Home / AMD Ryzen 9 / AMD Ryzen 9 7950X3D: Performance and Specs

AMD Ryzen 9 7950X3D

About processor

The AMD Ryzen 9 7950X3D processor is a powerhouse for desktop users looking for high-performance capabilities. With its cutting-edge TSMC 5nm FinFET technology, this processor offers impressive speed and efficiency. The 16 cores and 32 threads provide exceptional multitasking and processing power, making it ideal for both gamers and content creators. The 128MB of L3 cache ensures faster access to frequently used data, while the 120W TDP strikes a good balance between performance and power efficiency. Additionally, the integrated AMD Radeon™ Graphics deliver smooth visuals for gaming and multimedia applications without the need for a dedicated graphics card. In terms of performance, the AMD Ryzen 9 7950X3D excels in both single-core and multi-core tasks, as evidenced by its Geekbench 6 scores of 2912 for single-core and 19642 for multi-core performance. Overall, the AMD Ryzen 9 7950X3D processor delivers a top-tier experience for desktop users, whether they are into gaming, content creation, or heavy multitasking. Its combination of advanced technology, high core count, and impressive benchmark scores make it a worthy investment for those in need of uncompromising performance.

Basic

Label Name

AMD

Platform

Desktop

Launch Date

January 2023

Code Name

Raphael

CPU Specifications

Total Cores

Cores is a hardware term that describes the number of independent central processing units in a single computing component (die or chip).

Total Threads

Where applicable, Intel® Hyper-Threading Technology is only available on Performance-cores.

Basic Frequency

4.2GHz

Max Turbo Frequency

Max Turbo Frequency is the maximum single-core frequency at which the processor is capable of operating using Intel® Turbo Boost Technology and, if present, Intel® Turbo Boost Max Technology 3.0 and Intel® Thermal Velocity Boost. Frequency is typically measured in gigahertz (GHz), or billion cycles per second.

Up to 5.7GHz

L1 Cache

1024KB

L2 Cache

16MB

L3 Cache

128MB

CPU Socket

The socket is the component that provides the mechanical and electrical connections between the processor and motherboard.

AM5

Technology

Lithography refers to the semiconductor technology used to manufacture an integrated circuit, and is reported in nanometer (nm), indicative of the size of features built on the semiconductor.

TSMC 5nm FinFET

TDP

120W

Max. Operating Temperature

Junction Temperature is the maximum temperature allowed at the processor die.

89°C

PCI Express Version

PCI Express Revision is the supported version of the PCI Express standard. Peripheral Component Interconnect Express (or PCIe) is a high-speed serial computer expansion bus standard for attaching hardware devices to a computer. The different PCI Express versions support different data rates.

PCIe® 5.0

Memory Specifications

Memory Type

Intel® processors come in four different types: Single Channel, Dual Channel, Triple Channel, and Flex Mode. Maximum supported memory speed may be lower when populating multiple DIMMs per channel on products that support multiple memory channels.

DDR5

Memory Channels

The number of memory channels refers to the bandwidth operation for real world application.

GPU Specifications

Integrated Graphics Model

An integrated GPU refers to the graphics core that is integrated into the CPU processor. Leveraging the processor's powerful computational capabilities and intelligent power efficiency management, it delivers outstanding graphics performance and a smooth application experience at a lower power consumption.

AMD Radeon™ Graphics

Graphics Frequency

Graphics max dynamic frequency refers to the maximum opportunistic graphics render clock frequency (in MHz) that can be supported using Intel® HD Graphics with Dynamic Frequency feature.

2200 MHz