Apple M2
vs
AMD Ryzen 7 8745HS
vs
CPU Comparison Result
Below are the results of a comparison of
Apple M2
and
AMD Ryzen 7 8745HS
processors based on key performance characteristics, as well as power consumption and much more.
Advantages
- Larger L3 Cache: 16 MB (8 MB system level cache vs 16 MB)
- Higher Technology: TSMC 4nm FinFET (5 nm vs TSMC 4nm FinFET)
- Newer Launch Date: June 2024 (June 2022 vs June 2024)
Basic
Apple
Label Name
AMD
June 2022
Launch Date
June 2024
Laptop
Platform
Laptop
Apple Avalanche + Apple Blizzard
CPU Architecture
-
Apple M2
CPU Name
-
Apple M2
Model Name
Ryzen 7 8745HS
-
Code Name
Hawk Point
TSMC
Foundry
-
Apple M2 series
Generation
Zen 4
-
OS Support
Windows 11 - 64-Bit Edition, Windows 10 - 64-Bit Edition, RHEL x86 64-Bit, Ubuntu x86 64-Bit
CPU Specifications
8
Total Cores
Cores is a hardware term that describes the number of independent central processing units in a single computing component (die or chip).
8
8
Total Threads
16
4
Performance-cores
-
4
Efficient-cores
-
-
Basic Frequency
3.8 GHz
-
Max Turbo Frequency
Up to 4.9 GHz
2.42 GHz
Efficient-core Max Turbo Frequency
-
NEON
Instruction Set Extensions
-
3.48 GHz
Performance-core Max Turbo Frequency
-
ARMv8.6-A, NEON
Extended Instruction Set
-
P-cores: 192 KB instruction + 128 KB data per core; E-cores: 128 KB instruction + 64 KB data per core
L1 Cache
-
P-core cluster: 16 MB; E-core cluster: 4 MB
L2 Cache
8 MB
8 MB system level cache
L3 Cache
16 MB
-
CPU Socket
The socket is the component that provides the mechanical and electrical connections between the processor and motherboard.
FP7r2, FP8
-
Unlocked for Overclocking
No
5 nm
Technology
Lithography refers to the semiconductor technology used to manufacture an integrated circuit, and is reported in nanometer (nm), indicative of the size of features built on the semiconductor.
TSMC 4nm FinFET
-
TDP
45W
-
Max. Operating Temperature
Junction Temperature is the maximum temperature allowed at the processor die.
100°C
-
PCI Express Version
PCI Express Revision is the supported version of the PCI Express standard. Peripheral Component Interconnect Express (or PCIe) is a high-speed serial computer expansion bus standard for attaching hardware devices to a computer. The different PCI Express versions support different data rates.
PCIe® 4.0
ARMv8.6-A
Instruction Set
An instruction set architecture (ISA) defines the instructions a processor can execute. Common architectures include x86-64, ARM and RISC-V. The ISA determines software compatibility, while optional instruction extensions add specialized capabilities.
-
20 billion
Transistor Count
-
Memory Specifications
128-bit
Memory Bus Width
-
Unified LPDDR5-6400
Memory Type
DDR5 (FP7r2), LPDDR5X (FP7-FP8)
LPDDR5-6400
LPDDR5 Speed
-
24 GB
Max Memory Size
Max memory size refers to the maximum memory capacity supported by the processor.
256 GB
-
Memory Channels
The number of memory channels refers to the bandwidth operation for real world application.
2
100 GB/s
Max Memory Bandwidth
Max Memory bandwidth is the maximum rate at which data can be read from or stored into a semiconductor memory by the processor (in GB/s).
-
6400 MT/s
Maximum Memory Speed
4x2R DDR5-5600
-
ECC Memory Support
ECC Memory Supported indicates processor support for Error-Correcting Code memory. ECC memory is a type of system memory that can detect and correct common kinds of internal data corruption. Note that ECC memory support requires both processor and chipset support.
No
GPU Specifications
Thunderbolt 3 / USB4 with DisplayPort
External Display Standard
-
Apple M2 GPU
GPU Name
-
Up to 6K 60Hz external display
Max External Display Resolution
-
H.264, HEVC, ProRes, ProRes RAW; up to 8K H.264 and HEVC decode; multiple 4K and 8K ProRes streams
Video Decode
-
H.264, HEVC, ProRes, ProRes RAW; up to 8K H.264 and HEVC decode
Video Encode
-
Apple media engine with ProRes acceleration
Video Processing Unit
-
-
Integrated Graphics Model
An integrated GPU refers to the graphics core that is integrated into the CPU processor. Leveraging the processor's powerful computational capabilities and intelligent power efficiency management, it delivers outstanding graphics performance and a smooth application experience at a lower power consumption.
AMD Radeon™ 780M
1398 MHz
GPU Max Dynamic Frequency
-
10
Graphics Core Count
12
-
Graphics Frequency
2600 MHz
One external display up to 6K 60Hz
Number of Displays Supported
-
Metal, OpenCL
GPU APIs
-
Up to 3.6 TFLOPS FP32
Graphics Performance
-
Hardware-accelerated H.264, HEVC, ProRes, and ProRes RAW
Media Engine
-
1
Video Decode Engines
-
1
Video Encode Engines
-
1
ProRes Encode/Decode Engines
-
Yes
OpenCL Support
OpenCL (Open Computing Language) is a multi-platform API (Application Programming Interface) for heterogeneous parallel programming.
-
AI Specifications
16-core Apple Neural Engine
AI Engine
-
16
Neural Engine Core Count
-
Apple Neural Engine
NPU Name
-
15.8 TOPS
NPU Performance
-
Connectivity
Yes
Bluetooth Support
-
Bluetooth 5.3
Bluetooth Version
-
Wi-Fi 6 (802.11ax)
Wi-Fi Standard
-
Interfaces and Ports
Yes, Thunderbolt 3 up to 40 Gb/s
Thunderbolt Support
-
USB4
USB Version
-
Yes, USB4 up to 40 Gb/s
USB4 Support
-
Miscellaneous
Yes, Apple silicon secure boot chain of trust
Hardware-Verified Secure Boot
-
Apple image signal processor
Image Signal Processor
-
Kernel Integrity Protection, Pointer Authentication Codes, Fast Permission Restrictions
Runtime Anti-Exploitation
-
Benchmarks
Cinebench R23 Single Core
Apple M2
1595
Ryzen 7 8745HS
1749
+10%
Cinebench R23 Multi Core
Apple M2
8654
Ryzen 7 8745HS
16068
+86%
Geekbench 6 Single Core
Apple M2
2597
+10%
Ryzen 7 8745HS
2359
Geekbench 6 Multi Core
Apple M2
9707
Ryzen 7 8745HS
10351
+7%
Geekbench 7 Single Core
Apple M2
2385
+5%
Ryzen 7 8745HS
2269
Geekbench 7 Multi Core
Apple M2
10701
Ryzen 7 8745HS
13681
+28%
Passmark CPU Single Core
Apple M2
3885
+3%
Ryzen 7 8745HS
3789
Passmark CPU Multi Core
Apple M2
15654
Ryzen 7 8745HS
29232
+87%
Cinebench 2024 Single Core
Apple M2
120
+22%
Ryzen 7 8745HS
98
Cinebench 2024 Multi Core
Apple M2
555
Ryzen 7 8745HS
867
+56%
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