AMD Ryzen 3 7335U
About processor
The AMD Ryzen 3 7335U is a powerful processor designed for laptops, built on TSMC's 6nm FinFET technology. With a total of 4 cores and 8 threads, this processor delivers impressive multitasking performance. The 8MB of L3 cache further enhances its speed and efficiency, making it a great choice for both everyday tasks and more demanding workloads.
One of the standout features of the Ryzen 3 7335U is its integrated graphics model, the AMD Radeon 660M. This graphics solution provides solid performance for casual gaming and multimedia tasks, eliminating the need for a dedicated graphics card in many cases. The 28W TDP ensures that the processor operates efficiently and effectively, striking a good balance between performance and power consumption.
Overall, the AMD Ryzen 3 7335U is a compelling choice for users in need of a reliable and capable processor for their laptop. Whether it's for work, entertainment, or a bit of both, this processor delivers the performance and features needed to handle a wide range of tasks with ease. Its efficient design and integrated graphics make it a strong contender in the laptop processor market.
Basic
Label Name
AMD
Platform
Laptop
Launch Date
January 2023
Code Name
Rembrandt-R
CPU Specifications
Total Cores
?
Cores is a hardware term that describes the number of independent central processing units in a single computing component (die or chip).
4
Total Threads
?
Where applicable, Intel® Hyper-Threading Technology is only available on Performance-cores.
8
Basic Frequency
3.0GHz
Max Turbo Frequency
?
Max Turbo Frequency is the maximum single-core frequency at which the processor is capable of operating using Intel® Turbo Boost Technology and, if present, Intel® Turbo Boost Max Technology 3.0 and Intel® Thermal Velocity Boost. Frequency is typically measured in gigahertz (GHz), or billion cycles per second.
Up to 4.3GHz
L1 Cache
512KB
L2 Cache
2MB
L3 Cache
8MB
CPU Socket
?
The socket is the component that provides the mechanical and electrical connections between the processor and motherboard.
FP7
Technology
?
Lithography refers to the semiconductor technology used to manufacture an integrated circuit, and is reported in nanometer (nm), indicative of the size of features built on the semiconductor.
TSMC 6nm FinFET
TDP
28W
Max. Operating Temperature
?
Junction Temperature is the maximum temperature allowed at the processor die.
95°C
PCI Express Version
?
PCI Express Revision is the supported version of the PCI Express standard. Peripheral Component Interconnect Express (or PCIe) is a high-speed serial computer expansion bus standard for attaching hardware devices to a computer. The different PCI Express versions support different data rates.
PCIe® 4.0
Memory Specifications
Memory Type
?
Intel® processors come in four different types: Single Channel, Dual Channel, Triple Channel, and Flex Mode. Maximum supported memory speed may be lower when populating multiple DIMMs per channel on products that support multiple memory channels.
DDR5, LPDDR5
Memory Channels
?
The number of memory channels refers to the bandwidth operation for real world application.
2
GPU Specifications
Integrated Graphics Model
?
An integrated GPU refers to the graphics core that is integrated into the CPU processor. Leveraging the processor's powerful computational capabilities and intelligent power efficiency management, it delivers outstanding graphics performance and a smooth application experience at a lower power consumption.
AMD Radeon™ 660M
Graphics Frequency
?
Graphics max dynamic frequency refers to the maximum opportunistic graphics render clock frequency (in MHz) that can be supported using Intel® HD Graphics with Dynamic Frequency feature.
1800 MHz
Benchmarks
Geekbench 6
Single Core
Score
1724
Geekbench 6
Multi Core
Score
5477
Compared to Other CPU
Geekbench 6 Single Core
Geekbench 6 Multi Core