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AMD Ryzen 3 210

AMD Ryzen 3 210: A Versatile Processor for Everyday Tasks and More

(Codename: Hawk Point, Zen 4 architecture, 4nm manufacturing process)

Architecture and Manufacturing Process: The Foundation of Efficiency

The AMD Ryzen 3 210 is based on the Zen 4 architecture, which represents an evolutionary step for AMD's mobile solutions. The 4nm process from TSMC provides a high transistor density, positively impacting energy efficiency and performance.

- 4 Cores and 8 Threads: With SMT (Simultaneous Multithreading) support, each core processes two data streams. This allows for efficient task allocation, such as simultaneous use of a browser, office applications, and background processes.

- Clock Frequencies: The base frequency is 3.6 GHz, with a maximum in turbo mode of 4.7 GHz. Zen 4 is optimized for quick switching between low and high frequencies, which is critical for battery life.

- Integrated Graphics: Although the iGPU model is not specified, based on the Zen 4 generation, one might assume the use of Radeon 610M or a similar RDNA 2 architecture. This provides basic performance for less demanding games (e.g., CS:GO on low settings) and 4K video acceleration.

- Cache Memory: An 8 MB L3 cache speeds up the processing of frequently used data, which is important for multitasking.

Power Consumption and TDP: Balancing Power and Battery Life

The processor's TDP is 15W, typical for ultrabooks and thin laptops. This means:

- Low Heat Output: The cooling system can be compact, making devices thinner (e.g., models like Acer Swift or Lenovo Yoga).

- Flexible Power Management: The Precision Boost 2 technology automatically adjusts frequency based on load and temperature. For example, when rendering a short video in DaVinci Resolve, the processor can briefly boost to 4.7 GHz without overheating, thanks to aggressive throttling settings.

Real-World Performance

Office Work and Multitasking

The Ryzen 3 210 handles:

- Simultaneous operation of 20+ tabs in Chrome + Microsoft Teams + Word/Excel documents.

- Running virtual machines (e.g., lightweight Linux distributions) due to its 8 threads.

Multimedia

- Converting 1080p video in HandBrake takes about 25-30 minutes (for comparison, the Intel Core i3-1315U accomplishes the task in about 28-35 minutes).

- Streaming in OBS with encoding through iGPU — up to 60 FPS at 720p.

Gaming

The integrated graphics can handle:

- Dota 2 — 40-50 FPS on low settings (720p).

- Fortnite — 30-35 FPS in "Performance" mode (720p).

- Indie games like Hollow Knight or Stardew Valley — stable 60 FPS.

Turbo Mode: When plugged in, the processor holds high frequencies longer, but in battery mode, turbo boost is activated less frequently to conserve charge.

Use Cases: Who is the Ryzen 3 210 Suitable For?

- Students: For studying, working with texts, Zoom conferences, and light presentation editing.

- Office Workers: Multitasking without lag.

- On-the-Go Users: Watching Netflix, surfing the internet, messaging.

- Casual Gamers: Playing low-demand games or cloud gaming via Xbox Game Pass.

Not Suitable For:

- Professional 3D modeling.

- Streaming AAA games.

- Working with 4K video in Premiere Pro.

Battery Life: How Long Will It Last?

With a battery capacity of 50 Wh:

- In power-saving mode (50% brightness, Wi-Fi, office tasks): Up to 8-10 hours.

- Under load (gaming, rendering): 2-3 hours.

Energy-saving Technologies:

- AMD PowerNow!: Dynamically disables unused cores.

- Adaptive Voltage Scaling: Lowers voltage under low load.

Comparison with Competitors

1. Ryzen 3 210 (Zen 4):

- Cores/Threads: 4/8

- iGPU: Radeon 610M

- Power Consumption: 15W

- Performance: Moderate

- Price: Budget segment

2. Intel Core i3-1315U:

- Cores/Threads: 6/8 (2P+4E)

- iGPU: Intel UHD Graphics

- Power Consumption: 15W

- Performance: Similar, better in ST

- Price: Mid-range segment

3. Apple M1 (base version):

- Cores/Threads: 8/8 (4P+4E)

- iGPU: Apple M1 7-core

- Power Consumption: 10-15W

- Performance: Best in multi-threading

- Price: Premium

Key Differences:

- Versus Intel: The Ryzen 3 210 excels in multi-threading but falls short in single-thread performance.

- Versus Apple M1: The M1 surpasses in energy efficiency and rendering speed, but is limited by the macOS ecosystem.

Pros and Cons

Strengths:

- Excellent price-to-performance ratio.

- Support for modern standards: Wi-Fi 6E, DDR5.

- Good battery life.

Weaknesses:

- Limited graphics for gaming.

- Not suitable for heavy workloads.

Laptop Recommendations

1. Type of Device: Ultrabooks (e.g., ASUS ZenBook) or budget laptops (HP Pavilion).

2. What to Look For:

- RAM: At least 8 GB (preferably 16 GB for multitasking).

- Storage: SSD 256 GB and above.

- Screen: Full IPS display for comfortable work.

- Ports: USB-C supporting charging, HDMI.

Avoid models with passive cooling — prolonged loads can lead to throttling.

Final Conclusion

The AMD Ryzen 3 210 is an ideal choice for those seeking an affordable laptop for everyday tasks. It offers:

- Sufficient power for work and study.

- Long battery life.

- Modern connectivity technologies.

This processor may not impress enthusiasts, but it will be a reliable tool for most users who value a balance between price and quality.

Basic

Label Name

AMD

Platform

Laptop

Launch Date

January 2025

Model Name

The Intel processor number is just one of several factors - along with processor brand, system configurations, and system-level benchmarks - to be considered when choosing the right processor for your computing needs.

Ryzen 3 210

Code Name

Zen 4 (Hawk Point)

CPU Specifications

Total Cores

Cores is a hardware term that describes the number of independent central processing units in a single computing component (die or chip).

Total Threads

Where applicable, Intel® Hyper-Threading Technology is only available on Performance-cores.

Performance-cores

Efficient-cores

Performance-core Base Frequency

3.6 GHz

Efficient-core Base Frequency

2.8 GHz

Performance-core Max Turbo Frequency

Maximum P-core turbo frequency derived from Intel® Turbo Boost Technology.

4.7 GHz

L1 Cache

80 K per core

L2 Cache

1 MB per core

L3 Cache

8 MB shared

Bus Frequency

100 MHz

Multiplier

Unlocked Multiplier

CPU Socket

The socket is the component that provides the mechanical and electrical connections between the processor and motherboard.

FP8

Technology

Lithography refers to the semiconductor technology used to manufacture an integrated circuit, and is reported in nanometer (nm), indicative of the size of features built on the semiconductor.

4 nm

TDP

Max. Operating Temperature

Junction Temperature is the maximum temperature allowed at the processor die.

100 °C

PCIe Version

PCI Express is a high-speed serial computer expansion bus standard used for connecting high-speed components, replacing older standards such as AGP, PCI, and PCI-X. It has gone through multiple revisions and improvements since its initial release. PCIe 1.0 was first introduced in 2002, and in order to meet the growing demand for higher bandwidth, subsequent versions have been released over time.

4.0

Instruction Set

The instruction set is a hard program stored inside the CPU that guides and optimizes CPU operations. With these instruction sets, the CPU can run more efficiently. There are many manufacturers that design CPUs, which results in different instruction sets, such as the 8086 instruction set for the Intel camp and the RISC instruction set for the ARM camp. x86, ARM v8, and MIPS are all codes for instruction sets. Instruction sets can be extended; for example, x86 added 64-bit support to create x86-64. Manufacturers developing CPUs that are compatible with a certain instruction set need authorization from the instruction set patent holder. A typical example is Intel authorizing AMD, enabling the latter to develop CPUs compatible with the x86 instruction set.

x86-64

Memory Specifications

Memory Type

Intel® processors come in four different types: Single Channel, Dual Channel, Triple Channel, and Flex Mode. Maximum supported memory speed may be lower when populating multiple DIMMs per channel on products that support multiple memory channels.

LPDDR5X-7500,DDR5-5600

Max Memory Size

Max memory size refers to the maximum memory capacity supported by the processor.

256 GB

Memory Channels

The number of memory channels refers to the bandwidth operation for real world application.

ECC Memory Support

GPU Specifications

Integrated Graphics Model

An integrated GPU refers to the graphics core that is integrated into the CPU processor. Leveraging the processor's powerful computational capabilities and intelligent power efficiency management, it delivers outstanding graphics performance and a smooth application experience at a lower power consumption.

true

GPU Base Frequency

800 MHz

GPU Max Dynamic Frequency

2500 MHz

Execution Units

The Execution Unit is the foundational building block of Intel’s graphics architecture. Execution Units are compute processors optimized for simultaneous Multi-Threading for high throughput compute power.

Graphics Performance

1.28 TFLOPS

Miscellaneous

PCIe Lanes