels refers to the bandwidth operation for real world application.

Max Memory Bandwidth

Max Memory bandwidth is the maximum rate at which data can be read from or stored into a semiconductor memory by the processor (in GB/s).

68.25 GB/s

ECC Memory Supported

ECC Memory Supported indicates processor support for Error-Correcting Code memory. ECC memory is a type of system memory that can detect and correct common kinds of internal data corruption. Note that ECC memory support requires both processor and chipset support.

GPU Specifications

GPU APIs

Metal, OpenCL

GPU Name

Apple M1 GPU

Media Engine

Media encode and decode engines

ProRes Encode/Decode Engines

Video Decode

H.264, HEVC (H.265); multiple 4K video streams / up to 4K 60 fps depending on codec, bitrate and app

Video Decode Engines

Video Encode

H.264, HEVC (H.265); up to 4K 60 fps depending on profile, level and app

Video Encode Engines

AMD Radeon™ Graphics

Integrated Graphics Model

An integrated GPU refers to the graphics core that is integrated into the CPU processor. Leveraging the processor's powerful computational capabilities and intelligent power efficiency management, it delivers outstanding graphics performance and a smooth application experience at a lower power consumption.

1800 MHz

Graphics Frequency

Graphics max dynamic frequency refers to the maximum opportunistic graphics render clock frequency (in MHz) that can be supported using Intel® HD Graphics with Dynamic Frequency feature.

Graphics Core Count

Graphics Performance

Up to 2.6 TFLOPS FP32