MediaTek Dimensity 8250
About processor
Dimensity 8250 is a SmartPhone Mid range mobile processor manufactured by MediaTek. It was released on May 2024. The SoC is manufactured using the 4 nm fabrication process. It has Octa (8) cores. The main feachers of the SoC are: Frequency - Up to 3.1 GHz. This chip also integrates the Arm Mali-G610 MC6.
Basic
Label Name
MediaTek
Platform
SmartPhone Mid range
Launch Date
May 2024
Model Name
Dimensity 8250(MT6896 MT6896Z_C/CZA)
Architecture
1× Cortex-A78 @ 3.1 GHz + 3× Cortex-A78 @ 3.0 GHz + 4× Cortex-A55 @ 2.0 GHz
Cores
Octa (8)
Technology
4 nm
Frequency
Up to 3.1 GHz
GPU Specifications
GPU name
Arm Mali-G610 MC6
Max display resolution
WQHD+ @ 120 Hz (FHD+ @ 180 Hz)
Connectivity
4G support
LTE (FDD/TDD), 4G CA
5G support
5G Sub-6; 3GPP Rel-16; 3CC CA; SA/NSA; DL up to 4.7 Gbps
Bluetooth
Bluetooth 5.3 (LE Audio Dual-Link TWS)
Wi-Fi
Wi-Fi 6E (802.11 a/b/g/n/ac/ax), 2×2 (2T2R)
Navigation
GPS L1CA+L5; BeiDou B1I/B2a/B1C; GLONASS L1OF; Galileo E1/E5a; QZSS L1CA/L5; NavIC
Memory Specifications
Memory type
LPDDR5 (quad-channel)
Memory frequency
Up to 6400 Mbps
Miscellaneous
Neural processor (NPU)
MediaTek NPU 580 (multi-core)
L3 cache
4 MB
Max camera resolution
Up to 320 MP; triple 32+32+32 MP
Storage type
UFS 3.1
Video capture
4K (3840 × 2160)
Video codecs
H.264, HEVC (encode/decode); VP9, AV1 (decode)
Video playback
H.264, HEVC, VP9, AV1 playback
Instruction set
ARMv8.2-A (64-bit)
Benchmarks
Geekbench 6
Single Core
Score
1354
Geekbench 6
Multi Core
Score
4026
AnTuTu 10
Score
1013000
3DMark Steel Nomad Light
Score
673
Phones with Dimensity 8250
Oppo Reno12 (China)
Comparison of Devices with Dimensity 8250
3DMark Steel Nomad Light
Oppo Reno12 (China)
673
Compared to Other SoC
Geekbench 6 Single Core
Geekbench 6 Multi Core
AnTuTu 10
3DMark Steel Nomad Light
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