Home / CPU Comparison / AMD Ryzen Embedded R2544 or Intel Processor N150: What's better?

AMD Ryzen Embedded R2544

vs

Intel Processor N150

CPU Comparison Result

Below are the results of a comparison of AMD Ryzen Embedded R2544 and Intel Processor N150 processors based on key performance characteristics, as well as power consumption and much more.

Advantages

AMD Ryzen Embedded R2544

Higher Max Turbo Frequency: up to 3.7 GHz (up to 3.7 GHz vs 3.6 Ghz)

Intel Processor N150

Larger L3 Cache: 6 MB shared (4 MB (shared) vs 6 MB shared)
Higher Technology: 7 nm (12 nm vs 7 nm)
Higher Memory Type: DDR5-4800, DDR4-3200, LPDDR5-4800 (DDR4 vs DDR5-4800, DDR4-3200, LPDDR5-4800)
Newer Launch Date: January 2025 (September 2022 vs January 2025)

Basic

AMD

Label Name

Intel

September 2022

Launch Date

January 2025

Desktop

Platform

Laptop

Ryzen Embedded R2544

Model Name

The Intel processor number is just one of several factors - along with processor brand, system configurations, and system-level benchmarks - to be considered when choosing the right processor for your computing needs.

N150

Picasso

Code Name

Twin Lake

Ryzen Embedded (Zen+ (Picasso))

Generation

CPU Specifications

Total Cores

Cores is a hardware term that describes the number of independent central processing units in a single computing component (die or chip).

Total Threads

Where applicable, Intel® Hyper-Threading Technology is only available on Performance-cores.

3.35 GHz

Basic Frequency

up to 3.7 GHz

Max Turbo Frequency

Max Turbo Frequency is the maximum single-core frequency at which the processor is capable of operating using Intel® Turbo Boost Technology and, if present, Intel® Turbo Boost Max Technology 3.0 and Intel® Thermal Velocity Boost. Frequency is typically measured in gigahertz (GHz), or billion cycles per second.

3.6 Ghz

96 KB (per core)

L1 Cache

96 K per core

512 KB (per core)

L2 Cache

2 MB shared

4 MB (shared)

L3 Cache

6 MB shared

100 MHz

Bus Frequency

100 MHz

AMD Socket FP5

CPU Socket

The socket is the component that provides the mechanical and electrical connections between the processor and motherboard.

FCBGA1264

33.5x

Multiplier

34x

Multiplier Unlocked

Unlocked Multiplier

12 nm

Technology

Lithography refers to the semiconductor technology used to manufacture an integrated circuit, and is reported in nanometer (nm), indicative of the size of features built on the semiconductor.

7 nm

45 W

TDP

6 W

105°C

Max. Operating Temperature

Junction Temperature is the maximum temperature allowed at the processor die.

105°C

Gen 3, 16 Lanes (CPU only)

PCI Express Version

PCI Express Revision is the supported version of the PCI Express standard. Peripheral Component Interconnect Express (or PCIe) is a high-speed serial computer expansion bus standard for attaching hardware devices to a computer. The different PCI Express versions support different data rates.

PCIe Version

PCI Express is a high-speed serial computer expansion bus standard used for connecting high-speed components, replacing older standards such as AGP, PCI, and PCI-X. It has gone through multiple revisions and improvements since its initial release. PCIe 1.0 was first introduced in 2002, and in order to meet the growing demand for higher bandwidth, subsequent versions have been released over time.

3.0

Instruction Set

The instruction set is a hard program stored inside the CPU that guides and optimizes CPU operations. With these instruction sets, the CPU can run more efficiently. There are many manufacturers that design CPUs, which results in different instruction sets, such as the 8086 instruction set for the Intel camp and the RISC instruction set for the ARM camp. x86, ARM v8, and MIPS are all codes for instruction sets. Instruction sets can be extended; for example, x86 added 64-bit support to create x86-64. Manufacturers developing CPUs that are compatible with a certain instruction set need authorization from the instruction set patent holder. A typical example is Intel authorizing AMD, enabling the latter to develop CPUs compatible with the x86 instruction set.

x86-64

4,940 million

Transistor Count

Memory Specifications

DDR4

Memory Type

Intel® processors come in four different types: Single Channel, Dual Channel, Triple Channel, and Flex Mode. Maximum supported memory speed may be lower when populating multiple DIMMs per channel on products that support multiple memory channels.

DDR5-4800, DDR4-3200, LPDDR5-4800

Max Memory Size

Max memory size refers to the maximum memory capacity supported by the processor.

16 GB

Dual-channel

Memory Channels

The number of memory channels refers to the bandwidth operation for real world application.

Max Memory Bandwidth

Max Memory bandwidth is the maximum rate at which data can be read from or stored into a semiconductor memory by the processor (in GB/s).

38.4 GB/s

Yes

ECC Memory Support

ECC Memory Supported indicates processor support for Error-Correcting Code memory. ECC memory is a type of system memory that can detect and correct common kinds of internal data corruption. Note that ECC memory support requires both processor and chipset support.

GPU Specifications

Radeon Vega 8

Integrated Graphics Model

An integrated GPU refers to the graphics core that is integrated into the CPU processor. Leveraging the processor's powerful computational capabilities and intelligent power efficiency management, it delivers outstanding graphics performance and a smooth application experience at a lower power consumption.

true

GPU Max Dynamic Frequency

1000 MHz

Execution Units

The Execution Unit is the foundational building block of Intel’s graphics architecture. Execution Units are compute processors optimized for simultaneous Multi-Threading for high throughput compute power.

Graphics Performance

0.3 TFLOPS