AMD EPYC 7702
About processor
The AMD EPYC 7702 processor is a powerhouse of a CPU designed for server use. With a whopping 64 total cores and 128 total threads, it offers incredible multitasking capabilities and can handle even the most demanding workloads with ease. The 256MB L3 cache ensures fast access to frequently used data, further enhancing its performance.
Despite its impressive processing power, the EPYC 7702 has a TDP of 200W, which is relatively efficient for a CPU of this caliber. This means that it can deliver exceptional performance without consuming excessive amounts of power.
In terms of real-world performance, the EPYC 7702 excels in both single-core and multi-core tasks. In Geekbench 6 testing, it achieved a single-core score of 1282 and a multi-core score of 8891, showcasing its ability to handle both single-threaded and multi-threaded workloads with ease.
Overall, the AMD EPYC 7702 processor is an excellent choice for businesses and data centers in need of a high-performance CPU for their server applications. Its impressive core count, efficient power consumption, and stellar benchmark performance make it a top contender in the server CPU market.
Basic
Label Name
AMD
Platform
Server
Launch Date
August 2019
Code Name
Rome
CPU Specifications
Total Cores
?
Cores is a hardware term that describes the number of independent central processing units in a single computing component (die or chip).
64
Total Threads
?
Where applicable, Intel® Hyper-Threading Technology is only available on Performance-cores.
128
Basic Frequency
2.0GHz
Max Turbo Frequency
?
Max Turbo Frequency is the maximum single-core frequency at which the processor is capable of operating using Intel® Turbo Boost Technology and, if present, Intel® Turbo Boost Max Technology 3.0 and Intel® Thermal Velocity Boost. Frequency is typically measured in gigahertz (GHz), or billion cycles per second.
Up to 3.35GHz
L3 Cache
256MB
CPU Socket
?
The socket is the component that provides the mechanical and electrical connections between the processor and motherboard.
SP3
Technology
?
Lithography refers to the semiconductor technology used to manufacture an integrated circuit, and is reported in nanometer (nm), indicative of the size of features built on the semiconductor.
7 nm
TDP
200W
PCI Express Version
?
PCI Express Revision is the supported version of the PCI Express standard. Peripheral Component Interconnect Express (or PCIe) is a high-speed serial computer expansion bus standard for attaching hardware devices to a computer. The different PCI Express versions support different data rates.
PCIe 4.0 x128
Memory Specifications
Memory Type
?
Intel® processors come in four different types: Single Channel, Dual Channel, Triple Channel, and Flex Mode. Maximum supported memory speed may be lower when populating multiple DIMMs per channel on products that support multiple memory channels.
DDR4
Memory Channels
?
The number of memory channels refers to the bandwidth operation for real world application.
8
Bus Speed
Up to 3200MT/s
Benchmarks
Geekbench 6
Single Core
Score
1267
Geekbench 6
Multi Core
Score
11253
Geekbench 5
Single Core
Score
969
Geekbench 5
Multi Core
Score
6812
Passmark CPU
Single Core
Score
2086
Passmark CPU
Multi Core
Score
69872
Compared to Other CPU
Geekbench 6 Single Core
Geekbench 6 Multi Core
Geekbench 5 Single Core
Geekbench 5 Multi Core
Passmark CPU Single Core
Passmark CPU Multi Core