Advantages
- Larger L3 Cache: 16 MB (16 MB vs 8 MB system level cache)
- Higher Technology: TSMC 4nm FinFET (TSMC 4nm FinFET vs 5 nm)
- Newer Launch Date: May 2023 (May 2023 vs June 2022)
Basic
AMD
Label Name
Apple
May 2023
Launch Date
June 2022
Laptop
Platform
Laptop
-
CPU Architecture
Apple Avalanche + Apple Blizzard
-
CPU Name
Apple M2
Ryzen 5 7540U
Model Name
Apple M2
Phoenix
Code Name
-
-
Foundry
TSMC
Zen 4
Generation
Apple M2 series
Windows 11 - 64-Bit Edition, Windows 10 - 64-Bit Edition, RHEL x86 64-Bit, Ubuntu x86 64-Bit
OS Support
-
CPU Specifications
6
Total Cores
Cores is a hardware term that describes the number of independent central processing units in a single computing component (die or chip).
8
12
Total Threads
8
-
Performance-cores
4
-
Efficient-cores
4
3.2 GHz
Basic Frequency
-
Up to 4.9 GHz
Max Turbo Frequency
-
-
Efficient-core Max Turbo Frequency
2.42 GHz
-
Instruction Set Extensions
NEON
-
Performance-core Max Turbo Frequency
3.48 GHz
-
Extended Instruction Set
ARMv8.6-A, NEON
-
L1 Cache
P-cores: 192 KB instruction + 128 KB data per core; E-cores: 128 KB instruction + 64 KB data per core
6 MB
L2 Cache
P-core cluster: 16 MB; E-core cluster: 4 MB
16 MB
L3 Cache
8 MB system level cache
FP7, FP7r2
CPU Socket
The socket is the component that provides the mechanical and electrical connections between the processor and motherboard.
-
No
Unlocked for Overclocking
-
TSMC 4nm FinFET
Technology
Lithography refers to the semiconductor technology used to manufacture an integrated circuit, and is reported in nanometer (nm), indicative of the size of features built on the semiconductor.
5 nm
28W
TDP
-
100°C
Max. Operating Temperature
Junction Temperature is the maximum temperature allowed at the processor die.
-
PCIe® 4.0
PCI Express Version
PCI Express Revision is the supported version of the PCI Express standard. Peripheral Component Interconnect Express (or PCIe) is a high-speed serial computer expansion bus standard for attaching hardware devices to a computer. The different PCI Express versions support different data rates.
-
x86-64
Instruction Set
An instruction set architecture (ISA) defines the instructions a processor can execute. Common architectures include x86-64, ARM and RISC-V. The ISA determines software compatibility, while optional instruction extensions add specialized capabilities.
ARMv8.6-A
-
Transistor Count
20 billion
Memory Specifications
-
Memory Bus Width
128-bit
DDR5 (FP7r2), LPDDR5X (FP7-FP8)
Memory Type
Unified LPDDR5-6400
-
LPDDR5 Speed
LPDDR5-6400
256 GB
Max Memory Size
Max memory size refers to the maximum memory capacity supported by the processor.
24 GB
2
Memory Channels
The number of memory channels refers to the bandwidth operation for real world application.
-
-
Max Memory Bandwidth
Max Memory bandwidth is the maximum rate at which data can be read from or stored into a semiconductor memory by the processor (in GB/s).
100 GB/s
4x2R DDR5-5600
Maximum Memory Speed
6400 MT/s
Yes (FP7r2 only; Requires platform support)
ECC Memory Support
ECC Memory Supported indicates processor support for Error-Correcting Code memory. ECC memory is a type of system memory that can detect and correct common kinds of internal data corruption. Note that ECC memory support requires both processor and chipset support.
-
GPU Specifications
-
External Display Standard
Thunderbolt 3 / USB4 with DisplayPort
-
GPU Name
Apple M2 GPU
-
Max External Display Resolution
Up to 6K 60Hz external display
-
Video Decode
H.264, HEVC, ProRes, ProRes RAW; up to 8K H.264 and HEVC decode; multiple 4K and 8K ProRes streams
-
Video Encode
H.264, HEVC, ProRes, ProRes RAW; up to 8K H.264 and HEVC decode
-
Video Processing Unit
Apple media engine with ProRes acceleration
AMD Radeon™ 740M
Integrated Graphics Model
An integrated GPU refers to the graphics core that is integrated into the CPU processor. Leveraging the processor's powerful computational capabilities and intelligent power efficiency management, it delivers outstanding graphics performance and a smooth application experience at a lower power consumption.
-
-
GPU Max Dynamic Frequency
1398 MHz
4
Graphics Core Count
10
2500 MHz
Graphics Frequency
-
-
Number of Displays Supported
One external display up to 6K 60Hz
-
GPU APIs
Metal, OpenCL
-
Graphics Performance
Up to 3.6 TFLOPS FP32
-
Media Engine
Hardware-accelerated H.264, HEVC, ProRes, and ProRes RAW
-
Video Decode Engines
1
-
Video Encode Engines
1
-
ProRes Encode/Decode Engines
1
-
OpenCL Support
OpenCL (Open Computing Language) is a multi-platform API (Application Programming Interface) for heterogeneous parallel programming.
Yes
AI Specifications
-
AI Engine
16-core Apple Neural Engine
-
Neural Engine Core Count
16
-
NPU Name
Apple Neural Engine
-
NPU Performance
15.8 TOPS
Connectivity
-
Bluetooth Support
Yes
-
Bluetooth Version
Bluetooth 5.3
-
Wi-Fi Standard
Wi-Fi 6 (802.11ax)
Interfaces and Ports
-
Thunderbolt Support
Yes, Thunderbolt 3 up to 40 Gb/s
-
USB Version
USB4
-
USB4 Support
Yes, USB4 up to 40 Gb/s
Miscellaneous
-
Hardware-Verified Secure Boot
Yes, Apple silicon secure boot chain of trust
-
Image Signal Processor
Apple image signal processor
-
Runtime Anti-Exploitation
Kernel Integrity Protection, Pointer Authentication Codes, Fast Permission Restrictions
Benchmarks
Geekbench 6 Single Core
Ryzen 5 7540U
2162
Apple M2
2597
+20%
Geekbench 6 Multi Core
Ryzen 5 7540U
8007
Apple M2
9707
+21%
Geekbench 5 Single Core
Ryzen 5 7540U
1677
Apple M2
1914
+14%
Geekbench 5 Multi Core
Ryzen 5 7540U
7334
Apple M2
8812
+20%
Geekbench 7 Single Core
Ryzen 5 7540U
1975
Apple M2
2385
+21%
Geekbench 7 Multi Core
Ryzen 5 7540U
9489
Apple M2
10701
+13%
Passmark CPU Single Core
Ryzen 5 7540U
3722
Apple M2
3885
+4%
Passmark CPU Multi Core
Ryzen 5 7540U
19213
+23%
Apple M2
15654
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