Home / CPU Comparison / Apple M2 or AMD Ryzen 7 8745HS: What's better?

Apple M2

vs

AMD Ryzen 7 8745HS

CPU Comparison Result

Below are the results of a comparison of Apple M2 and AMD Ryzen 7 8745HS processors based on key performance characteristics, as well as power consumption and much more.

Advantages

AMD Ryzen 7 8745HS

Higher Performance-core Max Turbo Frequency: 5.1 GHz (3.48 GHz vs 5.1 GHz)
Larger L3 Cache: 16 MB shared (8 MB system level cache vs 16 MB shared)
Higher Technology: 4 nm (5 nm vs 4 nm)
Newer Launch Date: July 2024 (June 2022 vs July 2024)

Basic

Apple

Label Name

AMD

June 2022

Launch Date

July 2024

Laptop

Platform

Laptop

Apple Avalanche + Apple Blizzard

CPU Architecture

Apple M2

CPU Name

Apple M2

Model Name

The Intel processor number is just one of several factors - along with processor brand, system configurations, and system-level benchmarks - to be considered when choosing the right processor for your computing needs.

Ryzen 7 8745HS

Code Name

Zen 4 (Hawk Point)

TSMC

Foundry

Apple M2 series

Generation

CPU Specifications

Performance Cores

Total Cores

Cores is a hardware term that describes the number of independent central processing units in a single computing component (die or chip).

Total Threads

Where applicable, Intel® Hyper-Threading Technology is only available on Performance-cores.

Performance-cores

Efficient-cores

Performance-core Base Frequency

3.8 GHz

2.42 GHz

Efficient-core Max Turbo Frequency

Maximum E-core turbo frequency derived from Intel® Turbo Boost Technology.

NEON

Instruction Set Extensions

3.48 GHz

Performance-core Max Turbo Frequency

Maximum P-core turbo frequency derived from Intel® Turbo Boost Technology.

5.1 GHz

ARMv8.6-A, NEON

Extended Instruction Set

P-cores: 192 KB instruction + 128 KB data per core; E-cores: 128 KB instruction + 64 KB data per core

L1 Cache

64 K per core

P-core cluster: 16 MB; E-core cluster: 4 MB

L2 Cache

1 MB per core

8 MB system level cache

L3 Cache

16 MB shared

Bus Frequency

100 MHz

CPU Socket

The socket is the component that provides the mechanical and electrical connections between the processor and motherboard.

FP8

Multiplier

Unlocked Multiplier

5 nm

Technology

Lithography refers to the semiconductor technology used to manufacture an integrated circuit, and is reported in nanometer (nm), indicative of the size of features built on the semiconductor.

4 nm

TDP

Max. Operating Temperature

Junction Temperature is the maximum temperature allowed at the processor die.

100 °C

PCIe Version

PCI Express is a high-speed serial computer expansion bus standard used for connecting high-speed components, replacing older standards such as AGP, PCI, and PCI-X. It has gone through multiple revisions and improvements since its initial release. PCIe 1.0 was first introduced in 2002, and in order to meet the growing demand for higher bandwidth, subsequent versions have been released over time.

4.0

ARMv8.6-A

Instruction Set

The instruction set is a hard program stored inside the CPU that guides and optimizes CPU operations. With these instruction sets, the CPU can run more efficiently. There are many manufacturers that design CPUs, which results in different instruction sets, such as the 8086 instruction set for the Intel camp and the RISC instruction set for the ARM camp. x86, ARM v8, and MIPS are all codes for instruction sets. Instruction sets can be extended; for example, x86 added 64-bit support to create x86-64. Manufacturers developing CPUs that are compatible with a certain instruction set need authorization from the instruction set patent holder. A typical example is Intel authorizing AMD, enabling the latter to develop CPUs compatible with the x86 instruction set.

x86-64

20 billion

Transistor Count

25 billions

Memory Specifications

128-bit

Memory Bus Width

Unified LPDDR5-6400

Memory Type

Intel® processors come in four different types: Single Channel, Dual Channel, Triple Channel, and Flex Mode. Maximum supported memory speed may be lower when populating multiple DIMMs per channel on products that support multiple memory channels.

DDR5-5600,LPDDR5x-7500

LPDDR5-6400

LPDDR5 Speed

24 GB

Max Memory Size

Max memory size refers to the maximum memory capacity supported by the processor.

100 GB/s

Max Memory Bandwidth

Max Memory bandwidth is the maximum rate at which data can be read from or stored into a semiconductor memory by the processor (in GB/s).

6400 MT/s

Maximum Memory Speed

ECC Memory Support

GPU Specifications

Thunderbolt 3 / USB4 with DisplayPort

External Display Standard

Apple M2 GPU

GPU Name

Up to 6K 60Hz external display

Max External Display Resolution

H.264, HEVC, ProRes, ProRes RAW; up to 8K H.264 and HEVC decode; multiple 4K and 8K ProRes streams

Video Decode

H.264, HEVC, ProRes, ProRes RAW; up to 8K H.264 and HEVC decode

Video Encode

Apple media engine with ProRes acceleration

Video Processing Unit

Integrated Graphics Model

An integrated GPU refers to the graphics core that is integrated into the CPU processor. Leveraging the processor's powerful computational capabilities and intelligent power efficiency management, it delivers outstanding graphics performance and a smooth application experience at a lower power consumption.

true

GPU Base Frequency

800 MHz

1398 MHz

GPU Max Dynamic Frequency

2600 MHz

Graphics Core Count

Execution Units

The Execution Unit is the foundational building block of Intel’s graphics architecture. Execution Units are compute processors optimized for simultaneous Multi-Threading for high throughput compute power.

One external display up to 6K 60Hz

Number of Displays Supported

Metal, OpenCL

GPU APIs

Up to 3.6 TFLOPS FP32

Graphics Performance

Hardware-accelerated H.264, HEVC, ProRes, and ProRes RAW

Media Engine

Video Decode Engines

Video Encode Engines

ProRes Encode/Decode Engines

Yes